公开(公告)号：US11171274B2

公开(公告)日：2021-11-09

申请号：US16848534

申请日：2020-04-14

Applicant: NICHIA CORPORATION

Inventor： Hiroki Nakai ,  Kensuke Yamaoka

IPC: H01L33/64 ,  H01L27/15 ,  H01L33/38 ,  H01L33/44 ,  H01L33/50 ,  H01L33/56 ,  H01L33/60 ,  H01L33/62 ,  H01L33/32 ,  H01L33/40

Abstract: A light emitting element includes a semiconductor layered body, an insulating film, first and second electrodes, first external connecting parts and at least one second external connecting part. The semiconductor layered body includes a first semiconductor layer, a light emitting layer, and a second semiconductor layer. The first electrode is connected to the first semiconductor layer at exposed parts through openings in the insulating film, and partially arranged on the second semiconductor layer via the insulating film. The first external connecting parts are connected to the first electrode. The first external connecting parts are spaced apart from the exposed parts in a plan view, and at least two of the first external connecting parts being arranged between at least one set of adjacent ones of the exposed parts in the plan view. The second external connecting part is connected to the second electrode.

公开(公告)号：US10957822B2

公开(公告)日：2021-03-23

申请号：US16915579

申请日：2020-06-29

Applicant: NICHIA CORPORATION

Inventor： Hiroki Nakai ,  Kensuke Yamaoka

IPC: H01L33/48 ,  H01L25/075 ,  H01L33/50 ,  H01L33/60 ,  H01L33/52 ,  F21S41/151 ,  H01L33/62

Abstract: A light emitting device includes: a substrate; a light emitting element disposed on the substrate; a light transmissive member having a plate shape and having an upper face and a lower face that is larger than the upper face, disposed such that the lower face opposes a light emission face of the light emitting element; a light reflecting member covering lateral faces of the light transmissive member; and a light shielding frame covering lateral faces of the light transmissive member via the light reflecting member. The light shielding frame has an opening. An outer perimeter of the lower face of the light transmissive member is positioned outward of an inner perimeter of the opening in a plan view as seen from above.

公开(公告)号：US11152552B2

公开(公告)日：2021-10-19

申请号：US16592214

申请日：2019-10-03

Applicant: NICHIA CORPORATION

Inventor： Hiroki Nakai

IPC: H01L33/62 ,  H01L33/52 ,  H01L33/48 ,  H01L33/64

Abstract: A light emitting device includes a substrate, a light emitting element, and a frame. The substrate has a base and a wiring component. The frame surrounds the light emitting element on the substrate and has an inner edge and an outer edge. The wiring component has a first wiring layer constituting at least a part of an outermost surface of the wiring component inside of the outer edge of the frame, and connected to the light emitting element, and a second wiring layer constituting at least a part of the outermost surface of the wiring component outside of the inner edge of the frame, and made from a different material from the first wiring layer. A boundary between the first wiring layer and the second wiring layer on the outermost surface of the wiring component is disposed inside the outer edge of the frame.

公开(公告)号：US10741727B2

公开(公告)日：2020-08-11

申请号：US16203459

申请日：2018-11-28

Applicant: Nichia Corporation

Inventor： Hiroki Nakai ,  Kensuke Yamaoka

IPC: H01L33/48 ,  H01L25/075 ,  H01L33/50 ,  H01L33/60 ,  H01L33/52 ,  F21S41/151 ,  H01L33/62

Abstract: A light emitting device includes: a substrate; a light emitting element disposed on the substrate; a light transmissive member having a plate shape and having an upper face and a lower face disposed such that the lower face opposes a light emission face of the light emitting element; a light reflecting member covering lateral faces of the light emitting element and lateral faces of the light transmissive member; and a light shielding frame disposed on the upper face of the light reflecting member surrounding the light transmissive member. The light shielding frame has an opening, an inner perimeter of the opening is positioned at a distance apart from an outer perimeter of the upper face of the light transmissive member in a plan view as seen from above, and the light reflecting member is interposed between the inner perimeter of the opening and the outer perimeter of the upper face of the light transmissive member.

公开(公告)号：US10658559B2

公开(公告)日：2020-05-19

申请号：US16275014

申请日：2019-02-13

Applicant: NICHIA CORPORATION

Inventor： Hiroki Nakai ,  Kensuke Yamaoka

IPC: H01L33/64 ,  H01L27/15 ,  H01L33/38 ,  H01L33/44 ,  H01L33/50 ,  H01L33/56 ,  H01L33/60 ,  H01L33/62 ,  H01L33/32 ,  H01L33/40

Abstract: A light emitting element includes a semiconductor layered body, an insulating film, first and second electrodes, first external connecting parts and at least one second external connecting part. The semiconductor layered body includes a first semiconductor layer, a light emitting layer, and a second semiconductor layer. The first electrode is connected to the first semiconductor layer at exposed parts through openings in the insulating film, and partially arranged on the second semiconductor layer via the insulating film. The first external connecting parts are connected to the first electrode. The first external connecting parts are spaced apart from the exposed parts in a plan view. A group comprising at least one of the first external connecting parts and other group comprising at least one of the first external connecting parts respectively surround adjacent ones of the exposed parts while being spaced apart from each other in the plan view.