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公开(公告)号：US20240260177A1
公开(公告)日：2024-08-01
申请号：US18007388
申请日：2021-05-24
发明人： Kenya TAKIMOTO , Naoki SHIBATA , Hayato TAKAKURA
CPC分类号： H05K1/0298 , H05K3/02
摘要： Provided is a method for producing a wiring circuit board that includes the steps of forming a first metal layer on a metal supporting substrate; forming an insulating layer on the first metal layer; removing a portion of the first metal layer, the portion being exposed at the opening portion of the insulating layer, to expose the metal supporting substrate at the opening portion; forming a second metal layer on a portion of the metal supporting substrate exposed at the opening portion and on the insulating layer; and forming a conductive layer on the second metal layer. A wiring circuit board includes the metal supporting substrate, the first metal layer having a first opening portion, the insulating layer having a second opening portion having an opening along the first opening portion, the second metal layer connected to the metal supporting substrate, and the conductive layer on the second metal layer.
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公开(公告)号：US20220201871A1
公开(公告)日：2022-06-23
申请号：US17610060
申请日：2020-03-31
发明人： Kenya TAKIMOTO , Naoki SHIBATA , Hayato TAKAKURA
摘要： A wiring circuit board includes a metal support layer, a base insulating layer disposed on one side in a thickness direction of the metal support layer, and a conductive layer disposed on one side in the thickness direction of the base insulating layer, and including a first terminal and a ground lead residual portion electrically connected to the first terminal. The base insulating layer has a through hole penetrating in the thickness direction. The ground lead residual portion has an opening continuous so as to surround the through hole.
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公开(公告)号：US20210212208A1
公开(公告)日：2021-07-08
申请号：US17057906
申请日：2019-05-10
发明人： Naoki SHIBATA , Hiroaki MACHITANI , Yasunari OYABU , Masaki ITO , Kenya TAKIMOTO
摘要： A wiring circuit board includes an insulating layer and a conductive layer disposed on a front surface of the insulating layer. The conductive layer includes a first wiring, a first terminal electrically connected to the first wiring, a second wiring independent of the first wiring and having a thick thickness T2 with respect to a thickness T1 of the first wiring, and a second terminal electrically connected to the second wiring. The surfaces of the first terminal and the second terminal are disposed at generally the same position in a thickness direction.
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公开(公告)号：US20240244756A1
公开(公告)日：2024-07-18
申请号：US18404458
申请日：2024-01-04
发明人： Chihiro WATANABE , Kenya TAKIMOTO
CPC分类号： H05K3/0097 , H05K1/0266 , H05K2201/09936 , H05K2203/0165
摘要： An assembly sheet includes a supporting portion, a plurality of wiring circuit boards, and a joint portion. The supporting portion supports the plurality of wiring circuit boards. The supporting portion surrounds the plurality of wiring circuit boards while being separated from the plurality of wiring circuit boards by an interval. The joint portion joins the plurality of wiring circuit boards to the supporting portion. The plurality of wiring circuit boards includes a first wiring circuit board and a second wiring circuit board. The second wiring circuit board is arranged next to the first wiring circuit board while being separated from the first wiring circuit board by an interval. The second wiring circuit board is symmetrical to the first wiring circuit board with respect to a point centered therebetween. The supporting portion includes a first and second mark. The second mark is asymmetrical to the first with respect to the point.
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公开(公告)号：US20220256712A1
公开(公告)日：2022-08-11
申请号：US17610058
申请日：2020-04-08
发明人： Kenya TAKIMOTO , Naoki SHIBATA , Hayato TAKAKURA
摘要： A wiring circuit board includes a metal support layer, a base insulating layer disposed on one side in a thickness direction of the metal support layer, and a conductive layer disposed on one side in the thickness direction of the base insulating layer, and including a first terminal and a ground lead residual portion electrically connected to the first terminal. A thickness of the ground lead residual portion is thinner than a thickness of the first terminal.
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公开(公告)号：US20210212196A1
公开(公告)日：2021-07-08
申请号：US17057912
申请日：2019-05-10
发明人： Masaki ITO , Naoki SHIBATA , Yasunari OYABU , Kenya TAKIMOTO
摘要： A wiring circuit board includes a support metal layer having thermal conductivity of 5 W/m·K or more, an insulating layer disposed on at least one side in a thickness direction of the support metal layer, a wiring layer disposed on a front surface of the insulating layer, a protective metal film disposed on the entire surface of the support metal layer between the support metal layer and the insulating layer, and a protective thin film disposed on an exposed surface exposed from the protective metal film in the support metal layer.
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公开(公告)号：US20240244742A1
公开(公告)日：2024-07-18
申请号：US18559498
申请日：2022-01-28
发明人： Kenya TAKIMOTO , Naoki SHIBATA , Hayato TAKAKURA
CPC分类号： H05K1/0296 , H05K1/05 , H05K2201/09927
摘要： A wiring circuit board includes a support metal layer; a base insulating layer disposed on at least one surface in the thickness direction of the support metal layer, and a wiring layer disposed on one surface in the thickness direction of the base insulating layer. A plurality of stripe grooves that extends along a predetermined direction orthogonal to the thickness direction and a plurality of recesses that sinks in the thickness direction of the support metal layer are formed on one surface in the thickness direction and/or the other surface in the thickness direction of the support metal layer. The recesses form a two-dimensional code having a generally rectangular shape in plan view by means of a dot pattern. One side of the two-dimensional code is disposed so as to lie along the stripe grooves.
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公开(公告)号：US20240107679A1
公开(公告)日：2024-03-28
申请号：US18466533
申请日：2023-09-13
发明人： Kenya TAKIMOTO , Hiroaki MACHITANI
IPC分类号： H05K3/00
CPC分类号： H05K3/0052 , H05K2203/0169
摘要： An assembly sheet includes a plurality of wiring circuit boards, a support portion, a connecting portion, and an opening portion. The wiring circuit board includes a first and a second wiring circuit board. The connecting portion includes a first and a second connecting portion connected to the first and the second wiring circuit board, respectively. The support portion and the connecting portion are not disposed between the first and the second wiring circuit board. The first wiring circuit board includes a first main body portion and a first protrusion portion. The second wiring circuit board includes a second main body portion. A first line passing a center of the first main body portion and a second line passing the center of the second main body portion are deviated so that a protrusion amount of the first protrusion portion with respect to the second main body portion is small.
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公开(公告)号：US20230254971A1
公开(公告)日：2023-08-10
申请号：US18163071
申请日：2023-02-01
IPC分类号： H05K1/05
CPC分类号： H05K1/05 , H05K2201/09036
摘要： Provided is a wiring circuit board and a wiring circuit board assembly that allow suppression of the recognition error of the dot pattern. The wiring circuit board includes a metal supporting layer, an insulating base layer, and a wiring layer. The wiring circuit board further includes a plurality of streak groove portions disposed on one surface of the metal supporting layer in the thickness direction and a plurality of concave portions depressed in the metal supporting layer in the thickness direction. The plurality of concave portions forms a dot pattern. Each of the dots in dot pattern has one concave surface. The concave surface has an approximately spherical cap shape or an approximately cone shape.
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公开(公告)号：US20230007785A1
公开(公告)日：2023-01-05
申请号：US17779890
申请日：2020-11-05
发明人： Kenya TAKIMOTO , Naoki SHIBATA , Hayato TAKAKURA
IPC分类号： H05K3/28
摘要： A method for producing a wiring circuit board includes a first step, a second step, and a third step. In the first step, while a work film which is a long metal substrate having a first surface and a second surface opposite to the first surface is fed and wound by a roll-to-roll method, a composition containing a photosensitive resin is applied onto the first surface to form an insulating film, and a protective film is interposed between the second surface and the insulating film of the work film in being wound. In the second step, while the work film having undergone the first step is fed and wound by the roll-to-roll method, the protective film is peeled from the insulating film, and the insulating film is subjected to light exposure treatment to be formed with a latent image pattern. In a third step, the insulating film having undergone the second step is subjected to development treatment to be patterned.
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