公开(公告)号：US20140263938A1

公开(公告)日：2014-09-18

申请号：US14292125

申请日：2014-05-30

Applicant: NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY ,  DESIGN NETWORK CO., LTD.

Inventor： Shiro HARA ,  Shizuka NAKANO ,  Hitoshi MAEKAWA ,  Shinji FUTAGAWA ,  Takahiro FUKUDA

IPC: B23Q1/01

CPC classification number: B23Q1/01 ,  B62B3/06 ,  B62B5/049 ,  B62B5/063 ,  B62B2203/28 ,  F16M11/20 ,  H01L21/67775

Abstract: Mounting structure to allow a production line made up of movable manufacturing devices to be rearranged quickly, safely, and reliably. The mounting structure according to the present invention includes a fixing structure installed on a floor and a leg portion installed on a bottom plate of the movable manufacturing device. The fixing structure comprises a floor side positioning member and a floor side coupling member while the leg portion comprises a leg side positioning member and a leg side coupling member. The floor side positioning member and the leg side positioning member positions the movable manufacturing device accurately by fitting each other when the device is placed at the specified location of the fixing structure. The floor side coupling member and the leg side coupling member fixes the movable manufacturing device located on the fixing structure by coupling each other.

Abstract translation: 安装结构使得由可移动制造装置组成的生产线能够快速，安全，可靠地重新排列。 根据本发明的安装结构包括安装在地板上的固定结构和安装在可移动制造装置的底板上的脚部。 固定结构包括地板侧定位构件和地板侧联接构件，而腿部包括腿侧定位构件和腿侧联接构件。 当装置放置在固定结构的指定位置时，地板侧定位构件和腿侧定位构件将可动制造装置准确地相互配合。 地板侧联接构件和腿侧联接构件通过彼此联接固定位于固定结构上的可移动制造装置。

公开(公告)号：US20150380289A1

公开(公告)日：2015-12-31

申请号：US14768352

申请日：2014-02-17

Applicant: NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY

Inventor： Shiro HARA ,  Hitoshi MAEKAWA ,  Shizuka NAKANO

IPC: H01L21/677

CPC classification number: H01L21/67778 ,  H01L21/67155 ,  H01L21/67167 ,  H01L21/67276 ,  H01L21/67739 ,  H01L21/67745

Abstract: [Problem to be Solved]A production system to facilitate the commonization of front chambers among a plurality of production devices that are different in the kind of a process to be performed for a processing substrate. According to the production system of the present invention, it is possible to reduce the development cost and production cost of the production devices.[Solution]Control units are provided separately in a processing chamber and a front chamber of a small production device. When the processing-chamber control unit outputs a load request signal, the front-chamber control unit loads a processing substrate to the processing chamber, and outputs a load acknowledgment signal. When the load acknowledgment signal is input, the processing-chamber control unit performs a process for the processing substrate, and outputs an unload request signal after the completion of the process. When the unload request signal is input, the front-chamber control unit starts the unloading of the processing substrate, and outputs an unload acknowledgment signal when the processing substrate is unloaded from the processing chamber. When the unload acknowledgment signal is input, the processing chamber starts the preparation of the next process.

Abstract translation: [待解决的问题]一种生产系统，用于促进在对处理基板进行的处理的种类不同的多个生产装置之间的前室的通用化。 根据本发明的生产系统，可以降低生产装置的开发成本和生产成本。 [解决方案]控制单元分别设置在小型生产装置的处理室和前室中。 当处理室控制单元输出负载请求信号时，前室控制单元将处理衬底加载到处理室，并输出负载确认信号。 当输入负载确认信号时，处理室控制单元执行处理衬底的处理，并且在完成处理之后输出卸载请求信号。 当输入卸载请求信号时，前室控制单元开始卸载处理基板，并且当处理基板从处理室卸载时输出卸载确认信号。 当输入卸载确认信号时，处理室开始准备下一个处理。

公开(公告)号：US20170098557A1

公开(公告)日：2017-04-06

申请号：US15126087

申请日：2015-03-10

Applicant: NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY ,  DESIGN NETWORK CO., LTD.

Inventor： Yoshiki SHIMIZU ,  Shiro HARA ,  Hiroyuki TANAKA ,  Shizuka NAKANO ,  Hisato OGISO ,  Sommawan KHUMPUANG ,  Shinji FUTAGAWA ,  Hideaki YOSHIOKA ,  Takahiro FUKUDA ,  Yoshinori UCHIYAMA

IPC: H01L21/67 ,  H01J37/32 ,  H01L21/3065

CPC classification number: H01L21/67069 ,  H01J37/32082 ,  H01J37/32192 ,  H01J37/32715 ,  H01J2237/334 ,  H01L21/3065 ,  H01L21/6719

Abstract: To provide a plasma device that all functions required for a plasma etching process are incorporated into a narrow space of a minimal fabrication manufacturing device. A plasma processing chamber for performing the plasma etching process on a semiconductor wafer is provided, and a micro-plasma supply section and a lower electrode that superimposes RF on supplied micro-plasma are provided in the plasma processing chamber. A wafer support device that supports the semiconductor wafer supports the semiconductor wafer in the plasma processing chamber during the etching process. The wafer support device is coupled to and supported by a drive section that is arranged outside the plasma processing chamber. The drive section makes the wafer support device repetitively move scanningly in the plasma processing chamber in parallel with a wafer processing surface during the etching process.