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    Film laminated structure, method for producing the same, and gas sensor
    2.
    发明申请
    Film laminated structure, method for producing the same, and gas sensor 审中-公开
    薄膜层叠结构体及其制造方法以及气体传感器

    公开(公告)号：US20150276661A1

    公开(公告)日：2015-10-01

    申请号：US14668116

    申请日：2015-03-25

    Applicant: NGK Insulators, Ltd.

    Inventor： Satoko MORIYAMA ,  Mika MURAKAMI ,  Kunihiko YOSHIOKA ,  Hironori SAKAKIBARA

    IPC: G01N27/407 ,  C04B35/48

    Abstract: A method of the present invention is a method for producing a film laminated structure, including the steps of: (a) preparing a ceramic substrate; (b) charging a mold with a slurry that contains a raw material powder, a gelling agent containing at least two polymerizable organic compounds, and an organic solvent serving as a dispersion medium, and molding and hardening the slurry through a polymerization reaction of the gelling agent to form a green body having a recessed portion or through-hole; (c) inserting the ceramic substrate into the recessed portion or through-hole of the green body and then drying the ceramic substrate and the green body to form a green structure; and (d) firing the green structure to form a film laminated structure, the film laminated structure including a film formed from the green body by firing.

    Abstract translation: 本发明的方法是一种薄膜叠层结构体的制造方法，包括以下步骤：（a）制备陶瓷基材; （b）用包含原料粉末的浆料，含有至少两种可聚合有机化合物的胶凝剂和用作分散介质的有机溶剂的模具装入模具，并通过胶凝剂的聚合反应来模制和硬化浆料 以形成具有凹部或通孔的生坯; （c）将陶瓷基板插入生坯的凹部或通孔中，然后干燥陶瓷基板和生坯以形成绿色结构; 和（d）烧制绿色结构以形成薄膜叠层结构，该薄膜层叠结构包括通过烧制由生坯形成的薄膜。

    COMPACT DRYING METHOD
    4.
    发明申请
    COMPACT DRYING METHOD 审中-公开
    紧凑干燥方法

    公开(公告)号：US20160046530A1

    公开(公告)日：2016-02-18

    申请号：US14861092

    申请日：2015-09-22

    Applicant: NGK Insulators, Ltd.

    Inventor： Yusuke FUJI ,  Kunihiko YOSHIOKA

    IPC: C04B35/638

    CPC classification number: C04B35/638 ,  B01D12/00 ,  B22F3/225 ,  C04B35/632 ,  C04B2235/602 ,  C04B2235/604 ,  C04B2235/606 ,  F26B5/005 ,  F26B2210/02

    Abstract: A compact is formed by introducing a slurry containing a ceramic powder or a metal powder, a binder and a solvent into a compaction die, and compacting the slurry in the compaction die. The compact embedded in the compaction die is immersed in an alternative CFC (liquid) (FIG. 4A). The solvent contained in the compact is gradually replaced with the alternative CFC. In the course of this process, the compact separates naturally from the compaction die (releasing is achieved) without receiving an external force. Subsequently, the compact is taken out of the alternative CFC (liquid). The alternative CFC has a boiling point as low as 95° C. at 1 atmospheric pressure. Accordingly, the alternative CFC contained in the compact will volatilize at high speed, thus being removed. Consequently, the compact can be dried in a relatively short time without being heated.

    Abstract translation: 通过将包含陶瓷粉末或金属粉末，粘合剂和溶剂的浆料引入压实模具中并压实压实模具中的浆料而形成压块。 嵌入压实模具中的压实体被浸入替代的CFC（液体）（图4A）中。 压实物中包含的溶剂逐渐被替代的CFC替代。 在这个过程中，紧固件与压实模具自然分离（释放被实现），而不会受到外力。 随后，将压实体从备选的CFC（液体）中取出。 替代的CFC在1个大气压下具有低至95℃的沸点。 因此，压实体中所含的替代CFC将高速挥发，从而被除去。 因此，可以在相对短的时间内干燥压块而不加热。

    STRUCTURAL BODY AND ELECTRODE STRUCTURE
    6.
    发明申请
    STRUCTURAL BODY AND ELECTRODE STRUCTURE 审中-公开
    结构体和电极结构

    公开(公告)号：US20150084508A1

    公开(公告)日：2015-03-26

    申请号：US14490748

    申请日：2014-09-19

    Applicant: NGK INSULATORS, LTD.

    Inventor： Yoshimasa KONDO ,  Kunihiko YOSHIOKA

    IPC: H01B17/58 ,  H01B3/12 ,  H01J37/32

    CPC classification number: H01B17/58 ,  H01B3/12 ,  H01J37/32348 ,  H01J37/32532 ,  H05H1/2406 ,  H05H2001/2418

    Abstract: A structural body is provided in fluid, perpendicular to a typical flow direction of the fluid. The structural body includes a cylindrical insulating body having at least one hollow portion and at least one conducting body positioned in the hollow portion of the insulating body. In a cross section of the insulating body having a normal line in an axial direction of the insulating body, the following relationship is satisfied: 1.5×Diy≦Dix≦15×Diy where Dix is a length of the insulating body in the typical flow direction (direction x) and Diy is a maximum value of a length of the insulating body in a direction (direction y) perpendicular to the typical flow direction.

    Abstract translation: 结构体以与流体的典型流动方向垂直的流体提供。 结构体包括具有至少一个中空部分的圆柱形绝缘体和位于绝缘体的中空部分中的至少一个导电体。 在绝缘体的沿绝缘体的轴向的法线的截面中，满足以下关系：1.5×Diy＆nlE; Dix＆nlE; 15×Diy其中Dix是绝缘体在典型流动方向上的长度 （方向x），Diy是与典型流动方向垂直的方向（方向y）的绝缘体的长度的最大值。

    BONDED COMPACT AND METHOD OF PRODUCING GREEN BONDED COMPACT
    7.
    发明申请
    BONDED COMPACT AND METHOD OF PRODUCING GREEN BONDED COMPACT 有权
    绑定紧凑和生产绿色绑定紧凑的方法

    公开(公告)号：US20140065375A1

    公开(公告)日：2014-03-06

    申请号：US14014956

    申请日：2013-08-30

    Applicant: NGK Insulators, Ltd.

    Inventor： Kunihiko YOSHIOKA ,  Satoshi ISHIBASHI

    IPC: H05K13/00 ,  B32B18/00 ,  B32B7/02 ,  H05K1/03

    CPC classification number: H05K13/00 ,  B32B7/02 ,  B32B18/00 ,  C04B35/634 ,  C04B37/008 ,  C04B2235/604 ,  C04B2235/608 ,  C04B2237/348 ,  C04B2237/62 ,  C04B2237/66 ,  C04B2237/704 ,  C04B2237/708 ,  H01M8/0215 ,  H01M2008/1293 ,  H05K1/0306 ,  Y02E60/525 ,  Y02P70/56 ,  Y10T428/24744

    Abstract: Provided is a method of producing “a ceramic green bonded compact in which a ceramic green film is bonded on each bonding surface of a ceramic green substrate having hole portions,” the method imparting good adhesiveness to a thin green film while suppressing the green substrate from having deformation. In this method, first, a layer of a paste for bonding is formed on each bonding surface of green sheets prepared. Next, each bonding surface of the green sheets on which the paste layer is formed is brought into contact, in a state in which the paste layer is wet, with each bonding surface of a porous ceramic green substrate prepared. While this state is maintained, pores in the green substrate absorb a dispersion medium in the paste layer in the wet state. As a result, the paste layer is dried, thereby completely bonding the green substrate and the green sheets.

    Abstract translation: 本发明提供一种制造“陶瓷绿色接合体的陶瓷绿色接合体的方法”，其中陶瓷生坯被粘结在具有孔部分的陶瓷生坯基材的接合表面上，该方法赋予了对绿色薄膜的良好粘附性， 有变形。 在该方法中，首先，在制备的生片的每个接合面上形成用于接合的糊料层。 接下来，在形成有糊层的生片的每个接合表面在糊层湿润的状态下与多孔陶瓷生坯基板的各接合表面进行接触。 当保持这种状态时，绿色底物中的孔在湿润状态下吸收膏层中的分散介质。 结果，干燥糊料层，从而完全粘接生坯基材和生片。

    MOLDED BODY, AND METHOD FOR PRODUCING THE MOLDED BODY
    8.
    发明申请
    MOLDED BODY, AND METHOD FOR PRODUCING THE MOLDED BODY 审中-公开
    模制体，以及生产模制体的方法

    公开(公告)号：US20150042009A1

    公开(公告)日：2015-02-12

    申请号：US14525547

    申请日：2014-10-28

    Applicant: NGK Insulators, Ltd.

    Inventor： Kunihiko YOSHIOKA ,  Kimihisa KANEKO ,  Makoto OHMORI ,  Kenji SUZUKI

    IPC: B28B1/00 ,  B28B1/24 ,  B28B7/00

    CPC classification number: B28B1/008 ,  B28B1/24 ,  B28B7/0091 ,  B28B19/0015 ,  B29C39/021 ,  B29C39/023 ,  B29C39/12 ,  B29C39/123 ,  C04B37/001 ,  C04B2235/602 ,  C04B2235/6023 ,  C04B2237/68 ,  C04B2237/78 ,  Y10T428/24355 ,  Y10T428/24413 ,  Y10T428/24612 ,  Y10T428/24628 ,  Y10T428/31504

    Abstract: A second mold is placed on a planar surface of a first mold to form a first mold cavity, which is filled with a first material slurry containing a first material powder and the molded slurry is caused to set, thereby forming a first molded part on the planar surface of the first mold. A third mold is placed on the planar surface of the first mold from which the second mold is removed and on which the first molded part is formed, thereby forming a second mold cavity. The second mold cavity is filled with a second material slurry which contains a second material powder different from the first material powder so as to mold the slurry in contact with the first molded part. The molded slurry is caused to set, thereby forming a second molded part on the planar surface of the first mold.

    Abstract translation: 将第二模具放置在第一模具的平坦表面上以形成第一模腔，其填充有包含第一材料粉末的第一材料浆料，并且使所述模制浆料固化，从而在所述第一模腔上形成第一模制部件 第一模具的平面。 将第三模具放置在第一模具的平坦表面上，从该第二模具移除第二模具并在其上形成第一模制部件，从而形成第二模腔。 第二模腔填充有第二材料浆料，其含有与第一材料粉末不同的第二材料粉末，以模制与第一模制部件接触的浆料。 使模制的浆料固化，从而在第一模具的平面上形成第二模制部件。

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