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公开(公告)号：US20180163023A1
公开(公告)日：2018-06-14
申请号：US15834259
申请日：2017-12-07
Applicant: NAN YA PLASTICS CORPORATION
Inventor： Te-Chao LIAO , Ying-Te HUANG , Hao-Sheng CHEN , Hung-Yi CHANG , Chia-Lin LIU
IPC: C08K5/5333 , C08J5/24 , C08K3/36 , H05K1/09
Abstract: A thermosetting resin composition contains a primary resin formed from mixing a styrene-type polyphenylene ether resin thermally modified with styrene with an acrylic-type polyphenylene ether resin thermally modified with acrylic at a weight ratio ranging between 0.5 and 1.5, consequently having excellent heat resistance, flowability, and filling ability; and when cured, having a dielectric constant smaller than 3.0 and a dielectric dissipation factor smaller less than 0.0020 at the frequency of 1 GHz as well as a glass transition temperature higher than 210° C.; in application, the composition is suitable to impregnate reinforcement to form prepregs with excellent cutability.
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公开(公告)号：US20200165446A1
公开(公告)日：2020-05-28
申请号：US16202156
申请日：2018-11-28
Applicant: NAN YA PLASTICS CORPORATION
Inventor： Te-Chao LIAO , Ying-Te HUANG , Hao-Sheng CHEN , Hung-Yi CHANG , Chia-Lin LIU
Abstract: A thermosetting resin composition comprises a thermosetting polybutadiene resin, a thermosetting polyphenylene ether resin that is ended with styrene and acrylate in a weight ratio of 0.5-1.5 as reactive functional groups, a thermoplastic resin that serves to set desired heat resistance, flowability and filling performance, a compound cross-linking initiator composed of peroxides of different half-life temperatures to effectively improve its crosslink density during its thermal curing process; particularly the composition after cured has a low dielectric constant, a low dielectric dissipation factor, a high Tg, and high rigidity, and the prepreg made thereof is easy to cut.
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公开(公告)号：US20200165434A1
公开(公告)日：2020-05-28
申请号：US16202165
申请日：2018-11-28
Applicant: NAN YA PLASTICS CORPORATION
Inventor： Te-Chao LIAO , Ying-Te HUANG , Chih-Kai CHANG , Hung-Yi CHANG , Hao-Sheng CHEN , Chia-Lin LIU
Abstract: A fluorocarbon resin composition is applicable to produce a prepreg for use in making a high-frequency circuit board, including a polytetrafluoroethylene resin; a fluorine-containing copolymer of poly fluoroalkoxy or fluorinated ethylene propylene; inorganic powders and an impregnation additive such as hydroxyethyl cellulos; resulted in that the prepreg is capable of increasing a plurality of times for proceeding impregnation-coating, the surface defects prone to occur on a fluorocarbon prepreg during drying, baking and sintering after impregnation are therefore improved at the same time.
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4.发明申请THERMOSETTING RESIN COMPOSITION AND PREPREG AS WELL AS HARDENED PRODUCT USING THE SAME 有权热固性树脂组合物和预制物作为硬化产品使用它公开(公告)号：US20160177082A1
公开(公告)日：2016-06-23
申请号：US14973809
申请日：2015-12-18
Applicant: NAN YA PLASTICS CORPORATION
Inventor： Te-Chao LIAO , Dein-Run FUNG , Ying-Te HUANG , Hao-Sheng CHEN , Hung-Yi CHANG , Chia-Lin LIU
CPC classification number: C08J5/24 , C08J3/246 , C08J2351/08 , C08J2409/00 , C08L71/126 , C08L2205/025 , C08L2205/03 , C08L2205/05 , H05K1/032 , H05K1/0366 , H05K1/0373 , H05K2201/012 , H05K2201/0209 , C08L9/00
Abstract: A thermosetting resin composition due to containing a modified PPE resin as a main ingredient is suited for use in making a pregreg or a copper foil substrate, when hardened, featuring a small dielectric constant (Dk), a low dielectric dissipation factor (Df) and a high Tg as well as a high resistance to heat and flame, this outstanding result is because the modified PPE resin is formed with a novel two-dimensional hardenable structure prepared to have side-chain reactive functional groups being provided in addition to those at the terminal ends of the main chain of the PPE resin thereof.
Abstract translation: 由于含有改性PPE树脂作为主要成分的热固性树脂组合物适用于制造预浸料或铜箔基材时，硬化时具有小介电常数（Dk），低介电损耗因数（Df）和 高Tg以及高耐热性和耐火性，这是因为改性PPE树脂由新型二维可硬化结构形成，除了具有侧链反应性官能团 其PPE树脂的主链的末端。
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