公开(公告)号：US11272615B2

公开(公告)日：2022-03-08

申请号：US17057906

申请日：2019-05-10

Applicant: NITTO DENKO CORPORATION

Inventor： Naoki Shibata ,  Hiroaki Machitani ,  Yasunari Oyabu ,  Masaki Ito ,  Kenya Takimoto

IPC: H05K1/02 ,  H05K1/11

Abstract: A wiring circuit board includes an insulating layer and a conductive layer disposed on a front surface of the insulating layer. The conductive layer includes a first wiring, a first terminal electrically connected to the first wiring, a second wiring independent of the first wiring and having a thick thickness T2 with respect to a thickness T1 of the first wiring, and a second terminal electrically connected to the second wiring. The surfaces of the first terminal and the second terminal are disposed at generally the same position in a thickness direction.

公开(公告)号：US12035484B2

公开(公告)日：2024-07-09

申请号：US17610060

申请日：2020-03-31

Applicant: NITTO DENKO CORPORATION

Inventor： Kenya Takimoto ,  Naoki Shibata ,  Hayato Takakura

IPC: H05K3/44 ,  H05K1/11

CPC classification number: H05K3/445 ,  H05K1/115 ,  H05K2201/09563 ,  H05K2203/0323 ,  H05K2203/0723

Abstract: A wiring circuit board includes a metal support layer, a base insulating layer disposed on one side in a thickness direction of the metal support layer, and a conductive layer disposed on one side in the thickness direction of the base insulating layer, and including a first terminal and a ground lead residual portion electrically connected to the first terminal. The base insulating layer has a through hole penetrating in the thickness direction. The ground lead residual portion has an opening continuous so as to surround the through hole.

公开(公告)号：US12289830B2

公开(公告)日：2025-04-29

申请号：US18163071

申请日：2023-02-01

Applicant: NITTO DENKO CORPORATION

Inventor： Hayato Takakura ,  Naoki Shibata ,  Kenya Takimoto ,  Chihiro Watanabe

IPC: H05K1/05

Abstract: A wiring circuit board includes a metal supporting layer, an insulating base layer, and a wiring layer. The wiring circuit board further includes a plurality of streak groove portions disposed on one surface of the metal supporting layer in the thickness direction and a plurality of concave portions depressed in the metal supporting layer in the thickness direction. The plurality of concave portions forms a dot pattern. Each of the dots in the dot pattern has one concave surface. The concave surface has an approximately spherical cap shape or an approximately cone shape.

公开(公告)号：US11284503B2

公开(公告)日：2022-03-22

申请号：US17057912

申请日：2019-05-10

Applicant: NITTO DENKO CORPORATION

Inventor： Masaki Ito ,  Naoki Shibata ,  Yasunari Oyabu ,  Kenya Takimoto

IPC: H05K1/00 ,  H05K1/02 ,  H05K1/09 ,  H05K1/11 ,  H05K1/18 ,  H05K3/20 ,  H05K3/28 ,  H05K3/38 ,  H05K3/44 ,  H05K7/00 ,  H05K7/20 ,  H05K1/05 ,  H05K3/10

Abstract: A wiring circuit board includes a support metal layer having thermal conductivity of 5 W/m·K or more, an insulating layer disposed on at least one side in a thickness direction of the support metal layer, a wiring layer disposed on a front surface of the insulating layer, a protective metal film disposed on the entire surface of the support metal layer between the support metal layer and the insulating layer, and a protective thin film disposed on an exposed surface exposed from the protective metal film in the support metal layer.