公开(公告)号：US20240347371A1

公开(公告)日：2024-10-17

申请号：US18751140

申请日：2024-06-21

Applicant: NHK SPRING CO., LTD.

Inventor： Yusuke OTSUKA ,  Naoya KIDA ,  Jun FUTAKUCHIYA ,  Noriyoshi KANEDA ,  Hibiki YOKOYAMA ,  Michiyoshi SONE ,  Hiroki SAKAMOTO

IPC: H01L21/687 ,  H01J37/32

CPC classification number: H01L21/68757 ,  H01J37/32715 ,  H01J2237/2007

Abstract: A laminate structure of the disclosure is a laminate structure for a semiconductor manufacturing device, and includes a substrate containing aluminum and including a first face, an intermediate layer arranged on the first face of the substrate and containing aluminum oxide, and a cover layer arranged on the intermediate layer and containing metal atoms. The intermediate layer includes a partition wall forming a plurality of voids in a cross-sectional shape parallel to the first face. The intermediate layer includes a boundary layer covering the first face of the substrate. The cover layer is arranged in some of the plurality of voids in the intermediate layer. The plurality of voids includes voids adjacent to the boundary layer and separated from the cover layer.