公开(公告)号：US09780270B2

公开(公告)日：2017-10-03

申请号：US14292069

申请日：2014-05-30

Applicant: Nthdegree Technologies Worldwide Inc.

Inventor： Eric William Kahrs ,  Bradley Steven Oraw

IPC: G09F13/04 ,  H01L33/58 ,  F21V33/00 ,  H01L25/075 ,  F21K9/65

CPC classification number: H01L33/58 ,  F21K9/65 ,  F21V33/0052 ,  H01L25/0753 ,  H01L2224/32245 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An initially flat light sheet is formed by printing conductor layers and microscopic LEDs over a flexible substrate to connect the LEDs in parallel. The light sheet is then subjected to a molding process which forms 3-dimensional features in the light sheet, such as bumps of any shape. The features may be designed to create a desired light emission profile, increase light extraction, and/or create graphical images. In one embodiment, an integrated light sheet and touch sensor is formed, where the molded features convey touch positions of the sensor. In one embodiment, a curable resin is applied to the light sheet to fix the molded features. In another embodiment, optical features are molded over the flat light sheet. In another embodiment, each molded portion of the light sheet forms a separate part that is then singulated from the light sheet.

公开(公告)号：US20140230207A1

公开(公告)日：2014-08-21

申请号：US14177632

申请日：2014-02-11

Applicant: NTHDEGREE TECHNOLOGIES WORLDWIDE INC.

Inventor： Bradley Steven Oraw ,  Bemly Sujeewa Randeniya ,  Eric William Kahrs

IPC: H05K3/04

CPC classification number: H05K3/048 ,  H05K3/046 ,  H05K2203/0228 ,  H05K2203/0522 ,  H05K2203/1545 ,  Y10T29/302 ,  Y10T156/1082

Abstract: A flex-circuit or a rigid printed circuit board is formed by depositing an adhesive pattern on a top surface of a substrate. The adhesive pattern corresponds to a copper foil pattern to be formed for interconnecting electronic components. A thin copper foil is then laminated over the substrate to adhere the foil to the adhesive pattern. The foil is then peeled off the substrate such that the foil overlying the adhesive pattern remains, and the foil that is not overlying the adhesive pattern is removed. In one embodiment, the foil is cut or weakened along the edges of the adhesive pattern to minimize tearing of the foil. The foil may be first affixed to a sheet for increased mechanical integrity, prior to the foil being laminated over the substrate, followed by kiss-cutting the foil while on the sheet to avoid tearing of the foil during the lift-off step.

Abstract translation: 柔性电路或刚性印刷电路板通过在基板的顶表面上沉积粘合剂图案而形成。 粘合剂图案对应于要形成的用于互连电子部件的铜箔图案。 然后将薄铜箔层压在基板上以将箔粘附到粘合剂图案上。 然后将箔从基材上剥下，使得覆盖粘合剂图案的箔片保留，并且不覆盖粘合剂图案的箔被去除。 在一个实施例中，箔沿着粘合剂图案的边缘被切割或削弱，以最小化箔的撕裂。 在箔被层压在基材上之前，箔可以首先固定到片材上以增加机械完整性，然后在片材上亲吻切割箔片，以避免在剥离步骤期间撕裂箔片。

公开(公告)号：US20140355251A1

公开(公告)日：2014-12-04

申请号：US14292069

申请日：2014-05-30

Applicant: Nthdegree Technologies Worldwide Inc.

Inventor： Eric William Kahrs ,  Bradley Steven Oraw

IPC: F21K99/00 ,  H01L33/58 ,  F21V33/00

CPC classification number: H01L33/58 ,  F21K9/65 ,  F21V33/0052 ,  H01L25/0753 ,  H01L2224/32245 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An initially flat light sheet is formed by printing conductor layers and microscopic LEDs over a flexible substrate to connect the LEDs in parallel. The light sheet is then subjected to a molding process which forms 3-dimensional features in the light sheet, such as bumps of any shape. The features may be designed to create a desired light emission profile, increase light extraction, and/or create graphical images. In one embodiment, an integrated light sheet and touch sensor is formed, where the molded features convey touch positions of the sensor. In one embodiment, a curable resin is applied to the light sheet to fix the molded features. In another embodiment, optical features are molded over the flat light sheet. In another embodiment, each molded portion of the light sheet forms a separate part that is then singulated from the light sheet.

Abstract translation: 通过在柔性基板上印刷导体层和微观LED以平行地连接LED来形成初始平坦的光片。 然后对光片进行在光片中形成三维特征的成型工艺，例如任何形状的凸块。 特征可以被设计成产生期望的发光轮廓，增加光提取和/或创建图形图像。 在一个实施例中，形成集成的光片和触摸传感器，其中模制特征传送传感器的触摸位置。 在一个实施例中，将可固化树脂施加到光片以固定模制特征。 在另一个实施例中，光学特征被模制在平面光板上。 在另一个实施例中，光片的每个模制部分形成一个单独的部分，然后从光片中分离。