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    METHODS FOR VACUUM ASSISTED UNDERFILLING
    2.
    发明申请
    METHODS FOR VACUUM ASSISTED UNDERFILLING 审中-公开
    真空辅助方法

    公开(公告)号：US20160189984A1

    公开(公告)日：2016-06-30

    申请号：US15061807

    申请日：2016-03-04

    申请人： NORDSON CORPORATION

    发明人： Alec J. Babiarz ,  Horatio Quinones ,  Thomas L. Ratledge ,  Jiangang Zhao

    IPC分类号： H01L21/56 ,  H01L21/324

    CPC分类号： B23K37/00 ,  H01L21/324 ,  H01L21/563 ,  H01L24/27 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/92125 ,  H01L2924/01029 ,  H05K13/0465 ,  H01L2924/00 ,  H01L2924/3512

    摘要： Methods for applying an underfill with vacuum assistance. The method includes receiving a substrate with the surface at least partially covered by a glass-like film that has a top surface of reduced roughness relative to the surface of the substrate, providing the underfill on the top surface of the glass-like film along an exterior edge of the electronic device, evacuating the space to provide a vacuum condition in the open portion of the space, and heating the underfill to cause flow of the underfill toward the exterior edge and into the open portion of the space, wherein the glass-like film reduces trapping of gas under the underfill.

    摘要翻译： 在真空辅助下应用底部填充物的方法。 所述方法包括：接收基材，所述表面至少部分被玻璃状薄膜覆盖，所述玻璃状薄膜相对于所述基材的表面具有减小的粗糙度的顶表面，从而沿着所述玻璃状薄膜的顶表面提供底部填充物 电子装置的外边缘，抽空空间以在空间的开口部分提供真空状态，并且加热底部填充物以使底部填充物流向外部边缘并进入空间的开口部分，其中， 类似的膜减少了在底部填料下的气体捕获。

    METHODS FOR VACUUM ASSISTED UNDERFILLING
    3.
    发明申请
    METHODS FOR VACUUM ASSISTED UNDERFILLING 有权
    真空辅助方法

    公开(公告)号：US20140183248A1

    公开(公告)日：2014-07-03

    申请号：US14215559

    申请日：2014-03-17

    申请人： NORDSON CORPORATION

    发明人： Alec J. Babiarz ,  Horatio Quinones ,  Thomas L. Ratledge ,  Jiangang Zhao

    IPC分类号： B23K37/00 ,  H05K13/04

    CPC分类号： H01L21/563 ,  B23K37/00 ,  H01L21/324 ,  H01L24/27 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/92125 ,  H01L2924/01029 ,  H05K13/0465 ,  H01L2924/00 ,  H01L2924/3512

    摘要： Methods for applying an underfill with vacuum assistance. The method may include dispensing the underfill onto a substrate proximate to at least one exterior edge of an electronic device attached to the substrate. A space between the electronic device and the substrate is evacuated through at least one gap in the underfill. The method further includes heating the underfill to cause the underfill to flow into the space. Because a vacuum condition is supplied in the open portion of the space before flow is initiated, the incidence of underfill voiding is lowered.

    摘要翻译： 在真空辅助下应用底部填充物的方法。 该方法可以包括将底部填充物分配到靠近附接到衬底的电子设备的至少一个外部边缘的衬底上。 电子设备和基板之间的空间通过底部填充物中的至少一个间隙被排出。 该方法还包括加热底部填充物以使底部填充物流入空间。 因为在开始流动之前在空间的开放部分中提供真空条件，所以底部填充排泄的发生率降低。

    MODULAR JETTING DEVICES
    4.
    发明申请
    MODULAR JETTING DEVICES 有权
    模块化喷射装置

    公开(公告)号：US20160221022A1

    公开(公告)日：2016-08-04

    申请号：US15095872

    申请日：2016-04-11

    申请人： NORDSON CORPORATION

    发明人： Stanley Cruz Aguilar ,  Mani Ahmadi ,  Stephen Russell des Jardins ,  Erik Fiske ,  Mark Meier ,  Horatio Quinones ,  Thomas L. Ratledge ,  Robert James Wright

    IPC分类号： B05C5/02 ,  B05C11/10

    CPC分类号： B05C5/0225 ,  B05B1/304 ,  B05B1/3046 ,  B05B15/65 ,  B05C5/02 ,  B05C5/0237 ,  B05C5/027 ,  B05C5/0291 ,  B05C11/1002 ,  B05C11/1013 ,  B05C11/1034 ,  F16K31/1221

    摘要： A jetting device and/or fluid module includes a nozzle with a fluid outlet, a body including a fluid chamber and a fluid inlet in fluid communication with the fluid chamber, and a valve seat disposed in the fluid chamber, where the valve seat includes an opening in fluid communication with the fluid outlet. The jetting device also includes a movable element having a top portion and a bottom portion, where the top portion is disposed external to the fluid chamber and arranged to be contacted by a reciprocating drive pin, and where the bottom portion is disposed within the fluid chamber. Finally, the jetting device also includes a sealing member contacting the movable element between the top portion and the bottom portion, where the sealing member also contacts the body, and defines a portion of a boundary of the fluid chamber to seal the fluid chamber

    摘要翻译： 喷射装置和/或流体模块包括具有流体出口的喷嘴，包括流体室的主体和与流体室流体连通的流体入口，以及设置在流体室中的阀座，其中阀座包括一个 打开与流体出口流体连通。 喷射装置还包括具有顶部和底部的可移动元件，其中顶部设置在流体室外部并且布置成与往复驱动销接触，并且其中底部设置在流体室内 。 最后，喷射装置还包括在顶部和底部之间接触可移动元件的密封构件，密封构件也与主体接触，并且限定流体室的边界的一部分以密封流体室

    FLOW METERING FOR DISPENSE MONITORING AND CONTROL
    5.
    发明申请
    FLOW METERING FOR DISPENSE MONITORING AND CONTROL 有权
    流量监测用于监控和控制

    公开(公告)号：US20160005668A1

    公开(公告)日：2016-01-07

    申请号：US14855487

    申请日：2015-09-16

    申请人： NORDSON CORPORATION

    发明人： Joseph E. Donner ,  Michael Gorman ,  Christopher L. Giusti ,  Alan R. Lewis ,  Horatio Quinones ,  Thomas L. Ratledge ,  Yuriy Suhinin

    IPC分类号： H01L21/66 ,  G01G17/06 ,  H01L21/56 ,  G01F1/00

    CPC分类号： H01L22/26 ,  B05B15/50 ,  B05C5/0225 ,  B05C11/1013 ,  B05C11/1034 ,  G01F1/00 ,  G01G17/06 ,  H01L21/563

    摘要： Methods and systems of accurately dispensing a viscous fluid onto a substrate. In an embodiment, a method includes using an electronic flow meter device to produce electrical flow meter output signals and performing a responsive control function in a closed loop manner by adjusting at least one dispensing parameter to correct for a difference between an output data set and a reference data set. In another embodiment, a system includes a control operatively coupled to a gas flow meter device and to a weigh scale allowing for a density of an amount of viscous material to be determined. In another embodiment, a method includes using a control coupled to both a gas flow meter device and a weigh scale and performing a responsive control function in a closed loop manner by adjusting at least one dispensing parameter using gas flow meter output signals and weigh scale output signals.

    摘要翻译： 将粘性流体精确分配到基材上的方法和系统。 在一个实施例中，一种方法包括使用电子流量计装置来产生电流量计输出信号并以闭环方式执行响应控制功能，通过调整至少一个分配参数来校正输出数据组和 参考数据集。 在另一个实施例中，系统包括可操作地耦合到气体流量计装置的控制器和允许确定一定量的粘性材料的密度的称重秤。 在另一个实施例中，一种方法包括使用耦合到气体流量计装置和称重秤的控制并且以闭环方式执行响应控制功能，通过使用气体流量计输出信号和称重输出信号调节至少一个分配参数 信号。

    METHODS FOR CONTINUOUSLY MOVING A FLUID DISPENSER WHILE DISPENSING AMOUNTS OF A FLUID MATERIAL
    6.
    发明申请
    METHODS FOR CONTINUOUSLY MOVING A FLUID DISPENSER WHILE DISPENSING AMOUNTS OF A FLUID MATERIAL 有权
    流体分配器中流体分配器连续移动的方法

    公开(公告)号：US20140248421A1

    公开(公告)日：2014-09-04

    申请号：US14280032

    申请日：2014-05-16

    申请人： Nordson Corporation

    发明人： Ronald N. Abernathy ,  Clifford A. Fowler ,  Philip P. Maiorca ,  Horatio Quinones ,  Thomas L. Ratledge

    IPC分类号： H05K3/00

    CPC分类号： B05B12/084 ,  H05K1/0269 ,  H05K3/0005 ,  H05K3/0008 ,  H05K3/125 ,  H05K13/0465 ,  H05K2203/0126 ,  H05K2203/013 ,  H05K2203/163

    摘要： Methods for applying fluid materials to a substrate, such as circuit board, while continuously moving the fluid dispenser. Some methods generally involve correcting the dispense location for each of the dispensed amounts of fluid material by executing a statistical comparison of either the predicted and actual landing locations on the substrate, or the predicted and actual positions of the dispenser at each of the dispense locations. Other methods generally involve initiating the dispensing of amounts of the fluid material at dispense locations corrected by a correction factor specified in terms of the servo cycle for the movement of the dispenser or by a correction factor specified in terms of partial servo cycles courtesy of a timer.

    摘要翻译： 在流体分配器连续移动的同时将流体材料施加到诸如电路板的基底上的方法。 一些方法通常包括通过执行基板上的预测和实际着陆位置的统计比较，或在每个分配位置处的分配器的预测位置和实际位置来校正每个分配量的流体材料的分配位置。 其他方法通常包括在通过针对分配器的运动的伺服循环所指定的校正因子校正的分配位置处引发流体材料的量的分配，或通过由计时器提供的部分伺服循环所指定的校正因子 。

    Methods for continuously moving a fluid dispenser while dispensing amounts of a fluid material
    7.
    发明授权
    Methods for continuously moving a fluid dispenser while dispensing amounts of a fluid material 有权

    公开(公告)号：US10646889B2

    公开(公告)日：2020-05-12

    申请号：US15589920

    申请日：2017-05-08

    申请人： NORDSON CORPORATION

    发明人： Ronald N. Abernathy ,  Clifford A. Fowler ,  Phillip P. Maiorca ,  Horatio Quinones ,  Thomas L. Ratledge

    IPC分类号： C23C16/52 ,  B05B12/08 ,  H05K13/04 ,  H05K3/00 ,  H05K3/12 ,  H05K1/02

    摘要： Methods for applying fluid materials to a substrate, such as circuit board, while continuously moving the fluid dispenser are disclosed. Initially, a dispenser is continuously moved through a constant motion trajectory connecting the plurality of dispense locations on the substrate. The electrical output signals generated by one or more of encoders of the dispenser are monitored as the dispenser is continuously moved through the constant motion trajectory. The dispenser is triggered at each of the plurality of dispense locations and droplets of the fluid material are jetted while continuously moving the dispenser. The spatial coordinates of each droplet of the fluid material on the substrate are measured and compared to expected landing coordinates for each droplet of the fluid material to generate a spatial error for each droplet of the fluid material. At least one dispense location is corrected and an updated constant motion trajectory is generated.