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公开(公告)号:US20230197797A1
公开(公告)日:2023-06-22
申请号:US17645280
申请日:2021-12-20
Applicant: NXP B.V.
Inventor: Congyong Zhu , Bernhard Grote , Bruce McRae Green
IPC: H01L29/40 , H01L29/20 , H01L29/778 , H01L21/311 , H01L21/76 , H01L21/765 , H01L29/66
CPC classification number: H01L29/402 , H01L21/765 , H01L21/7605 , H01L21/31116 , H01L29/2003 , H01L29/7786 , H01L29/66462
Abstract: Placement of a field plate in a field-effect transistor is optimized by using multiple dielectric layers such that a first end of field plate is separated from a channel region of the transistor by a first set of one or more distinct dielectric material layers. A second end of the field plate overlies the channel region and a control electrode from which it is separated by the first set of dielectric layers and one or more additional dielectric layers.
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公开(公告)号:US20220208975A1
公开(公告)日:2022-06-30
申请号:US17139636
申请日:2020-12-31
Applicant: NXP B.V.
Inventor: Ibrahim Khalil , Bernhard Grote , Humayun Kabir , Bruce McRae Green
Abstract: An embodiment of a semiconductor device includes a semiconductor substrate, a first dielectric layer disposed over the upper surface of the semiconductor substrate, and a first current-carrying electrode and a second current-carrying electrode formed over the semiconductor substrate within openings formed in the first dielectric layer. A control electrode is formed over the semiconductor substrate and disposed between the first current-carrying electrode and a second current-carrying electrode and over the first dielectric layer. A first conductive element is formed over the first dielectric layer, adjacent the control electrode and between the control electrode and the second current-carrying electrode. A second dielectric layer is disposed over the control electrode and over the first conductive element. A second conductive element is disposed over the second dielectric layer and over the first conductive element.
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公开(公告)号:US12148820B2
公开(公告)日:2024-11-19
申请号:US17645286
申请日:2021-12-20
Applicant: NXP B.V.
Inventor: Congyong Zhu , Bernhard Grote , Bruce McRae Green
IPC: H01L29/778 , H01L29/20 , H01L29/66
Abstract: Placement of a field plate in a field-effect transistor is optimized by using multiple dielectric layers such that a first end of field plate is separated from a channel region of the transistor by a first set of one or more distinct dielectric material layers. A second end of the field plate overlies the channel region and a control electrode from which it is separated by the first set of dielectric layers and one or more additional dielectric layers.
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公开(公告)号:US11923424B2
公开(公告)日:2024-03-05
申请号:US17139636
申请日:2020-12-31
Applicant: NXP B.V.
Inventor: Ibrahim Khalil , Bernhard Grote , Humayun Kabir , Bruce McRae Green
CPC classification number: H01L29/402 , H01L29/0649 , H01L29/2003 , H01L29/205 , H01L29/404 , H01L29/66462 , H01L29/78
Abstract: An embodiment of a semiconductor device includes a semiconductor substrate, a first dielectric layer disposed over the upper surface of the semiconductor substrate, and a first current-carrying electrode and a second current-carrying electrode formed over the semiconductor substrate within openings formed in the first dielectric layer. A control electrode is formed over the semiconductor substrate and disposed between the first current-carrying electrode and a second current-carrying electrode and over the first dielectric layer. A first conductive element is formed over the first dielectric layer, adjacent the control electrode and between the control electrode and the second current-carrying electrode. A second dielectric layer is disposed over the control electrode and over the first conductive element. A second conductive element is disposed over the second dielectric layer and over the first conductive element.
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5.
公开(公告)号:US20240250130A1
公开(公告)日:2024-07-25
申请号:US18593544
申请日:2024-03-01
Applicant: NXP B.V.
Inventor: Ibrahim Khalil , Bernhard Grote , Humayun Kabir , Bruce McRae Green
CPC classification number: H01L29/402 , H01L29/0649 , H01L29/2003 , H01L29/205 , H01L29/404 , H01L29/66462 , H01L29/78
Abstract: An embodiment of a semiconductor device includes a semiconductor substrate, a first dielectric layer disposed over the upper surface of the semiconductor substrate, and a first current-carrying electrode and a second current-carrying electrode formed over the semiconductor substrate within openings formed in the first dielectric layer. A control electrode is formed over the semiconductor substrate and disposed between the first current-carrying electrode and a second current-carrying electrode and over the first dielectric layer. A first conductive element is formed over the first dielectric layer, adjacent the control electrode and between the control electrode and the second current-carrying electrode. A second dielectric layer is disposed over the control electrode and over the first conductive element. A second conductive element is disposed over the second dielectric layer and over the first conductive element. An opening in the second dielectric layer couples the first conductive element to the second conductive element.
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公开(公告)号:US20230197839A1
公开(公告)日:2023-06-22
申请号:US17645286
申请日:2021-12-20
Applicant: NXP B.V.
Inventor: Congyong Zhu , Bernhard Grote , Bruce McRae Green
IPC: H01L29/778 , H01L29/66 , H01L29/20
CPC classification number: H01L29/778 , H01L29/66462 , H01L29/2003
Abstract: Placement of a field plate in a field-effect transistor is optimized by using multiple dielectric layers such that a first end of field plate is separated from a channel region of the transistor by a first set of one or more distinct dielectric material layers. A second end of the field plate overlies the channel region and a control electrode from which it is separated by the first set of dielectric layers and one or more additional dielectric layers.
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