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公开(公告)号：US09659822B2
公开(公告)日：2017-05-23
申请号：US14903525
申请日：2014-07-08
发明人： Johannes Adrianus Cornelis Theeuwes , Jeroen Anthonius Smeltink , Egbert Anne Martijn Brouwer , Gerrit Oosterhuis
IPC分类号： H01L21/44 , H01L21/768 , C23C14/04 , H01L21/285 , B23K26/08 , B23K26/34 , C23C14/54 , B23K26/32 , B23K26/082 , B23K26/0622 , G05B19/418 , H01L21/68 , H01L21/687 , B23K101/40 , B23K103/08 , B23K103/10 , B23K103/12 , B23K103/18 , B23K103/00
CPC分类号： H01L21/76898 , B23K26/0622 , B23K26/082 , B23K26/0853 , B23K26/32 , B23K26/34 , B23K2101/40 , B23K2103/08 , B23K2103/10 , B23K2103/12 , B23K2103/18 , B23K2103/50 , B23K2103/56 , C23C14/048 , C23C14/54 , G05B19/418 , G05B2219/33198 , G05B2219/45031 , H01L21/2855 , H01L21/68 , H01L21/68785 , H01L21/76838
摘要： A method for providing position control information for controlling an impingement position of a laser beam for treatment of a chip die in a chip manufacturing process, comprises the steps of a) receiving a specification of positions (x,y) of a electrically conductive elements in the chip die, the positions having a first coordinate along a first direction (x) and a second coordinate (y) along a second direction in a plane defined by the chip die, said first and second direction being mutually transverse to each other, b) selecting a cluster of positions that is within a predetermined two-dimensional spatial range, wherein each pair of positions in the cluster at least has a first minimum difference in their first coordinates or a second minimum difference in their second coordinates and removing the next position from the ordered set, c) update the positions of the set of positions in accordance with an expected time needed to carry out the treatment for said cluster and a speed of a wafer comprising the chip die, d) repeating steps b-d until each of the positions in said set is assigned to a cluster.
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公开(公告)号：US20160155666A1
公开(公告)日：2016-06-02
申请号：US14903525
申请日：2014-07-08
发明人： Johannes Adrianus Cornelis Theeuwes , Jeroen Anthonius Smeltink , Egbert Anne Martijn Brouwer , Gerrit Oosterhuis
IPC分类号： H01L21/768 , H01L21/687 , C23C14/04 , G05B19/418 , C23C14/54 , H01L21/68 , H01L21/285
CPC分类号： H01L21/76898 , B23K26/0622 , B23K26/082 , B23K26/0853 , B23K26/32 , B23K26/34 , B23K2101/40 , B23K2103/08 , B23K2103/10 , B23K2103/12 , B23K2103/18 , B23K2103/50 , B23K2103/56 , C23C14/048 , C23C14/54 , G05B19/418 , G05B2219/33198 , G05B2219/45031 , H01L21/2855 , H01L21/68 , H01L21/68785 , H01L21/76838
摘要： A method for providing position control information for controlling an impingement position of a laser beam for treatment of a chip die in a chip manufacturing process, comprises the steps of a) receiving a specification of positions (x,y) of a electrically conductive elements in the chip die, the positions having a first coordinate along a first direction (x) and a second coordinate (y) along a second direction in a plane defined by the chip die, said first and second direction being mutually transverse to each other, b) selecting a cluster of positions that is within a predetermined two-dimensional spatial range, wherein each pair of positions in the cluster at least has a first minimum difference in their first coordinates or a second minimum difference in their second coordinates and removing the next position from the ordered set, c) update the positions of the set of positions in accordance with an expected time needed to carry out the treatment for said cluster and a speed of a wafer comprising the chip die, d) repeating steps b-d until each of the positions in said set is assigned to a cluster.
摘要翻译： 一种用于在芯片制造过程中提供用于控制用于处理芯片芯片的激光束的冲击位置的位置控制信息的方法，包括以下步骤：a）接收导电元件的位置（x，y） 所述芯片模具，所述位置在由所述芯片模具限定的平面中沿着第一方向（x）和第二坐标（y）沿着第二方向具有第一坐标，所述第一和第二方向彼此相互横向，b ）选择位于预定二维空间范围内的位置簇，其中所述簇中的每对位置至少具有其第一坐标中的第一最小差值或其第二坐标中的第二最小差值，并移除所述下一位置 从有序集合中，c）根据对所述群集进行处理所需的预期时间更新所述一组位置的位置，并且 晶片，d）重复步骤b-d，直到将所述组中的每个位置分配给簇。
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