公开(公告)号：US11876072B2

公开(公告)日：2024-01-16

申请号：US17465328

申请日：2021-09-02

申请人： NANYA TECHNOLOGY CORPORATION

发明人： Wei-Zhong Li ,  Yi-Ting Shih ,  Chien-Chung Wang ,  Hsih-Yang Chiu

IPC分类号： H01L23/00

CPC分类号： H01L24/85 ,  H01L24/03 ,  H01L24/05 ,  H01L24/48 ,  H01L2224/03831 ,  H01L2224/04042 ,  H01L2224/48824 ,  H01L2224/85031 ,  H01L2224/85359

摘要： A method for preparing a semiconductor device includes providing an integrated circuit die having a bond pad. The bond pad includes aluminum (Al). The method also includes etching a top portion of the bond pad to form a recess, and bonding a wire bond to the recess in the bond pad. The wire bond includes copper (Cu).

公开(公告)号：US12113046B2

公开(公告)日：2024-10-08

申请号：US18386345

申请日：2023-11-02

申请人： NANYA TECHNOLOGY CORPORATION

发明人： Wei-Zhong Li ,  Yi-Ting Shih ,  Chien-Chung Wang ,  Hsih-Yang Chiu

IPC分类号： H01L23/00

CPC分类号： H01L24/85 ,  H01L24/03 ,  H01L24/05 ,  H01L24/48 ,  H01L2224/03831 ,  H01L2224/04042 ,  H01L2224/48824 ,  H01L2224/85031 ,  H01L2224/85359

摘要： A method for preparing a semiconductor device includes providing an integrated circuit die having a bond pad. The bond pad includes aluminum (Al). The method also includes etching a top portion of the bond pad to form a recess, and bonding a wire bond to the recess in the bond pad. The wire bond includes copper (Cu).