公开(公告)号：US11171274B2

公开(公告)日：2021-11-09

申请号：US16848534

申请日：2020-04-14

Applicant: NICHIA CORPORATION

Inventor： Hiroki Nakai ,  Kensuke Yamaoka

IPC: H01L33/64 ,  H01L27/15 ,  H01L33/38 ,  H01L33/44 ,  H01L33/50 ,  H01L33/56 ,  H01L33/60 ,  H01L33/62 ,  H01L33/32 ,  H01L33/40

Abstract: A light emitting element includes a semiconductor layered body, an insulating film, first and second electrodes, first external connecting parts and at least one second external connecting part. The semiconductor layered body includes a first semiconductor layer, a light emitting layer, and a second semiconductor layer. The first electrode is connected to the first semiconductor layer at exposed parts through openings in the insulating film, and partially arranged on the second semiconductor layer via the insulating film. The first external connecting parts are connected to the first electrode. The first external connecting parts are spaced apart from the exposed parts in a plan view, and at least two of the first external connecting parts being arranged between at least one set of adjacent ones of the exposed parts in the plan view. The second external connecting part is connected to the second electrode.

公开(公告)号：US11585495B2

公开(公告)日：2023-02-21

申请号：US17540571

申请日：2021-12-02

Applicant: NICHIA CORPORATION

Inventor： Kensuke Yamaoka

IPC: F21K9/90 ,  F21S41/32 ,  F21S41/141 ,  F21S41/43

Abstract: A light-emitting device includes: a mounting board; a light-emitting element disposed on or above the mounting board; a plate-shaped light-transmissive member having: a first surface; and a second surface facing a light-emitting surface of the light-emitting element; a light-reflective member covering a lateral surface of the light-transmissive member; and a light-shielding frame on an upper surface of the light-reflective member around the light-transmissive member. The light-shielding frame has an opening. An inner perimeter of the opening is located apart from outer perimeters of the first surface and the second surface of the light-transmissive member in a top plan view. The light-reflective member is disposed between the inner perimeter of the opening and the outer perimeters of the light-transmissive member.

公开(公告)号：US10957822B2

公开(公告)日：2021-03-23

申请号：US16915579

申请日：2020-06-29

Applicant: NICHIA CORPORATION

Inventor： Hiroki Nakai ,  Kensuke Yamaoka

IPC: H01L33/48 ,  H01L25/075 ,  H01L33/50 ,  H01L33/60 ,  H01L33/52 ,  F21S41/151 ,  H01L33/62

Abstract: A light emitting device includes: a substrate; a light emitting element disposed on the substrate; a light transmissive member having a plate shape and having an upper face and a lower face that is larger than the upper face, disposed such that the lower face opposes a light emission face of the light emitting element; a light reflecting member covering lateral faces of the light transmissive member; and a light shielding frame covering lateral faces of the light transmissive member via the light reflecting member. The light shielding frame has an opening. An outer perimeter of the lower face of the light transmissive member is positioned outward of an inner perimeter of the opening in a plan view as seen from above.

公开(公告)号：US12204128B2

公开(公告)日：2025-01-21

申请号：US18156855

申请日：2023-01-19

Applicant: NICHIA CORPORATION

Inventor： Kensuke Yamaoka ,  Hiroaki Kuroda ,  Daisuke Sanga

IPC: F21V8/00 ,  A01G7/04 ,  C09K11/61 ,  C09K11/64

Abstract: An optical member includes a first light guide member having an elongated shape and comprising an end surface and a lateral surface extending in a longitudinal direction from the end surface; and a wavelength conversion layer disposed on the lateral surface of the first light guide member and containing a phosphor.

公开(公告)号：US11367818B2

公开(公告)日：2022-06-21

申请号：US17028614

申请日：2020-09-22

Applicant: NICHIA CORPORATION

Inventor： Kensuke Yamaoka ,  Masaki Nagao

IPC: H01L33/60 ,  H01L25/075 ,  H01L33/52 ,  G02F1/13357 ,  F21K9/68 ,  H01L33/62

Abstract: A method of manufacturing a light-emitting device includes: mounting a light-emitting element on a mounting board; placing a light-shielding frame on a sheet, the light-shielding frame defining an opening and comprising at least one narrow portion having a width that is smaller than that of another portion of the light-shielding frame in a top view; applying a light-reflective resin on at least the narrow portion of the light-shielding frame; forming a light-guiding supporting member; and bonding the second surface of a light-transmissive member of the light-guiding supporting member to an upper surface of the light-emitting element so as to fix the light-guiding supporting member on or above the light-emitting element.

公开(公告)号：US11227971B2

公开(公告)日：2022-01-18

申请号：US16727463

申请日：2019-12-26

Applicant: Nichia Corporation

Inventor： Kensuke Yamaoka

IPC: H01L33/00 ,  H01L33/58 ,  H01L33/20 ,  H01L25/075 ,  F21K9/90 ,  F21Y115/10 ,  F21S41/141

Abstract: A light emitting device manufacturing method includes: disposing n pieces of light emitting elements in m rows on a substrate block, where an interval between a kth light emitting element from one end of rows and a (k+1)th light emitting element has a first distance; disposing a phosphor member on the light emitting elements; disposing a frame member to surround the light emitting elements; disposing a cover member in each area surrounded by the frame member to cover lateral surfaces of the light emitting elements and the phosphor members while forming recesses at an upper surface between the kth light emitting elements and the (k+1)th light emitting elements apart by the first distance; disposing a light shielding member in each recess; and cutting the light shielding members, the cover members, and the substrate block between the light emitting elements that are apart by the first distance.

公开(公告)号：US11769862B2

公开(公告)日：2023-09-26

申请号：US17211473

申请日：2021-03-24

Applicant: NICHIA CORPORATION

Inventor： Dai Wakamatsu ,  Kimihiro Miyamoto ,  Kensuke Yamaoka ,  Yoshiyuki Ide

IPC: H01L33/48 ,  H01L33/62 ,  H01L25/075 ,  H01L33/64 ,  H01L33/60 ,  H01L33/50

CPC classification number: H01L33/483 ,  H01L25/0753 ,  H01L33/50 ,  H01L33/60 ,  H01L33/62 ,  H01L33/641

Abstract: A light emitting device includes: a first substrate including: a first lead, and a second lead positioned apart from the first lead; a second substrate disposed on an upper face of the second lead, the second substrate including: a base, and a first conducting part disposed on an upper face of the base; a light emitting element disposed on the second substrate and electrically connected to the first conducting part; a first wire electrically connecting the first lead and the first conducting part; and a wall part straddling and covering an upper face of the first lead and an upper face of the second lead. A height of the wall part is less than a height of the second substrate.

公开(公告)号：US11221113B2

公开(公告)日：2022-01-11

申请号：US16582645

申请日：2019-09-25

Applicant: NICHIA CORPORATION

Inventor： Kensuke Yamaoka

IPC: F21K9/90 ,  F21S41/32 ,  F21S41/141 ,  F21S41/43

Abstract: A method for manufacturing a light-emitting device includes: a mounting step; a light-shielding frame placement step; a light-transmissive member placement step; a light-guiding supporting member formation step; a light-guiding supporting member bonding step; and a second light-reflective member formation step.

公开(公告)号：US10741727B2

公开(公告)日：2020-08-11

申请号：US16203459

申请日：2018-11-28

Applicant: Nichia Corporation

Inventor： Hiroki Nakai ,  Kensuke Yamaoka

IPC: H01L33/48 ,  H01L25/075 ,  H01L33/50 ,  H01L33/60 ,  H01L33/52 ,  F21S41/151 ,  H01L33/62

Abstract: A light emitting device includes: a substrate; a light emitting element disposed on the substrate; a light transmissive member having a plate shape and having an upper face and a lower face disposed such that the lower face opposes a light emission face of the light emitting element; a light reflecting member covering lateral faces of the light emitting element and lateral faces of the light transmissive member; and a light shielding frame disposed on the upper face of the light reflecting member surrounding the light transmissive member. The light shielding frame has an opening, an inner perimeter of the opening is positioned at a distance apart from an outer perimeter of the upper face of the light transmissive member in a plan view as seen from above, and the light reflecting member is interposed between the inner perimeter of the opening and the outer perimeter of the upper face of the light transmissive member.

公开(公告)号：US10658559B2

公开(公告)日：2020-05-19

申请号：US16275014

申请日：2019-02-13

Applicant: NICHIA CORPORATION

Inventor： Hiroki Nakai ,  Kensuke Yamaoka

IPC: H01L33/64 ,  H01L27/15 ,  H01L33/38 ,  H01L33/44 ,  H01L33/50 ,  H01L33/56 ,  H01L33/60 ,  H01L33/62 ,  H01L33/32 ,  H01L33/40

Abstract: A light emitting element includes a semiconductor layered body, an insulating film, first and second electrodes, first external connecting parts and at least one second external connecting part. The semiconductor layered body includes a first semiconductor layer, a light emitting layer, and a second semiconductor layer. The first electrode is connected to the first semiconductor layer at exposed parts through openings in the insulating film, and partially arranged on the second semiconductor layer via the insulating film. The first external connecting parts are connected to the first electrode. The first external connecting parts are spaced apart from the exposed parts in a plan view. A group comprising at least one of the first external connecting parts and other group comprising at least one of the first external connecting parts respectively surround adjacent ones of the exposed parts while being spaced apart from each other in the plan view.