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公开(公告)号：US09659822B2
公开(公告)日：2017-05-23
申请号：US14903525
申请日：2014-07-08
发明人： Johannes Adrianus Cornelis Theeuwes , Jeroen Anthonius Smeltink , Egbert Anne Martijn Brouwer , Gerrit Oosterhuis
IPC分类号： H01L21/44 , H01L21/768 , C23C14/04 , H01L21/285 , B23K26/08 , B23K26/34 , C23C14/54 , B23K26/32 , B23K26/082 , B23K26/0622 , G05B19/418 , H01L21/68 , H01L21/687 , B23K101/40 , B23K103/08 , B23K103/10 , B23K103/12 , B23K103/18 , B23K103/00
CPC分类号： H01L21/76898 , B23K26/0622 , B23K26/082 , B23K26/0853 , B23K26/32 , B23K26/34 , B23K2101/40 , B23K2103/08 , B23K2103/10 , B23K2103/12 , B23K2103/18 , B23K2103/50 , B23K2103/56 , C23C14/048 , C23C14/54 , G05B19/418 , G05B2219/33198 , G05B2219/45031 , H01L21/2855 , H01L21/68 , H01L21/68785 , H01L21/76838
摘要： A method for providing position control information for controlling an impingement position of a laser beam for treatment of a chip die in a chip manufacturing process, comprises the steps of a) receiving a specification of positions (x,y) of a electrically conductive elements in the chip die, the positions having a first coordinate along a first direction (x) and a second coordinate (y) along a second direction in a plane defined by the chip die, said first and second direction being mutually transverse to each other, b) selecting a cluster of positions that is within a predetermined two-dimensional spatial range, wherein each pair of positions in the cluster at least has a first minimum difference in their first coordinates or a second minimum difference in their second coordinates and removing the next position from the ordered set, c) update the positions of the set of positions in accordance with an expected time needed to carry out the treatment for said cluster and a speed of a wafer comprising the chip die, d) repeating steps b-d until each of the positions in said set is assigned to a cluster.
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公开(公告)号：US20160168709A1
公开(公告)日：2016-06-16
申请号：US14908618
申请日：2014-07-28
IPC分类号： C23C16/52
CPC分类号： C23C16/52 , B05B13/0473 , B05C3/02 , B05C5/0254 , B05C5/0258 , B05C11/1018
摘要： A slot-die coating apparatus for manufacturing a patterned coating layer (3) on a substrate (1) comprises a substrate carrier (6), a coating device, a sensor facility (70) and a controller (80). The substrate carrier (6) is arranged on a support for providing the substrate (1). The coating device comprises a head-side unit and a support-side unit (50, 55; 52 resp.) that are mutually movable with respect to each other by a motor (52, 56). The head-side unit comprises a translator part (52) and a slot-die coating head (2). The support-side unit (55) comprises a stator part (56) of the motor. The controller (80) controls the motor (52) to position the slot-die coating head at a desired distance (Ds). The support-side unit (55) has a mass that is at least equal to the mass of the head-side unit (50), and the support-side unit (55) is flexibly coupled to the support (60).
摘要翻译： 用于在基板（1）上制造图案化涂层（3）的槽模涂布装置包括基板载体（6），涂布装置，传感器设备（70）和控制器（80）。 衬底载体（6）布置在用于提供衬底（1）的支撑件上。 涂覆装置包括头部单元和支撑侧单元（50,55; 52），它们通过马达（52,56）相对于彼此相互移动。 头侧单元包括平移器部分（52）和狭缝模头涂覆头部（2）。 支撑侧单元（55）包括电动机的定子部分（56）。 控制器（80）控制马达（52）以将槽模头涂覆头定位在期望的距离（Ds）。 支撑侧单元（55）具有至少等于头侧单元（50）的质量的质量，并且支撑侧单元（55）柔性地联接到支撑件（60）。
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公开(公告)号：US20160155666A1
公开(公告)日：2016-06-02
申请号：US14903525
申请日：2014-07-08
发明人： Johannes Adrianus Cornelis Theeuwes , Jeroen Anthonius Smeltink , Egbert Anne Martijn Brouwer , Gerrit Oosterhuis
IPC分类号： H01L21/768 , H01L21/687 , C23C14/04 , G05B19/418 , C23C14/54 , H01L21/68 , H01L21/285
CPC分类号： H01L21/76898 , B23K26/0622 , B23K26/082 , B23K26/0853 , B23K26/32 , B23K26/34 , B23K2101/40 , B23K2103/08 , B23K2103/10 , B23K2103/12 , B23K2103/18 , B23K2103/50 , B23K2103/56 , C23C14/048 , C23C14/54 , G05B19/418 , G05B2219/33198 , G05B2219/45031 , H01L21/2855 , H01L21/68 , H01L21/68785 , H01L21/76838
摘要： A method for providing position control information for controlling an impingement position of a laser beam for treatment of a chip die in a chip manufacturing process, comprises the steps of a) receiving a specification of positions (x,y) of a electrically conductive elements in the chip die, the positions having a first coordinate along a first direction (x) and a second coordinate (y) along a second direction in a plane defined by the chip die, said first and second direction being mutually transverse to each other, b) selecting a cluster of positions that is within a predetermined two-dimensional spatial range, wherein each pair of positions in the cluster at least has a first minimum difference in their first coordinates or a second minimum difference in their second coordinates and removing the next position from the ordered set, c) update the positions of the set of positions in accordance with an expected time needed to carry out the treatment for said cluster and a speed of a wafer comprising the chip die, d) repeating steps b-d until each of the positions in said set is assigned to a cluster.
摘要翻译： 一种用于在芯片制造过程中提供用于控制用于处理芯片芯片的激光束的冲击位置的位置控制信息的方法，包括以下步骤：a）接收导电元件的位置（x，y） 所述芯片模具，所述位置在由所述芯片模具限定的平面中沿着第一方向（x）和第二坐标（y）沿着第二方向具有第一坐标，所述第一和第二方向彼此相互横向，b ）选择位于预定二维空间范围内的位置簇，其中所述簇中的每对位置至少具有其第一坐标中的第一最小差值或其第二坐标中的第二最小差值，并移除所述下一位置 从有序集合中，c）根据对所述群集进行处理所需的预期时间更新所述一组位置的位置，并且 晶片，d）重复步骤b-d，直到将所述组中的每个位置分配给簇。
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公开(公告)号：US11920241B2
公开(公告)日：2024-03-05
申请号：US17434483
申请日：2020-03-24
IPC分类号： C23C16/455
CPC分类号： C23C16/45578 , C23C16/45557
摘要： A fluid handling structure for a gas phase deposition apparatus, the structure defining a flow path with an inlet and an outlet for transmitting pressurized fluid from said inlet to the outlet, wherein the structure includes an elongated slit and a series of nozzles through which pressurized fluid is allowed to enter the elongated slit, the inlet being upstream the series of nozzles, and wherein the outlet is formed downstream at a gap opening of the elongated slit allowing pressurized fluid to discharge from the elongated slit towards a substrate, wherein the series of nozzles are configured to provide a larger flow resistance than the elongated slit, and wherein the series of nozzles are adapted to form a series of jet flows directed towards one or more impingement surfaces of the structure when pressurized fluid is transmitted through the flow path.
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公开(公告)号：US10006124B2
公开(公告)日：2018-06-26
申请号：US14908618
申请日：2014-07-28
CPC分类号： C23C16/52 , B05B13/0473 , B05C3/02 , B05C5/0254 , B05C5/0258 , B05C11/1018
摘要： A slot-die coating apparatus for manufacturing a patterned coating layer (3) on a substrate (1) comprises a substrate carrier (6), a coating device, a sensor facility (70) and a controller (80). The substrate carrier (6) is arranged on a support for providing the substrate (1). The coating device comprises a head-side unit and a support-side unit (50, 55; 52 resp.) that are mutually movable with respect to each other by a motor (52, 56). The head-side unit comprises a translator part (52) and a slot-die coating head (2). The support-side unit (55) comprises a stator part (56) of the motor. The controller (80) controls the motor (52) to position the slot-die coating head at a desired distance (Ds). The support-side unit (55) has a mass that is at least equal to the mass of the head-side unit (50), and the support-side unit (55) is flexibly coupled to the support (60).
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