公开(公告)号：US20240164017A1

公开(公告)日：2024-05-16

申请号：US18504717

申请日：2023-11-08

Applicant: NITTO DENKO CORPORATION

Inventor： Hideki MATSUI ,  Naoki SHIBATA ,  Ryosuke SASAOKA

IPC: H05K1/11 ,  H05K3/10 ,  H05K3/18 ,  H05K3/38

CPC classification number: H05K1/11 ,  H05K3/108 ,  H05K3/18 ,  H05K3/38 ,  H05K3/244 ,  H05K2201/0347 ,  H05K2201/099

Abstract: A wiring circuit board includes a first insulating layer, a conductive pattern disposed at one side of the first insulating layer in a thickness direction and having a terminal and a wire connected with the terminal, and a second insulating layer for suppressing release of the terminal from the first insulating layer. The second insulating layer has a first portion disposed at the one side of the first insulating layer in the thickness direction and a second portion disposed at one side of a peripheral edge portion of the terminal in the thickness direction and covering the peripheral edge portion.

公开(公告)号：US20240114628A1

公开(公告)日：2024-04-04

申请号：US18471046

申请日：2023-09-20

Applicant: NITTO DENKO CORPORATION

Inventor： Kenta FUKUSHIMA ,  Hayato TAKAKURA ,  Naoki SHIBATA ,  Ryosuke SASAOKA

IPC: H05K3/10 ,  H05K1/02 ,  H05K3/00 ,  H05K3/32

CPC classification number: H05K3/103 ,  H05K1/0296 ,  H05K3/0017 ,  H05K3/32 ,  H05K2201/10287

Abstract: A method for producing a wiring circuit board includes a preparation step of preparing a substrate; a first patterning step of forming a first insulating layer on one side of the substrate in a thickness direction; a second patterning step of forming a conductive pattern on one side of the first insulating layer in the thickness direction; and a deposition step of depositing a metal on the other side of the substrate in the thickness direction and forming a first metal support layer. The conductive pattern has two terminals, and two wirings. The first metal support layer has a terminal support portion supporting the terminals, a wiring support portion supporting one of the wirings, and a second wiring support portion supporting the other wiring and disposed spaced from the wiring support portion.

公开(公告)号：US20240107664A1

公开(公告)日：2024-03-28

申请号：US18471070

申请日：2023-09-20

Applicant: NITTO DENKO CORPORATION

Inventor： Kenta FUKUSHIMA ,  Hayato TAKAKURA ,  Naoki SHIBATA ,  Ryosuke SASAOKA

IPC: H05K1/02 ,  H05K3/00 ,  H05K3/10

CPC classification number: H05K1/0296 ,  H05K3/0017 ,  H05K3/10

Abstract: A method for producing a wiring circuit board includes a step of preparing a substrate; a step of forming a first insulating layer on one side of the substrate in a thickness direction; a step of forming a conductive pattern on one side of the first insulating layer in the thickness direction; a step of etching the substrate to form a first metal support layer on the other side of the first insulating layer in the thickness direction; and a step of depositing a metal on the other side of the first metal support layer in the thickness direction to form a second metal support layer. The second metal support layer has a terminal support portion supporting two terminals of the conductive pattern, a wiring support portion supporting a wiring of the conductive pattern, and a second wiring support portion supporting a second wiring of the conductive pattern.

公开(公告)号：US20220192010A1

公开(公告)日：2022-06-16

申请号：US17441918

申请日：2020-03-05

Applicant: NITTO DENKO CORPORATION

Inventor： Ryosuke SASAOKA ,  Yasunari OYABU ,  Hiroaki MACHITANI ,  Hayato TAKAKURA

IPC: H05K1/02 ,  H05K3/00

Abstract: A wiring circuit board includes an alignment mark layer. The alignment mark layer includes a first alignment mark and a second alignment mark. The condition A or the condition B is satisfied. Condition A: The first alignment mark has a first portion (a first starting point portion or a first center of gravity portion). The second alignment mark has a second portion (a second starting point portion or a second center of gravity portion). Condition B: The first alignment mark has the first portion, and the second alignment mark does not have the second portion, or the first alignment mark does not have the first portion, and the second alignment mark does not have the second portion.

公开(公告)号：US20240107683A1

公开(公告)日：2024-03-28

申请号：US18471033

申请日：2023-09-20

Applicant: NITTO DENKO CORPORATION

Inventor： Kenta FUKUSHIMA ,  Hayato TAKAKURA ,  Naoki SHIBATA ,  Ryosuke SASAOKA

IPC: H05K3/40 ,  H05K1/02 ,  H05K3/06

CPC classification number: H05K3/4007 ,  H05K1/0298 ,  H05K3/062

Abstract: A wiring circuit board includes a first insulating layer; a conductive pattern disposed on one side of the first insulating layer in a thickness direction; and a metal support layer disposed on the other side of the first insulating layer in the thickness direction. The metal support layer has a terminal support portion supporting three terminals of the conductive pattern, a wiring support portion supporting a wiring of the conductive pattern, and a second wiring support portion supporting a second wiring of the conductive pattern. A thickness of each of the wiring support portions is thinner than a thickness of the terminal support portion.

公开(公告)号：US20220386463A1

公开(公告)日：2022-12-01

申请号：US17884176

申请日：2022-08-09

Applicant: NITTO DENKO CORPORATION

Inventor： Ryosuke SASAOKA ,  Naoki SHIBATA ,  Yasunari OYABU

IPC: H05K1/14 ,  H05K3/36

Abstract: A method for producing a wiring circuit board includes a first step of preparing a wiring circuit board assembly sheet including a support sheet, a plurality of wiring circuit boards supported by the support sheet, and a joint connecting the support sheet to the plurality of wiring circuit boards, having flat-shaped one surface and the other surface facing one surface at spaced intervals thereto in a thickness direction, and having a thin portion in which the other surface is recessed toward one surface and a second step of forming a burr portion protruding toward the other side in the thickness direction and cutting the thin portion.

公开(公告)号：US20210185832A1

公开(公告)日：2021-06-17

申请号：US17265925

申请日：2019-07-12

Applicant: NITTO DENKO CORPORATION

Inventor： Ryosuke SASAOKA ,  Naoki SHIBATA ,  Yasunari OYABU

IPC: H05K3/42 ,  H05K3/10 ,  H05K3/22 ,  H05K1/02

Abstract: A method for producing a wiring circuit board includes a first step of preparing a wiring circuit board assembly sheet including a support sheet, a plurality of wiring circuit boards supported by the support sheet, and a joint connecting the support sheet to the plurality of wiring circuit boards, having flat-shaped one surface and the other surface facing one surface at spaced intervals thereto in a thickness direction, and having a thin portion in which the other surface is recessed toward one surface and a second step of forming a burr portion protruding toward the other side in the thickness direction and cutting the thin portion.

公开(公告)号：US20240164024A1

公开(公告)日：2024-05-16

申请号：US18504725

申请日：2023-11-08

Applicant: NITTO DENKO CORPORATION

Inventor： Ikuya HASHIMOTO ,  Ryosuke SASAOKA ,  Naoki SHIBATA

IPC: H05K3/10 ,  H05K1/11 ,  H05K3/00 ,  H05K3/18

CPC classification number: H05K3/108 ,  H05K1/119 ,  H05K3/002 ,  H05K3/18 ,  H05K3/28 ,  H05K2203/0723

Abstract: A method for producing a wiring circuit board includes a region setting step of setting a pattern forming region and an opening forming region in a support layer; an insulating layer forming step of forming a base insulating layer on the support layer in the pattern forming region; a pattern step of forming a conductive pattern having a first conductive layer and a second conductive layer on the base insulating layer; and an etching step of etching the support layer in the opening forming region, and in the pattern step, a dummy pattern is formed in the opening forming region.

公开(公告)号：US20240107667A1

公开(公告)日：2024-03-28

申请号：US18471063

申请日：2023-09-20

Applicant: NITTO DENKO CORPORATION

Inventor： Kenta FUKUSHIMA ,  Hayato TAKAKURA ,  Naoki SHIBATA ,  Ryosuke SASAOKA

IPC: H05K1/05 ,  H05K3/00

CPC classification number: H05K1/05 ,  H05K3/0017 ,  H05K2203/0121 ,  H05K2203/0353

Abstract: A method for producing a wiring circuit board includes a step of preparing a substrate; a step of forming a metal layer on one side of the substrate in a thickness direction; a step of forming a first insulating layer on one side of the metal layer in the thickness direction; a step of forming a conductive pattern on one side of the first insulating layer in the thickness direction; a step of removing the substrate and exposing the metal layer; and a step of depositing a metal on the other side of the metal layer in the thickness direction and forming a first metal support layer. The first metal support layer has a terminal support portion supporting two terminals of a conductive pattern, a wiring support portion supporting a wiring of the conductive pattern, and a second wiring support portion supporting a second wiring of the conductive pattern.

公开(公告)号：US20230284394A1

公开(公告)日：2023-09-07

申请号：US18176900

申请日：2023-03-01

Applicant: NITTO DENKO CORPORATION

Inventor： Naoki SHIBATA ,  Ryosuke SASAOKA

IPC: H05K3/46 ,  G03F7/039 ,  G03F7/038

CPC classification number: H05K3/4676 ,  G03F7/039 ,  G03F7/0387 ,  H05K3/4608 ,  H05K3/0023

Abstract: Provided is a method for producing a wiring circuit board capable of improving the dimensional accuracy of a second conductive layer. The wiring circuit board produced by the producing method includes a metal supporting layer, a first insulating layer disposed on one surface of the metal supporting layer in a thickness direction, a first conductive layer disposed on one surface of the first insulating layer in the thickness direction, a second insulating layer disposed on one surface of the first insulating layer in the thickness direction so as to cover the first conductive layer, and a second conductive layer disposed on one surface of the second insulating layer in the thickness direction. The producing method includes a step of forming the second insulating layer by bonding a film made of a photosensitive resin to one surfaces of the first insulating layer and the first conductive layer in the thickness direction.