公开(公告)号：US20160189984A1

公开(公告)日：2016-06-30

申请号：US15061807

申请日：2016-03-04

Applicant: NORDSON CORPORATION

Inventor： Alec J. Babiarz ,  Horatio Quinones ,  Thomas L. Ratledge ,  Jiangang Zhao

IPC: H01L21/56 ,  H01L21/324

CPC classification number: B23K37/00 ,  H01L21/324 ,  H01L21/563 ,  H01L24/27 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/92125 ,  H01L2924/01029 ,  H05K13/0465 ,  H01L2924/00 ,  H01L2924/3512

Abstract: Methods for applying an underfill with vacuum assistance. The method includes receiving a substrate with the surface at least partially covered by a glass-like film that has a top surface of reduced roughness relative to the surface of the substrate, providing the underfill on the top surface of the glass-like film along an exterior edge of the electronic device, evacuating the space to provide a vacuum condition in the open portion of the space, and heating the underfill to cause flow of the underfill toward the exterior edge and into the open portion of the space, wherein the glass-like film reduces trapping of gas under the underfill.

Abstract translation: 在真空辅助下应用底部填充物的方法。 所述方法包括：接收基材，所述表面至少部分被玻璃状薄膜覆盖，所述玻璃状薄膜相对于所述基材的表面具有减小的粗糙度的顶表面，从而沿着所述玻璃状薄膜的顶表面提供底部填充物 电子装置的外边缘，抽空空间以在空间的开口部分提供真空状态，并且加热底部填充物以使底部填充物流向外部边缘并进入空间的开口部分，其中， 类似的膜减少了在底部填料下的气体捕获。

公开(公告)号：US20140183248A1

公开(公告)日：2014-07-03

申请号：US14215559

申请日：2014-03-17

Applicant: NORDSON CORPORATION

Inventor： Alec J. Babiarz ,  Horatio Quinones ,  Thomas L. Ratledge ,  Jiangang Zhao

IPC: B23K37/00 ,  H05K13/04

CPC classification number: H01L21/563 ,  B23K37/00 ,  H01L21/324 ,  H01L24/27 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/92125 ,  H01L2924/01029 ,  H05K13/0465 ,  H01L2924/00 ,  H01L2924/3512

Abstract: Methods for applying an underfill with vacuum assistance. The method may include dispensing the underfill onto a substrate proximate to at least one exterior edge of an electronic device attached to the substrate. A space between the electronic device and the substrate is evacuated through at least one gap in the underfill. The method further includes heating the underfill to cause the underfill to flow into the space. Because a vacuum condition is supplied in the open portion of the space before flow is initiated, the incidence of underfill voiding is lowered.

Abstract translation: 在真空辅助下应用底部填充物的方法。 该方法可以包括将底部填充物分配到靠近附接到衬底的电子设备的至少一个外部边缘的衬底上。 电子设备和基板之间的空间通过底部填充物中的至少一个间隙被排出。 该方法还包括加热底部填充物以使底部填充物流入空间。 因为在开始流动之前在空间的开放部分中提供真空条件，所以底部填充排泄的发生率降低。

公开(公告)号：US09314882B2

公开(公告)日：2016-04-19

申请号：US14215559

申请日：2014-03-17

Applicant: Nordson Corporation

Inventor： Alec J. Babiarz ,  Horatio Quinones ,  Thomas L. Ratledge ,  Jiangang Zhao

IPC: H01L21/00 ,  B23K37/00 ,  H01L21/56 ,  H01L23/00 ,  H05K13/04

CPC classification number: H01L21/563 ,  B23K37/00 ,  H01L21/324 ,  H01L24/27 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/92125 ,  H01L2924/01029 ,  H05K13/0465 ,  H01L2924/00 ,  H01L2924/3512

Abstract: Methods for applying an underfill with vacuum assistance. The method may include dispensing the underfill onto a substrate proximate to at least one exterior edge of an electronic device attached to the substrate. A space between the electronic device and the substrate is evacuated through at least one gap in the underfill. The method further includes heating the underfill to cause the underfill to flow into the space. Because a vacuum condition is supplied in the open portion of the space before flow is initiated, the incidence of underfill voiding is lowered.

Abstract translation: 在真空辅助下应用底部填充物的方法。 该方法可以包括将底部填充物分配到靠近附接到衬底的电子设备的至少一个外部边缘的衬底上。 电子设备和基板之间的空间通过底部填充物中的至少一个间隙被排出。 该方法还包括加热底部填充物以使底部填充物流入空间。 因为在开始流动之前在空间的开放部分中提供真空条件，所以底部填充排泄的发生率降低。