公开(公告)号：US20200165434A1

公开(公告)日：2020-05-28

申请号：US16202165

申请日：2018-11-28

申请人： NAN YA PLASTICS CORPORATION

发明人： Te-Chao LIAO ,  Ying-Te HUANG ,  Chih-Kai CHANG ,  Hung-Yi CHANG ,  Hao-Sheng CHEN ,  Chia-Lin LIU

IPC分类号： C08L27/18 ,  C08J5/24 ,  H05K1/03 ,  H05K1/02

摘要： A fluorocarbon resin composition is applicable to produce a prepreg for use in making a high-frequency circuit board, including a polytetrafluoroethylene resin; a fluorine-containing copolymer of poly fluoroalkoxy or fluorinated ethylene propylene; inorganic powders and an impregnation additive such as hydroxyethyl cellulos; resulted in that the prepreg is capable of increasing a plurality of times for proceeding impregnation-coating, the surface defects prone to occur on a fluorocarbon prepreg during drying, baking and sintering after impregnation are therefore improved at the same time.

公开(公告)号：US20200165501A1

公开(公告)日：2020-05-28

申请号：US16202173

申请日：2018-11-28

申请人： NAN YA PLASTICS CORPORATION

发明人： Te-Chao LIAO ,  Hao-Sheng CHEN ,  Chih-Kai CHANG ,  Hung-Yi CHANG

IPC分类号： C09K5/14 ,  C08L27/18 ,  C08J5/24 ,  H05K1/03 ,  H05K1/02 ,  H05K3/02 ,  B32B15/082 ,  B32B15/20

摘要： A fluorocarbon resin composition is applicable to produce high-frequency circuit boards including a polytetrafluoroethylene resin; a fluorine-containing copolymer such as poly fluoroalkoxy and fluorinated ethylene propylene; low molecular-weight PTFE micro-powders and inorganic powders; in particular the temperature of pressing copper foil substrates is lowered from 350° C. to 250° C. via a lowering temperature rate of 1 to 4° C./min to improve the crystallinity of the fluorocarbon resin composition as well as improve the copper foil substrate with a high thermal conductivity and a wide range of dielectric constant.