公开(公告)号：US11272615B2

公开(公告)日：2022-03-08

申请号：US17057906

申请日：2019-05-10

Applicant: NITTO DENKO CORPORATION

Inventor： Naoki Shibata ,  Hiroaki Machitani ,  Yasunari Oyabu ,  Masaki Ito ,  Kenya Takimoto

IPC: H05K1/02 ,  H05K1/11

Abstract: A wiring circuit board includes an insulating layer and a conductive layer disposed on a front surface of the insulating layer. The conductive layer includes a first wiring, a first terminal electrically connected to the first wiring, a second wiring independent of the first wiring and having a thick thickness T2 with respect to a thickness T1 of the first wiring, and a second terminal electrically connected to the second wiring. The surfaces of the first terminal and the second terminal are disposed at generally the same position in a thickness direction.

公开(公告)号：US11647269B2

公开(公告)日：2023-05-09

申请号：US16756253

申请日：2018-10-02

Applicant: NITTO DENKO CORPORATION

Inventor： Shusaku Shibata ,  Hayato Takakura ,  Yoshihiro Kawamura ,  Masaki Ito ,  Shuichi Wakaki

IPC: H04N5/225 ,  H01L27/146 ,  H04N5/369

CPC classification number: H04N5/2253 ,  H01L27/14636 ,  H04N5/369

Abstract: An imaging element-mounting board includes a board area having a board disposed and a plurality of reinforcement portions disposed around the board area. The plurality of reinforcement portions are independent from each other.

公开(公告)号：US11297711B2

公开(公告)日：2022-04-05

申请号：US16644781

申请日：2018-09-05

Applicant: NITTO DENKO CORPORATION

Inventor： Yoshihiro Kawamura ,  Shusaku Shibata ,  Hayato Takakura ,  Masaki Ito

IPC: H05K1/02 ,  H05K1/03 ,  H05K3/46

Abstract: A wiring circuit board sequentially includes a conductive layer, an insulating layer, and a shield layer toward one side in a thickness direction. The insulating layer covers the conductive layer and has an insulating opening portion exposing a part of a one-side surface in the thickness direction of the conductive layer, and the shield layer has a recessed portion disposed at the inside of the insulating opening portion and recessed toward the other side in the thickness direction so as to be in contact with the conductive layer. The shield layer sequentially includes an adhesive layer and a main body layer toward one side in the thickness direction. A ratio (Tb/Ta) of a thickness Tb of the main body layer to a thickness Ta of the adhesive layer is 4 or more.

公开(公告)号：US11058002B2

公开(公告)日：2021-07-06

申请号：US16649825

申请日：2018-09-06

Applicant: NITTO DENKO CORPORATION

Inventor： Shusaku Shibata ,  Hayato Takakura ,  Masaki Ito ,  Yoshihiro Kawamura ,  Shuichi Wakaki

IPC: H05K3/02 ,  H05K1/18 ,  H05K1/11 ,  H05K3/00 ,  H05K3/42 ,  H05K3/46

Abstract: A method for producing a wired circuit board, the method including the steps of: a first step of providing an insulating layer having an opening penetrating in the thickness direction at one side surface in the thickness direction of the metal plate, a second step of providing a first barrier layer at one side surface in the thickness direction of the metal plate exposed from the opening by plating, a third step of providing a second barrier layer continuously at one side in the thickness direction of the first barrier layer and an inner surface of the insulating layer facing the opening, a fourth step of providing a conductor layer so as to contact the second barrier layer, and a fifth step of removing the metal plate by etching.

公开(公告)号：US11627661B2

公开(公告)日：2023-04-11

申请号：US17338130

申请日：2021-06-03

Applicant: NITTO DENKO CORPORATION

Inventor： Shusaku Shibata ,  Hayato Takakura ,  Masaki Ito ,  Yoshihiro Kawamura ,  Shuichi Wakaki

IPC: H05K1/18 ,  H05K1/11 ,  H05K3/00 ,  H05K3/42 ,  H05K3/46

Abstract: A method for producing a wired circuit board, the method including the steps of: a first step of providing an insulating layer having an opening penetrating in the thickness direction at one side surface in the thickness direction of the metal plate, a second step of providing a first barrier layer at one side surface in the thickness direction of the metal plate exposed from the opening by plating, a third step of providing a second barrier layer continuously at one side in the thickness direction of the first barrier layer and an inner surface of the insulating layer facing the opening, a fourth step of providing a conductor layer so as to contact the second barrier layer, and a fifth step of removing the metal plate by etching.

公开(公告)号：US11284503B2

公开(公告)日：2022-03-22

申请号：US17057912

申请日：2019-05-10

Applicant: NITTO DENKO CORPORATION

Inventor： Masaki Ito ,  Naoki Shibata ,  Yasunari Oyabu ,  Kenya Takimoto

IPC: H05K1/00 ,  H05K1/02 ,  H05K1/09 ,  H05K1/11 ,  H05K1/18 ,  H05K3/20 ,  H05K3/28 ,  H05K3/38 ,  H05K3/44 ,  H05K7/00 ,  H05K7/20 ,  H05K1/05 ,  H05K3/10

Abstract: A wiring circuit board includes a support metal layer having thermal conductivity of 5 W/m·K or more, an insulating layer disposed on at least one side in a thickness direction of the support metal layer, a wiring layer disposed on a front surface of the insulating layer, a protective metal film disposed on the entire surface of the support metal layer between the support metal layer and the insulating layer, and a protective thin film disposed on an exposed surface exposed from the protective metal film in the support metal layer.

公开(公告)号：US11183448B2

公开(公告)日：2021-11-23

申请号：US16607612

申请日：2018-04-23

Applicant: NITTO DENKO CORPORATION

Inventor： Hayato Takakura ,  Shuichi Wakaki ,  Shusaku Shibata ,  Yoshihiro Kawamura ,  Masaki Ito

IPC: H01L23/498 ,  H01L27/146 ,  H01L23/552 ,  H01L23/00 ,  H01L21/48 ,  H04N5/225

Abstract: A wiring circuit board includes a first insulating layer, a terminal, a second insulating layer disposed at one side in a thickness direction of the terminal, and a wire continuous to the terminal in a direction crossing the thickness direction. The first insulating layer has an opening portion passing through the first insulating layer in the thickness direction and having the opening cross-sectional area increasing as being closer to one side in the thickness direction. The terminal has a peripheral end portion and a solid portion. The peripheral end portion contacts with an inner side surface of the first insulating layer. The inner side surface forms the opening portion. The solid portion integrally disposed with the peripheral end portion at the inner side of the peripheral end portion. The peripheral end portion and the solid portion fill the entire opening portion.