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公开(公告)号:US20230207286A1
公开(公告)日:2023-06-29
申请号:US18176749
申请日:2023-03-01
Applicant: NHK SPRING CO., LTD.
Inventor: Hibiki YOKOYAMA , Naoya KIDA , Jun FUTAKUCHIYA , Noriyoshi KANEDA , Michiyoshi SONE
CPC classification number: H01J37/32715 , C23C4/11
Abstract: A stage includes a base material including a step portion and an insulating film. The step portion includes a first surface recessed from a top surface of the base material and a second surface recessed from a side surface of the base material. The insulating film includes a plurality of first layers on the first surface and a plurality of second layers on the second surface. In the step portion, each first end portion of the plurality of first layers and each second end portion of the plurality of second layers are alternately stacked. The first surface and the second surface are connected via a corner, and each first end portion and each second end portion are alternately stacked at the corner.
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公开(公告)号:US20240347371A1
公开(公告)日:2024-10-17
申请号:US18751140
申请日:2024-06-21
Applicant: NHK SPRING CO., LTD.
Inventor: Yusuke OTSUKA , Naoya KIDA , Jun FUTAKUCHIYA , Noriyoshi KANEDA , Hibiki YOKOYAMA , Michiyoshi SONE , Hiroki SAKAMOTO
IPC: H01L21/687 , H01J37/32
CPC classification number: H01L21/68757 , H01J37/32715 , H01J2237/2007
Abstract: A laminate structure of the disclosure is a laminate structure for a semiconductor manufacturing device, and includes a substrate containing aluminum and including a first face, an intermediate layer arranged on the first face of the substrate and containing aluminum oxide, and a cover layer arranged on the intermediate layer and containing metal atoms. The intermediate layer includes a partition wall forming a plurality of voids in a cross-sectional shape parallel to the first face. The intermediate layer includes a boundary layer covering the first face of the substrate. The cover layer is arranged in some of the plurality of voids in the intermediate layer. The plurality of voids includes voids adjacent to the boundary layer and separated from the cover layer.
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公开(公告)号:US20240327967A1
公开(公告)日:2024-10-03
申请号:US18738218
申请日:2024-06-10
Applicant: NHK SPRING CO., LTD.
Inventor: Hibiki YOKOYAMA , Jun FUTAKUCHIYA , Noriyoshi KANEDA , Michiyoshi SONE , Masahiro FUJII , Takatoshi NAMBU
IPC: C23C4/01
CPC classification number: C23C4/01
Abstract: The metal mask has a body having a first surface in contact with a surface of a workpiece, a second surface opposite the first surface and a third surface between the first surface and the second surface, and an eave portion continuous with the body portion and projecting outwards from the first surface, the eave portion being arranged away from the surface of the workpiece. The third surface (side surface) of the body portion of the metal mask may have a stepped portion formed of the eave portion. The third surface (side surface) of the body part has an inclined surface that extends from the first surface to the second surface and may have a structure in which the eave portion is arranged above the inclined surface.
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公开(公告)号:US20240032156A1
公开(公告)日:2024-01-25
申请号:US18374271
申请日:2023-09-28
Applicant: NHK SPRING CO., LTD.
Inventor: Naoya KIDA , Jun FUTAKUCHIYA , Daisuke FUJINO , Yuki TANI
CPC classification number: H05B3/56 , H05B3/18 , H05B2203/016
Abstract: A sheathed heater with improved reliability is provided. Alternatively, a substrate support device including the sheathed heater with improved reliability is provided. The sheathed heater of the present invention includes a first metal wire, a first terminal connected to a first end of the first metal wire, a first conductive flexible member connected to the first terminal and connected to a second metal wire, a second terminal connected to a second end of the first metal wire, and a second conductive flexible member connected to the second terminal and connected to a third metal wire, wherein the first conductive flexible member and the second conductive flexible member are arranged adjacent to each other.
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