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Patent Agency Ranking
公开(公告)号：US20180371237A1
公开(公告)日：2018-12-27
申请号：US15739843
申请日：2016-07-06
Applicant: NISSHINBO CHEMICAL INC.
Inventor： Nami TSUKAMOTO , Nobuyuki MATSUMOTO , Ikuo TAKAHASHI , Takahiko ITOH
Abstract: A carbodiimide-based aqueous resin crosslinking agent excellent in the storage stability in the coexistence of an aqueous resin, comprising a polycarbodiimide (A) having substituents derived from hydrophilic organic compounds at both terminals thereof, at least one of the substituents being a substituent derived from a hydrophilic organic compound having a molecular weight of 340 or more, and a polycarbodiimide (B) having substituents derived from organic compounds having a molecular weight of 300 or less at both terminals thereof, wherein the mass ratio [(B)/(A)] of the polycarbodiimide (B) to the polycarbodiimide (A) is from 20/80 to 95/5.
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公开(公告)号：US20180118878A1
公开(公告)日：2018-05-03
申请号：US15563884
申请日：2016-03-18
Applicant: NISSHINBO CHEMICAL INC.
Inventor： Ikuo TAKAHASHI , Takahiko ITOH , Shinichi NAKASHIMA , Takahiro SASAKI
CPC classification number: C08G59/686 , C08G18/025 , C08G18/71 , C08G18/7671 , C08G18/833 , C08G59/621 , C08G59/68
Abstract: The present invention provides an epoxy resin composition, which is improved in terms of storage stability without deteriorating the characteristics of a cured resin, and is also superior in handling property, by using a curing accelerator having higher latency. The epoxy resin composition of the present invention comprises an epoxy resin, a curing agent, and a curing accelerator, wherein the curing accelerator is a reaction product between a carbodiimide compound and an imidazole compound, and is contained in an amount of 0.1 to 5 parts by mass with respect to 100 parts by mass of the epoxy resin.
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公开(公告)号：US20180282516A1
公开(公告)日：2018-10-04
申请号：US15764717
申请日：2016-09-30
Applicant: NISSHINBO CHEMICAL INC.
Inventor： Ikuo TAKAHASHI , Yoshihiro YAMAZAKI , Akira TANIGUCHI , Saori KOTANI , Naoki NISHIKAWA
Abstract: There are provided a resin additive with which the generation of an isocyanate gas during the production of a master batch or a resin composition can be effectively suppressed when a carbodiimide compound is used as an additive for improving the hydrolysis resistance of a resin, a master batch using the above resin additive, and a method for producing the same, and a resin composition using the above resin additive, and a method for producing the same. A resin additive comprising a carbodiimide compound (A) and a surfactant (B), and a master batch and a resin composition comprising the above resin additive and a resin (D), and methods for producing these.
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公开(公告)号：US20180094095A1
公开(公告)日：2018-04-05
申请号：US15563850
申请日：2016-03-30
Applicant: NISSHINBO CHEMICAL INC.
Inventor： Ikuo TAKAHASHI , Takahiko ITOH , Takahiro SASAKI
IPC: C08G18/02 , C08L101/08 , C08G18/83 , C08G18/76 , C08L63/00
CPC classification number: C08G18/025 , C08G18/095 , C08G18/168 , C08G18/44 , C08G18/71 , C08G18/76 , C08G18/7621 , C08G18/797 , C08G18/833 , C08J2300/24 , C08L63/00 , C08L101/08 , C09D175/04 , C08L79/08
Abstract: The modified polycarbodiimide compound of the present invention is obtained by modifying a polycarbodiimide compound derived from a diisocyanate compound with at least one aliphatic amine selected from the group consisting of diethylamine, methylisopropylamine, tert-butylethylamine, di-sec-butylamine, dicyclohexylamine, 2-methylpiperidine and 2,6-dimethylpiperidine. The curing agent of the present invention comprises the modified polycarbodiimide compound of the present invention. The thermosetting resin composition of the present invention comprises a carboxyl group-containing resin having a carboxyl group in a molecule or an epoxy resin having two or more epoxy groups in one molecule, and the curing agent of the present invention. Thus, a modified polycarbodiimide compound that can allow a resin composition to be cured at a relatively low temperature and that can suppress curing of a resin composition in a drying step before a thermal curing step of a resin composition, a curing agent comprising the modified polycarbodiimide compound, and a thermosetting resin composition comprising the curing agent can be provided.
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公开(公告)号：US20180066098A1
公开(公告)日：2018-03-08
申请号：US15563043
申请日：2016-03-30
Applicant: NISSHINBO CHEMICAL INC.
Inventor： Ikuo TAKAHASHI , Takahiko ITOH , Takahiro SASAKI
IPC: C08G18/02 , C08L79/08 , C08L101/08 , C08G18/83
CPC classification number: C08G18/025 , C08G18/095 , C08G18/168 , C08G18/44 , C08G18/71 , C08G18/7621 , C08G18/797 , C08G18/833 , C08J2300/24 , C08L63/00 , C08L79/08 , C08L101/08 , C09D175/04
Abstract: The modified polycarbodiimide compound of the present invention is obtained by modifying a polycarbodiimide compound derived from a diisocyanate compound with an aromatic heterocyclic compound having endocyclic secondary amine nitrogen. The curing agent of the present invention comprises the modified polycarbodiimide compound of the present invention. Thus, a modified polycarbodiimide compound that allows amine dissociation to start at a low temperature as compared with a modified polycarbodiimide compound obtained by modifying a polycarbodiimide compound derived from a diisocyanate compound with diisopropylamine, and a curing agent comprising the modified polycarbodiimide compound can be provided.
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