公开(公告)号：US20210313302A1

公开(公告)日：2021-10-07

申请号：US17219221

申请日：2021-03-31

Applicant: NICHIA CORPORATION

Inventor： Katsuyoshi KADAN ,  So SAKAMAKI ,  Masayuki EGUCHI

IPC: H01L25/075 ,  H01L33/62

Abstract: A method of manufacturing a surface light source includes providing an intermediate structure body that includes a composite board including a supporting member and a wiring layer disposed on the supporting member and includes a plurality of light-emitting elements disposed apart from each other on the wiring layer of the composite board, disposing a plurality of covering members apart from each other to cover upper surfaces and lateral surfaces of the light-emitting elements and portions of the composite board around the light-emitting elements, disposing a light-shielding member such that a gap between the covering members is filled, removing the covering members to form a plurality of hole portions, and disposing a light-transmissive member in the hole portions.

公开(公告)号：US20210242382A1

公开(公告)日：2021-08-05

申请号：US17161402

申请日：2021-01-28

Applicant: NICHIA CORPORATION

Inventor： So SAKAMAKI

IPC: H01L33/62 ,  H01L33/50

Abstract: A method of manufacturing a light-emitting module according includes providing an intermediate structure, the intermediate structure including a board, and a plurality of light sources, and forming first and second wirings on an upper surface of the intermediate structure. The first wiring includes first extending portions and first connecting portions. The second wiring includes second extending portions and second connecting portions. The forming of the first and second wirings includes forming the first extending portions and the first connecting portions and the second extending portions, forming an insulating member covering at least the first connecting portions while at least a portion of each of the second extending portions is exposed from the insulating member, and forming the second connecting portions on or above a part of the insulating member positioned on or above the first connecting portions of the first wiring.

公开(公告)号：US20200343408A1

公开(公告)日：2020-10-29

申请号：US16859039

申请日：2020-04-27

Applicant: NICHIA CORPORATION

Inventor： So SAKAMAKI

IPC: H01L33/00 ,  H01L25/075

Abstract: A method for manufacturing a light-emitting module, includes placing a light-emitting element on a support member with an electrode formation surface of the light-emitting element facing upward; forming a pair of first conductive members respectively on the element electrodes; forming a first light-reflective resin layer on the support member and around the light-emitting element and the first conductive members; forming a pair of second conductive members on the first light-reflective resin layer and respectively on the first conductive members, the second conductive member being wider than the first conductive member; forming a second light-reflective resin layer on the first light-reflective resin layer and around the second conductive members; forming wiring electrodes over the second light-reflective resin layer from the second conductive members; and removing the support member.

公开(公告)号：US20250022996A1

公开(公告)日：2025-01-16

申请号：US18898677

申请日：2024-09-27

Applicant: NICHIA CORPORATION

Inventor： Tetsuya MIWA ,  So SAKAMAKI

IPC: H01L33/60 ,  H01L25/075 ,  H01L33/62

Abstract: A light-emitting module including a substrate including a support member having a first surface and a wiring layer provided on the first surface, and a plurality of light-emitting elements provided on the first surface and electrically connected to the wiring layer. A plurality of light adjustment members is provided on a side of upper surfaces of the light-emitting elements, and spaced apart from the light-emitting elements, respectively. At least one light-shielding member is provided on the first surface, provided surrounding a first light-emitting element among the light-emitting elements and a first light adjustment member among the light adjustment members in plan view, and provided between the first light-emitting element and a second light-emitting element among the light-emitting elements in cross-sectional view. A light-transmissive member covers the first surface, the wiring layer, the light-emitting elements, the light adjustment members, and the at least one light-shielding member.

公开(公告)号：US20210091053A1

公开(公告)日：2021-03-25

申请号：US17116531

申请日：2020-12-09

Applicant: NICHIA CORPORATION

Inventor： So SAKAMAKI ,  Yasunori NAGAHAMA ,  Masahiko SANO ,  Katsuyoshi KADAN

IPC: H01L25/075 ,  H01L33/50 ,  H01L33/62 ,  H01L33/60 ,  H01L33/00

Abstract: A light emitting module includes a substrate, a light reflective resin layer, wiring electrodes and a light emitting element. The light reflective resin layer is arranged on the substrate. The wiring electrodes are arranged over the substrate with the light reflective resin layer being interposed between the substrate and the wiring electrodes. The light emitting element has an electrode formation surface including a positive and negative pair of element electrodes, and a light emitting surface on a side opposite to the electrode formation surface. The light emitting element is arranged on top surfaces of the wiring electrodes with the element electrodes facing the top surfaces of the wiring electrodes.

公开(公告)号：US20250048782A1

公开(公告)日：2025-02-06

申请号：US18738578

申请日：2024-06-10

Applicant: Nichia Corporation

Inventor： So SAKAMAKI

IPC: H01L33/00 ,  H01L33/46 ,  H01L33/62

Abstract: A manufacturing method for a light-emitting device includes: forming a first metal film electrically connecting a first terminal and a first pad on a substrate such that the first metal film covers a part of an upper surface of each of the first terminal and the first pad; forming a first insulating film by insulating a front surface side of the first metal film while maintaining electrical connection between the first terminal and the first pad; mounting a light-emitting element having a first electrode on the substrate by bringing the first electrode into contact with the upper surface of the first terminal; forming a first plating film on surfaces of the first terminal and the first electrode in a state where the first metal film and the first insulating film remain formed; and removing the first insulating film and the first metal film after the first plating film is formed.

公开(公告)号：US20230197915A1

公开(公告)日：2023-06-22

申请号：US18069201

申请日：2022-12-20

Applicant: NICHIA CORPORATION

Inventor： So SAKAMAKI

IPC: H01L33/60 ,  H01L33/50 ,  H01L33/00

CPC classification number: H01L33/60 ,  H01L33/005 ,  H01L33/504

Abstract: A method for manufacturing a light-emitting device including a light-emitting element and a quantum dot configured to convert light emitted by the light-emitting element includes: preparing a base and a light-emitting element disposed on the base; forming a light reflective member surrounding the light-emitting element and including an inner surface and a top surface; forming a first barrier layer continuously covering a surface of the light-emitting element and the inner surface and the top surface of the light reflective member; forming a wavelength conversion member including the quantum dot in a region surrounded by the inner surface of the light reflective member, the light-emitting element being embedded in the wavelength conversion member ; and covering, with a second barrier layer, a top surface of the wavelength conversion member and at least a portion of the first barrier layer on the top surface of the light reflective member.

公开(公告)号：US20230066932A1

公开(公告)日：2023-03-02

申请号：US18048404

申请日：2022-10-20

Applicant: NICHIA CORPORATION

Inventor： So SAKAMAKI

IPC: H01L33/62 ,  H01L33/50

Abstract: A light emitting module includes a board, light sources, first and second wirings, and an insulating member. Each of the light sources includes first and second electrodes exposed from an upper side. The first wiring includes first extending portions and first connecting portions. The second wiring includes second extending portions and second connecting portions. The insulating member covers the first wiring and the second extending portions of the second wiring while a portion of each of the second extending portions of the second wiring is exposed from the insulating member through a corresponding one of the openings. The second connecting portions of the second wiring are arranged on or above a part of the insulating member positioned on or above the first connecting portions of the first wiring. The second connecting portions of the second wiring are respectively connected to the second extending portions at the openings.