公开(公告)号：US20200100360A1

公开(公告)日：2020-03-26

申请号：US16583160

申请日：2019-09-25

Applicant: NICHIA CORPORATION

Inventor： Masaaki KATSUMATA ,  Koji TAGUCHI ,  Norifumi SASAOKA ,  Yosuke NODA

IPC: H05K1/11 ,  H05K1/09 ,  H05K3/40 ,  H05K1/18 ,  H05K3/34 ,  H01L33/62

Abstract: A method of manufacturing a circuit substrate including forming, in an insulating substrate and circuit patterns that are provided on a first surface and a second surface of the insulating substrate, a through-hole penetrating the insulating substrate and the circuit patterns, where the circuit patterns contain Cu as a main component. The method including filling, in the through-hole, an electrically conductive paste that is a melting-point shift electrically conductive paste including Sn—Bi solder powder, Cu powder, and resin, and forming a protrusion obtained by causing the electrically conductive paste to protrude from the through-hole. The method further including performing pressure treatment on the protrusion near the through-hole; and performing heat treatment on the insulating substrate whose protrusion is subjected to the pressure treatment and causing the circuit patterns and the electrically conductive paste to be electrically connected with each other.

公开(公告)号：US20240098901A1

公开(公告)日：2024-03-21

申请号：US18465803

申请日：2023-09-12

Applicant: NICHIA CORPORATION

Inventor： Shota TAKASE ,  Masanori UEMURA ,  Masakazu SAKAMOTO ,  Yosuke NODA

IPC: H05K1/18 ,  H05K1/02 ,  H05K1/11 ,  H05K3/10

CPC classification number: H05K1/181 ,  H05K1/021 ,  H05K1/115 ,  H05K3/103 ,  H05K2201/10106 ,  H05K2203/0117

Abstract: A light-emitting module includes one or more light-emitting devices, and a wiring substrate. Each of the light-emitting devices includes light-emitting elements, and a package including a lower surface having a wiring region. The wiring substrate includes a metal portion, an electrode portion, and an insulating portion, and defines one or more first through holes. The mounting surface of the wiring substrate includes a first region where the metal portion defines an uppermost surface, a second region where the electrode portion defines an uppermost surface, and a third region where the insulating portion defines an uppermost surface. The first region and the second region are separated from each other by the third region. A boundary of each of the first through holes is defined in the first region. The wiring region of each of the light-emitting devices is bonded to the electrode portion of the wiring substrate.

公开(公告)号：US20250087964A1

公开(公告)日：2025-03-13

申请号：US18830565

申请日：2024-09-10

Applicant: NICHIA CORPORATION

Inventor： Yosuke NODA ,  Masakazu SAKAMOTO ,  Miwako KAZUNOBU

IPC: H01S5/02 ,  H01S5/024

Abstract: A manufacturing method of a mounting substrate includes: preparing a substrate including a mounting portion having a mounting surface, a first protruding portion having a first upper surface located above the mounting surface, and a second protruding portion having a second upper surface located above the mounting surface, the mounting surface being located between the first and second upper surfaces in a top view; disposing the substrate on a support member having a support surface such that the first and second upper surfaces face the support surface; and providing first and second through holes from a lower surface side toward an upper surface side of the substrate at first and second positions between which the mounting surface is interposed in the top view, the first and second positions not being located between the first upper surface and the mounting surface nor between the second upper surface and the mounting surface.

公开(公告)号：US20230199964A1

公开(公告)日：2023-06-22

申请号：US18068397

申请日：2022-12-19

Applicant: NICHIA CORPORATION

Inventor： Yosuke NODA ,  Masaaki KATSUMATA ,  Masakazu SAKAMOTO

IPC: H05K1/18 ,  H05K3/30 ,  H05K3/40

CPC classification number: H05K1/181 ,  H05K3/303 ,  H05K3/4015 ,  H05K2203/1105 ,  H05K2201/10106 ,  H05K2201/0376

Abstract: A method for manufacturing a circuit board includes: providing a first board including a post portion, and a second board defining an opening portion extending through a base material, the base material including a circuit pattern disposed on a first surface and an adhesive member disposed on a side of a second surface; and bonding the first board and the second board using the adhesive member by pressurizing and heating the first board and the second board in a state of the post portion being inserted in the opening portion and a top surface of the post portion being exposed from the second board. In a plan view, the second board includes a base material exposed portion. In the bonding, the adhesive member melted by the pressurizing and the heating is disposed between a lateral surface of the post portion and the second board.

公开(公告)号：US20210084763A1

公开(公告)日：2021-03-18

申请号：US17107953

申请日：2020-12-01

Applicant: NICHIA CORPORATION

Inventor： Masaaki KATSUMATA ,  Koji TAGUCHI ,  Norifumi SASAOKA ,  Yosuke NODA

IPC: H05K1/11 ,  H05K1/09 ,  H01L33/62

Abstract: A method of manufacturing a circuit substrate includes forming, in an insulating substrate and circuit patterns that are provided on a first surface and a second surface of the insulating substrate, a through-hole penetrating the insulating substrate and the circuit patterns, where the circuit patterns contain Cu as a main component. The method includes filling, in the through-hole, an electrically conductive paste that is a melting-point shift electrically conductive paste including Sn—Bi solder powder, Cu powder, and resin, and forming a protrusion obtained by causing the electrically conductive paste to protrude from the through-hole. The method further includes performing pressure treatment on the protrusion near the through-hole; and performing heat treatment on the insulating substrate whose protrusion is subjected to the pressure treatment and causing the circuit patterns and the electrically conductive paste to be electrically connected with each other.