公开(公告)号：US20230240007A1

公开(公告)日：2023-07-27

申请号：US18001681

申请日：2021-05-27

Applicant: NITTO DENKO CORPORATION

Inventor： Daigo TSUBAI ,  Naoki SHIBATA ,  Hiroaki MACHITANI

IPC: H05K1/05 ,  H05K1/11

CPC classification number: H05K1/05 ,  H05K1/11

Abstract: A wiring circuit board includes a metal support substrate, an insulating layer, and a conductive layer in this order in a thickness direction, and has an edge portion extending in a first direction. The edge portion includes a main structure portion and partially includes a partial structure portion. In the main structure portion, the metal support substrate has a substrate extension portion extending outwardly with respect to the insulating layer in a second direction perpendicular to the first direction and the thickness direction. In the partial structure portion, the insulating layer has an insulating layer extension portion extending outwardly with respect to the metal support substrate in the second direction.

公开(公告)号：US20210212208A1

公开(公告)日：2021-07-08

申请号：US17057906

申请日：2019-05-10

Applicant: NITTO DENKO CORPORATION

Inventor： Naoki SHIBATA ,  Hiroaki MACHITANI ,  Yasunari OYABU ,  Masaki ITO ,  Kenya TAKIMOTO

IPC: H05K1/11 ,  H05K1/02

Abstract: A wiring circuit board includes an insulating layer and a conductive layer disposed on a front surface of the insulating layer. The conductive layer includes a first wiring, a first terminal electrically connected to the first wiring, a second wiring independent of the first wiring and having a thick thickness T2 with respect to a thickness T1 of the first wiring, and a second terminal electrically connected to the second wiring. The surfaces of the first terminal and the second terminal are disposed at generally the same position in a thickness direction.

公开(公告)号：US20240107679A1

公开(公告)日：2024-03-28

申请号：US18466533

申请日：2023-09-13

Applicant: NITTO DENKO CORPORATION

Inventor： Kenya TAKIMOTO ,  Hiroaki MACHITANI

IPC: H05K3/00

CPC classification number: H05K3/0052 ,  H05K2203/0169

Abstract: An assembly sheet includes a plurality of wiring circuit boards, a support portion, a connecting portion, and an opening portion. The wiring circuit board includes a first and a second wiring circuit board. The connecting portion includes a first and a second connecting portion connected to the first and the second wiring circuit board, respectively. The support portion and the connecting portion are not disposed between the first and the second wiring circuit board. The first wiring circuit board includes a first main body portion and a first protrusion portion. The second wiring circuit board includes a second main body portion. A first line passing a center of the first main body portion and a second line passing the center of the second main body portion are deviated so that a protrusion amount of the first protrusion portion with respect to the second main body portion is small.

公开(公告)号：US20230098947A1

公开(公告)日：2023-03-30

申请号：US17908470

申请日：2021-02-24

Applicant: NITTO DENKO CORPORATION

Inventor： Shusaku SHIBATA ,  Hiroaki MACHITANI ,  Teppei NIINO

IPC: H05K1/11 ,  H05K1/05 ,  H05K3/32 ,  H05K1/02 ,  H05K3/46

Abstract: A wiring circuit board includes two insulating layers, a wiring layer, a pad portion, and a conductive connection portion. The wiring layer is on one side in a thickness direction of the first insulating layer, and has a contact portion. The second insulating layer is on one side in the thickness direction of the first insulating layer to cover the wiring layer. The pad portion is on one side in the thickness direction of the second insulating layer. The second insulating layer has a through opening portion and having an opening along at least a part of a peripheral end portion of the pad portion. The contact portion of the wiring layer faces the through opening portion. The conductive connection portion, is connected to at least the peripheral end portion of the pad portion, and the contact portion, and electrically connects the wiring layer to the pad portion.

公开(公告)号：US20220287177A1

公开(公告)日：2022-09-08

申请号：US17636251

申请日：2020-06-11

Applicant: NITTO DENKO CORPORATION

Inventor： Hayato TAKAKURA ,  Daigo TSUBAI ,  Hiroaki MACHITANI

IPC: H05K1/05 ,  H01B1/02 ,  H05K1/09

Abstract: A wired circuit board includes a metal supporting layer, an insulating base layer and a conductor layer from bottom to top. A peripheral edge of the insulating base layer includes an extension part extending further outward relative to the metal supporting layer. The metal supporting layer has a thickness T1 of 50 μm or more.

公开(公告)号：US20220192010A1

公开(公告)日：2022-06-16

申请号：US17441918

申请日：2020-03-05

Applicant: NITTO DENKO CORPORATION

Inventor： Ryosuke SASAOKA ,  Yasunari OYABU ,  Hiroaki MACHITANI ,  Hayato TAKAKURA

IPC: H05K1/02 ,  H05K3/00

Abstract: A wiring circuit board includes an alignment mark layer. The alignment mark layer includes a first alignment mark and a second alignment mark. The condition A or the condition B is satisfied. Condition A: The first alignment mark has a first portion (a first starting point portion or a first center of gravity portion). The second alignment mark has a second portion (a second starting point portion or a second center of gravity portion). Condition B: The first alignment mark has the first portion, and the second alignment mark does not have the second portion, or the first alignment mark does not have the first portion, and the second alignment mark does not have the second portion.