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公开(公告)号：US20230317909A1
公开(公告)日：2023-10-05
申请号：US18190923
申请日：2023-03-27
Applicant: NICHIA CORPORATION
Inventor： Katsuyoshi KADAN
IPC: H01L33/62 , H01L25/075 , H01L33/60
CPC classification number: H01L33/62 , H01L25/0753 , H01L33/60 , H01L2933/0066 , H01L2933/0058
Abstract: A light-emitting module includes a substrate including a support member having a first surface, and a wiring layer arranged on the first surface. The light-emitting modules further include a light-shielding member arranged on the first surface and having a plurality of holes in plan view, a plurality of light-emitting elements respectively arranged inside the plurality of holes on the first surface and electrically connected to the wiring layer, a first light-transmissive member having a plurality of convex bodies respectively arranged on light extraction surfaces of the plurality of light-emitting elements inside the plurality of holes, and a plurality of gaps respectively arranged in contact with the wiring layer between the plurality of light-emitting elements and inner peripheral surfaces of the plurality of holes.
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公开(公告)号：US20130270593A1
公开(公告)日：2013-10-17
申请号：US13831211
申请日：2013-03-14
Applicant: NICHIA CORPORATION
Inventor： Junya NARITA , Takuya OKADA , Yohei WAKAI , Yoshiki INOUE , Naoya SAKO , Katsuyoshi KADAN
IPC: H01L33/10
CPC classification number: H01L33/22 , H01L21/0242 , H01L21/0243 , H01L21/02458 , H01L21/0254 , H01L33/007 , H01L33/10 , H01L33/20 , H01L33/32 , Y10T428/24 , Y10T428/24479
Abstract: A sapphire substrate having a principal surface for growing a nitride semiconductor to form a nitride semiconductor light emitting device comprises a plurality of projections on the principal surface. Each of the projections has a bottom that has a substantially polygonal shape. Each side of the bottom of the projections has a depression in its center. Vertexes of the bottoms of the respective projections extend in a direction that is within a range of ±10 degrees of a direction that is rotated clockwise by 30 degrees from a crystal axis “a” of the sapphire substrate.
Abstract translation: 具有用于生长氮化物半导体以形成氮化物半导体发光器件的主表面的蓝宝石衬底包括主表面上的多个突起。 每个突起具有基本上多边形的底部。 突起的底部的每一侧在其中心具有凹陷。 各个突起的底部的顶点在与蓝宝石基板的晶轴“a”顺时针旋转30度的方向的±10度的范围内延伸。
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公开(公告)号：US20150270443A1
公开(公告)日：2015-09-24
申请号：US14734961
申请日：2015-06-09
Applicant: NICHIA CORPORATION
Inventor： Junya NARITA , Takuya OKADA , Yohei WAKAI , Yoshiki INOUE , Naoya SAKO , Katsuyoshi KADAN
CPC classification number: H01L33/22 , H01L21/0242 , H01L21/0243 , H01L21/02458 , H01L21/0254 , H01L33/007 , H01L33/10 , H01L33/20 , H01L33/32 , Y10T428/24 , Y10T428/24479
Abstract: The sapphire substrate has a principal surface for growing a nitride semiconductor to form a nitride semiconductor light emitting device and comprising a plurality of projections of the principal surface, wherein an outer periphery of a bottom surface of each of the projections has at least one depression. This depression is in the horizontal direction. The plurality of projections are arranged so that a straight line passes through the inside of at least any one of projections when the straight line is drawn at any position in any direction in a plane including the bottom surfaces of the plurality of projections.
Abstract translation: 蓝宝石衬底具有用于生长氮化物半导体以形成氮化物半导体发光器件的主表面，并且包括主表面的多个突起，其中每个突起的底表面的外周具有至少一个凹陷。 这个凹陷在水平方向。 多个突起被布置成使得当直线在包括多个突起的底表面的平面的任何方向上的任何位置处被拉伸时，直线穿过至少任一个突起的内部。
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Patent Agency Ranking
公开(公告)号：US20210313302A1
公开(公告)日：2021-10-07
申请号：US17219221
申请日：2021-03-31
Applicant: NICHIA CORPORATION
Inventor： Katsuyoshi KADAN , So SAKAMAKI , Masayuki EGUCHI
IPC: H01L25/075 , H01L33/62
Abstract: A method of manufacturing a surface light source includes providing an intermediate structure body that includes a composite board including a supporting member and a wiring layer disposed on the supporting member and includes a plurality of light-emitting elements disposed apart from each other on the wiring layer of the composite board, disposing a plurality of covering members apart from each other to cover upper surfaces and lateral surfaces of the light-emitting elements and portions of the composite board around the light-emitting elements, disposing a light-shielding member such that a gap between the covering members is filled, removing the covering members to form a plurality of hole portions, and disposing a light-transmissive member in the hole portions.
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公开(公告)号：US20130285109A1
公开(公告)日：2013-10-31
申请号：US13831138
申请日：2013-03-14
Applicant: NICHIA CORPORATION
Inventor： Junya NARITA , Takuya OKADA , Yohei WAKAI , Yoshiki INOUE , Naoya SAKO , Katsuyoshi KADAN
IPC: H01L33/20
CPC classification number: H01L33/22 , H01L21/0242 , H01L21/0243 , H01L21/02458 , H01L21/0254 , H01L33/007 , H01L33/10 , H01L33/20 , H01L33/32 , Y10T428/24 , Y10T428/24479
Abstract: A sapphire substrate having a principal surface for growing a nitride semiconductor to form a nitride semiconductor light emitting device comprises a plurality of projections on the principal surface. Each of the projections has a bottom that has a substantially polygonal shape. Each side of the bottom of the projections has a depression in its center. Vertexes of the bottoms of the respective projections extend in a direction that is within a range of ±10 degrees of a direction that is rotated counter-clockwise by 30 degrees from a crystal axis “a” of the sapphire substrate.
Abstract translation: 具有用于生长氮化物半导体以形成氮化物半导体发光器件的主表面的蓝宝石衬底包括主表面上的多个突起。 每个突起具有基本上多边形的底部。 突起的底部的每一侧在其中心具有凹陷。 相应突起的底部的顶点在与蓝宝石基板的晶轴“a”逆时针旋转30度的方向的±10度的范围内延伸。
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公开(公告)号：US20210091053A1
公开(公告)日：2021-03-25
申请号：US17116531
申请日：2020-12-09
Applicant: NICHIA CORPORATION
Inventor： So SAKAMAKI , Yasunori NAGAHAMA , Masahiko SANO , Katsuyoshi KADAN
IPC: H01L25/075 , H01L33/50 , H01L33/62 , H01L33/60 , H01L33/00
Abstract: A light emitting module includes a substrate, a light reflective resin layer, wiring electrodes and a light emitting element. The light reflective resin layer is arranged on the substrate. The wiring electrodes are arranged over the substrate with the light reflective resin layer being interposed between the substrate and the wiring electrodes. The light emitting element has an electrode formation surface including a positive and negative pair of element electrodes, and a light emitting surface on a side opposite to the electrode formation surface. The light emitting element is arranged on top surfaces of the wiring electrodes with the element electrodes facing the top surfaces of the wiring electrodes.
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公开(公告)号：US20200321497A1
公开(公告)日：2020-10-08
申请号：US16838697
申请日：2020-04-02
Applicant: NICHIA CORPORATION
Inventor： Katsuyoshi KADAN
Abstract: A method of manufacturing a light emitting device, the method includes: preparing an intermediate structure including a supporter, a plurality of light emitting elements arranged on the supporter, a covering layer arranged on the supporter and surrounding the light emitting elements, and wiring electrodes each arranged on and straddling the covering layer and a corresponding one of the light emitting elements: preparing a board including light-reflective resin arranged on a surface of the board; pressing the intermediate structure against the light-reflective resin arranged on the board, with the wiring electrodes facing the light-reflective resin; curing the light-reflective resin to form a light-reflective resin layer; and removing the supporter.
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公开(公告)号：US20190140151A1
公开(公告)日：2019-05-09
申请号：US16183662
申请日：2018-11-07
Applicant: NICHIA CORPORATION
Inventor： Katsuyoshi KADAN , Hajime WASHIO
IPC: H01L33/60 , H01L33/62 , H01L25/075
Abstract: A light emitting device includes: first and second conductive members disposed on an upper surface of a substrate; and a light emitting element disposed above a portion of an upper surface of a first electrode layer and a portion of an upper surface of a second electrode layer, above the spacer region. The upper surface of the first electrode layer and the upper surface of the second electrode layer above spacer region are located lower than the upper surface of the first electrode layer above the first conductive member and the upper surface of the second electrode layer above the second conductive member, and a reflectance of the first conductive member and the second to light emitted from the light emitting element is higher than reflectance of the first electrode layer and the second electrode layer to light emitted from the light emitting element.
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