公开(公告)号：US20190189866A1

公开(公告)日：2019-06-20

申请号：US16216882

申请日：2018-12-11

Applicant: NICHIA CORPORATION

Inventor： Masafumi KURAMOTO ,  Toshifumi IMURA ,  Tomoki TANISADA

IPC: H01L33/50 ,  H01L23/29 ,  H01L33/52 ,  H01L33/56 ,  H01L23/00

CPC classification number: H01L33/508 ,  H01L23/295 ,  H01L24/29 ,  H01L24/48 ,  H01L24/73 ,  H01L33/52 ,  H01L33/56 ,  H01L2224/2929 ,  H01L2224/29298 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48463 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2933/0091 ,  H01L2224/45099 ,  H01L2924/00

Abstract: A semiconductor device includes a semiconductor element, a base body, a conductive adhesive member, and a sealing member. The semiconductor element includes a substrate, a semiconductor element structure provided on the substrate, and p-electrode and n-electrode provided on the semiconductor element structure. The semiconductor element is disposed on the base body. The conductive adhesive member electrically connects the p-electrode and the n-electrode to the base body. The sealing member is provided to cover the semiconductor element on an upper surface of the base body. The conductive adhesive member contains particles selected from a group of (i) surface-treated particles having a particle diameter of 1 nm or more and 100 μm or less and (ii) particles that coexist with a dispersing agent.

公开(公告)号：US20150295153A1

公开(公告)日：2015-10-15

申请号：US14684468

申请日：2015-04-13

Applicant: NICHIA CORPORATION

Inventor： Masafumi KURAMOTO ,  Toshifumi IMURA ,  Tomoki TANISADA

IPC: H01L33/62 ,  H01L33/52 ,  H01L33/50

CPC classification number: H01L33/508 ,  H01L23/295 ,  H01L24/29 ,  H01L24/48 ,  H01L24/73 ,  H01L33/52 ,  H01L33/56 ,  H01L2224/2929 ,  H01L2224/29298 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48463 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2933/0091 ,  H01L2224/45099 ,  H01L2924/00

Abstract: The present invention provides a semiconductor device in which wet-spreading of an adhesive member for bonding the semiconductor element on a base body is suppressed.The semiconductor device (100) of the present invention is a semiconductor device including a base body (10), and a semiconductor element (20) bonded on the base body via an adhesive member (30), wherein the adhesive member (30) contains surface-treated particles (40), or particles (40) that coexist with a dispersing agent, and at least a part of the marginal portion (301) of the adhesive member is a region where the particles (40) are unevenly distributed.

Abstract translation: 本发明提供了一种半导体器件，其中抑制用于将半导体元件接合在基体上的粘合部件的湿扩散。 本发明的半导体装置（100）是具有基体（10）的半导体装置和通过粘接部件（30）与基体接合的半导体元件（20），其中，粘接部件（30） 表面处理颗粒（40）或与分散剂共存的颗粒（40），并且粘合剂构件的边缘部分（301）的至少一部分是颗粒（40）不均匀分布的区域。