公开(公告)号：US10034388B2

公开(公告)日：2018-07-24

申请号：US15664300

申请日：2017-07-31

Applicant: NITTO DENKO CORPORATION

Inventor： Takatoshi Sakakura ,  Tomoaki Okuno ,  Takahiro Takano

IPC: H05K1/18 ,  H05K3/34 ,  H05K1/02

Abstract: A suspension board with circuit includes a metal supporting layer, a base insulating layer disposed at one side in a thickness direction of the metal supporting layer, a conductive pattern including a wire disposed at one side in the thickness direction of the base insulating layer and a terminal exposed from the metal supporting layer and the base insulating layer when viewed from the other side in the thickness direction, a piezoelectric element disposed at the other side in the thickness direction with respect to the terminal and including an element terminal electrically connected to the terminal, and a solder layer disposed between the terminal and the element terminal. The solder layer has a solder composition containing Sn, Ag, and Cu, and the solder layer has a thickness in the thickness direction of 50 μm or less.

公开(公告)号：US10187991B2

公开(公告)日：2019-01-22

申请号：US15664280

申请日：2017-07-31

Applicant: NITTO DENKO CORPORATION

Inventor： Takatoshi Sakakura ,  Tomoaki Okuno

IPC: H05K1/18 ,  H05K1/16 ,  H01L41/047 ,  H05K3/10 ,  H05K3/40 ,  G11B5/00 ,  H05K1/05 ,  H05K3/34

Abstract: A suspension board with circuit includes a metal supporting layer, a base insulating layer, a conductive pattern including a wire, and a cover insulating layer. The conductive pattern includes a terminal for being connected to a piezoelectric element, connected to the wire, and disposed next to the base insulating layer in a direction perpendicular to the thickness direction. The terminal is exposed from the metal supporting layer and the base insulating layer when viewed from the other side in the thickness direction, and extends along the direction perpendicular to the thickness direction so as to go away from the base insulating layer next thereto. At least a portion of a peripheral end surface of the terminal is covered with the cover insulating layer.

公开(公告)号：US08917483B2

公开(公告)日：2014-12-23

申请号：US14230772

申请日：2014-03-31

Applicant: Nitto Denko Corporation

Inventor： Yuu Sugimoto ,  Takatoshi Sakakura

IPC: G11B5/48 ,  G11B5/84

CPC classification number: G11B5/484 ,  G11B5/4846 ,  G11B5/84 ,  Y10T29/49071 ,  Y10T156/10

Abstract: First and second laminated structures are respectively formed at one surface and the other surface of an insulating layer. A laminate is formed of the first laminated structure, the insulating layer and the second laminated structure. A heat-assisted wiring trace is included in the first laminated structure, and a support substrate and a connection terminal are included in the second laminated structure. The surface of the connection terminal is exposed at the other surface of the insulating layer. A first portion of the laminate including the connection terminal has a thickness smaller than the thickness of second and third portions of the laminate including portions on both sides of the connection terminal.

Abstract translation: 第一和第二层压结构分别形成在绝缘层的一个表面和另一个表面上。 由第一层叠结构，绝缘层和第二层叠结构形成层压体。 在第一层压结构中包括热辅助布线，并且在第二层叠结构中包括支撑基板和连接端子。 连接端子的表面在绝缘层的另一个表面露出。 包括连接端子的层压体的第一部分的厚度小于包括连接端子两侧部分的层压体的第二和第三部分的厚度。

公开(公告)号：US10225930B2

公开(公告)日：2019-03-05

申请号：US14753433

申请日：2015-06-29

Applicant: NITTO DENKO CORPORATION

Inventor： Daisuke Yamauchi ,  Takatoshi Sakakura

IPC: G11B5/127 ,  H04R31/00 ,  H05K1/05 ,  H05K3/00 ,  H05K3/02 ,  H05K3/44 ,  G11B5/48 ,  H05K3/06

Abstract: A method of producing a suspension board with circuit includes the steps of preparing a metal supporting layer, forming a curable insulating layer on the metal supporting layer using a photosensitive curable insulating composition such that an opening is formed in the curable insulating layer, curing the curable insulating layer to form an insulating layer, subjecting the metal supporting layer exposed from the opening to microwave plasma treatment, and forming a metal conducting portion on the metal supporting layer exposed from the opening.

公开(公告)号：US09721599B2

公开(公告)日：2017-08-01

申请号：US14730557

申请日：2015-06-04

Applicant: NITTO DENKO CORPORATION

Inventor： Takatoshi Sakakura

IPC: H05K1/11 ,  H05K1/18 ,  G11B5/48 ,  H05K3/40 ,  H05K1/05

CPC classification number: G11B5/4853 ,  G11B5/483 ,  G11B5/486 ,  G11B5/4873 ,  H05K1/056 ,  H05K1/11 ,  H05K1/183 ,  H05K3/4007 ,  H05K3/4644 ,  H05K2201/10083

Abstract: A suspension board with circuit includes a metal supporting board, an insulating base layer formed on one side of the metal supporting board in a thickness direction thereof, a conductive layer, and an insulating cover layer formed on the one side of the insulating base layer to cover the conductive layer. Either one of the insulating base layer and the insulating cover layer includes an opening extending therethrough in the thickness direction. The conductive layer includes a wire formed on the one side of the insulating base layer, and a connection terminal electrically connected to the wire and exposed from the opening to be capable of electrical connection to an electronic element. The suspension board with circuit further includes a protective layer for protecting the connection terminal exposed from the opening.