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公开(公告)号:US20160139038A1
公开(公告)日:2016-05-19
申请号:US14547908
申请日:2014-11-19
Applicant: NXP B.V.
Inventor: Marten Oldsen , Erik Jan Lous , Agata Sakic
IPC: G01N21/3504 , G01J3/45 , G01J3/26
CPC classification number: G01N21/3504 , G01J3/26 , G01J3/42 , G01N21/0303 , G01N21/031 , G01N21/3577 , G01N21/45 , G01N21/61 , G01N2021/0389 , G01N2021/056 , G01N2021/451 , G02B5/284 , G02B5/286
Abstract: One example discloses an interferometer device, including: a first side, having a first reflectivity; a second side, having a second reflectivity; a cavity disposed between the first and second sides, and having an opening configured to receive a substance; an electromagnetic source input region configured to receive an electromagnetic signal; and an electromagnetic detector output region configured to output the electromagnetic signal modulated in response to the substance in the cavity. Another example discloses a method including: fabricating a first side, having a first reflectivity; fabricating a second side, having a second reflectivity and positioned with respect to the first side so as to form a cavity; fabricating an opening configured to receive a substance; fabricating an electromagnetic source input region configured to receive an electromagnetic signal; and fabricating an electromagnetic detector output region configured to output the electromagnetic signal modulated in response to the substance in the cavity.
Abstract translation: 一个实例公开了一种干涉仪装置,包括:第一侧,具有第一反射率; 第二侧,具有第二反射率; 设置在所述第一和第二侧之间的腔,并且具有构造成接收物质的开口; 被配置为接收电磁信号的电磁源输入区域; 以及电磁检测器输出区域,被配置为输出响应于所述空腔中的物质调制的电磁信号。 另一个实例公开了一种方法,包括:制造具有第一反射率的第一侧; 制造第二侧,具有第二反射率并相对于第一侧定位以形成空腔; 制造构造成接收物质的开口; 制造被配置为接收电磁信号的电磁源输入区域; 以及制造电磁检测器输出区域,所述电磁检测器输出区域被配置为输出响应于所述空腔中的物质调制的电磁信号。
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公开(公告)号:US09419043B2
公开(公告)日:2016-08-16
申请号:US13887144
申请日:2013-05-03
Applicant: NXP B.V.
Inventor: Roel Daamen , Nebojsa Nenadovic , Erik Jan Lous
IPC: H01L27/14 , H01L31/02 , H01L27/146 , G01S3/784 , H01L31/0216 , G01S3/781 , H01L27/144
CPC classification number: H01L27/14643 , G01S3/781 , G01S3/784 , H01L27/1446 , H01L27/14618 , H01L27/14683 , H01L31/02024 , H01L31/02164 , H01L2224/4847
Abstract: An integrated circuit and a method of making the same. The integrated circuit includes a semiconductor substrate having a major surface. The integrated circuit also includes a directional light sensor. The directional light sensor includes a plurality of photodetectors located on the major surface. The directional light sensor also includes one or more barriers, wherein each barrier is positioned to shade one or more of the photodetectors from light incident upon the integrated circuit from a respective direction. The directional light sensor is operable to determine a direction of light incident upon the integrated circuit by comparing an output signal of at least two of the photodetectors.
Abstract translation: 一种集成电路及其制造方法。 集成电路包括具有主表面的半导体衬底。 集成电路还包括定向光传感器。 定向光传感器包括位于主表面上的多个光电探测器。 定向光传感器还包括一个或多个障碍物,其中每个屏障被定位成使一个或多个光电探测器从相应的方向遮蔽入射在集成电路上的光。 定向光传感器可操作以通过比较至少两个光电检测器的输出信号来确定入射在集成电路上的光的方向。
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公开(公告)号:US20140203391A1
公开(公告)日:2014-07-24
申请号:US13887144
申请日:2013-05-03
Applicant: NXP B.V.
Inventor: Roel Daamen , Nebojsa Nenadovic , Erik Jan Lous
IPC: H01L27/146
CPC classification number: H01L27/14643 , G01S3/781 , G01S3/784 , H01L27/1446 , H01L27/14618 , H01L27/14683 , H01L31/02024 , H01L31/02164 , H01L2224/4847
Abstract: An integrated circuit and a method of making the same. The integrated circuit includes a semiconductor substrate having a major surface. The integrated circuit also includes a directional light sensor. The directional light sensor includes a plurality of photodetectors located on the major surface. The directional light sensor also includes one or more barriers, wherein each barrier is positioned to shade one or more of the photodetectors from light incident upon the integrated circuit from a respective direction. The directional light sensor is operable to determine a direction of light incident upon the integrated circuit by comparing an output signal of at least two of the photodetectors.
Abstract translation: 一种集成电路及其制造方法。 集成电路包括具有主表面的半导体衬底。 集成电路还包括定向光传感器。 定向光传感器包括位于主表面上的多个光电探测器。 定向光传感器还包括一个或多个障碍物,其中每个屏障被定位成使一个或多个光电探测器从相应的方向遮蔽入射在集成电路上的光。 定向光传感器可操作以通过比较至少两个光电检测器的输出信号来确定入射在集成电路上的光的方向。
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