Sensor data network
    1.
    发明授权

    公开(公告)号:US10272927B2

    公开(公告)日:2019-04-30

    申请号:US15842253

    申请日:2017-12-14

    Applicant: NXP B.V.

    Abstract: An apparatus includes a processor configured to receive first sensor data from a sensor system of the first entity and a receiver. The receiver is configured to receive second sensor data from a second entity in the vehicle to vehicle network over a communication network and provide the second sensor data to the processor. The second sensor data comprises a first type of sensor data having a first bandwidth requirement. The processor is further configured to determine an available bandwidth of the communication system; and when the first bandwidth requirement exceeds the communication bandwidth, select a second type of sensor data having a second bandwidth requirement. The second bandwidth requirement is less than the first bandwidth requirement. The processor is further configured to process the first and second sensor data to at least partially determine an environment surrounding the first entity.

    ATE testing system and method for millimetre wave packaged integrated circuits

    公开(公告)号:US11079429B2

    公开(公告)日:2021-08-03

    申请号:US15905110

    申请日:2018-02-26

    Applicant: NXP B.V.

    Abstract: An ATE testing system (900, 1000) for millimetre wave (mmW) packaged integrated circuits (820) includes: at least one packaged integrated circuit (820); a radio frequency, RF, socket (700) configured to receive the at least one packaged integrated circuit (820) and facilitate routing RF signals thereto via at least one input connector and at least one output connector; and at least one interface configured to couple a tester to at least one packaged integrated circuit (820). The RF socket (700) includes a mmW absorber (1010) located adjacent the at least one output connector of the RF socket (700).

    ATE TESTING SYSTEM AND METHOD FOR MILLIMETRE WAVE PACKAGED INTEGRATED CIRCUITS

    公开(公告)号:US20180259574A1

    公开(公告)日:2018-09-13

    申请号:US15905110

    申请日:2018-02-26

    Applicant: NXP B.V.

    CPC classification number: G01R31/2886 G01R1/045 G01R31/2851 G01R31/2896

    Abstract: An ATE testing system (900, 1000) for millimetre wave (mmW) packaged integrated circuits (820) includes: at least one packaged integrated circuit (820); a radio frequency, RF, socket (700) configured to receive the at least one packaged integrated circuit (820) and facilitate routing RF signals thereto via at least one input connector and at least one output connector; and at least one interface configured to couple a tester to at least one packaged integrated circuit (820). The RF socket (700) includes a mmW absorber (1010) located adjacent the at least one output connector of the RF socket (700).

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