公开(公告)号：US20230207286A1

公开(公告)日：2023-06-29

申请号：US18176749

申请日：2023-03-01

Applicant: NHK SPRING CO., LTD.

Inventor： Hibiki YOKOYAMA ,  Naoya KIDA ,  Jun FUTAKUCHIYA ,  Noriyoshi KANEDA ,  Michiyoshi SONE

IPC: H01J37/32 ,  C23C4/11

CPC classification number: H01J37/32715 ,  C23C4/11

Abstract: A stage includes a base material including a step portion and an insulating film. The step portion includes a first surface recessed from a top surface of the base material and a second surface recessed from a side surface of the base material. The insulating film includes a plurality of first layers on the first surface and a plurality of second layers on the second surface. In the step portion, each first end portion of the plurality of first layers and each second end portion of the plurality of second layers are alternately stacked. The first surface and the second surface are connected via a corner, and each first end portion and each second end portion are alternately stacked at the corner.

公开(公告)号：US20220155156A1

公开(公告)日：2022-05-19

申请号：US17590780

申请日：2022-02-01

Applicant: NHK SPRING CO., LTD.

Inventor： Naoya KIDA ,  Arata TATSUMI ,  Kenji SEKIYA ,  Naoya AIKAWA ,  Masaya TAKANASHI

IPC: G01K7/06

Abstract: A temperature sensor includes a block body, a first thermocouple, and a second thermocouple. The first thermocouple includes a first strand, a second strand, a first insulator surrounding the first strand and the second strand, and a first metal sheath surrounding the first insulator. The second thermocouple includes a third strand, a fourth strand, a second insulator surrounding the third strand and the fourth strand, and a second metal sheath surrounding the second insulator. An end portion of each of the first thermocouple and the second thermocouple is buried in the block body.

公开(公告)号：US20240347371A1

公开(公告)日：2024-10-17

申请号：US18751140

申请日：2024-06-21

Applicant: NHK SPRING CO., LTD.

Inventor： Yusuke OTSUKA ,  Naoya KIDA ,  Jun FUTAKUCHIYA ,  Noriyoshi KANEDA ,  Hibiki YOKOYAMA ,  Michiyoshi SONE ,  Hiroki SAKAMOTO

IPC: H01L21/687 ,  H01J37/32

CPC classification number: H01L21/68757 ,  H01J37/32715 ,  H01J2237/2007

Abstract: A laminate structure of the disclosure is a laminate structure for a semiconductor manufacturing device, and includes a substrate containing aluminum and including a first face, an intermediate layer arranged on the first face of the substrate and containing aluminum oxide, and a cover layer arranged on the intermediate layer and containing metal atoms. The intermediate layer includes a partition wall forming a plurality of voids in a cross-sectional shape parallel to the first face. The intermediate layer includes a boundary layer covering the first face of the substrate. The cover layer is arranged in some of the plurality of voids in the intermediate layer. The plurality of voids includes voids adjacent to the boundary layer and separated from the cover layer.

公开(公告)号：US20240032156A1

公开(公告)日：2024-01-25

申请号：US18374271

申请日：2023-09-28

Applicant: NHK SPRING CO., LTD.

Inventor： Naoya KIDA ,  Jun FUTAKUCHIYA ,  Daisuke FUJINO ,  Yuki TANI

IPC: H05B3/56 ,  H05B3/18

CPC classification number: H05B3/56 ,  H05B3/18 ,  H05B2203/016

Abstract: A sheathed heater with improved reliability is provided. Alternatively, a substrate support device including the sheathed heater with improved reliability is provided. The sheathed heater of the present invention includes a first metal wire, a first terminal connected to a first end of the first metal wire, a first conductive flexible member connected to the first terminal and connected to a second metal wire, a second terminal connected to a second end of the first metal wire, and a second conductive flexible member connected to the second terminal and connected to a third metal wire, wherein the first conductive flexible member and the second conductive flexible member are arranged adjacent to each other.

公开(公告)号：US20220151031A1

公开(公告)日：2022-05-12

申请号：US17582848

申请日：2022-01-24

Applicant: NHK SPRING CO., LTD.

Inventor： Naoya KIDA ,  Arata TATSUMI ,  Kenji SEKIYA ,  Naoya AIKAWA ,  Masaya TAKANASHI

IPC: H05B3/56 ,  H05B3/06 ,  H05B3/18

Abstract: A heater includes a folded heater wire, a first insulator provided on the heater wire, a metal sheath provided so as to be in contact with the first insulator, a first insulating member arranged parallel to a first end part of the heater wire taken out from a first end part of the metal sheath, a second insulating member arranged parallel to the first insulating member and parallel to a second end part of the heater wire taken out from the first end part of the metal sheath, a second insulator in contact with the first and the second insulating members and the metal sheath, and a lid member covering the first insulating member, the lid member being in contact with the metal sheath, the first and the second insulating members via the second insulator, and arranged parallel to the first and the second insulating members and the metal sheath.