公开(公告)号：US12288770B2

公开(公告)日：2025-04-29

申请号：US17660441

申请日：2022-04-25

Applicant: NXP B.V.

Inventor： Kuan-Hsiang Mao ,  Norazham Mohd Sukemi ,  Chin Teck Siong ,  Tsung Nan Lo ,  Wen Hung Huang

IPC: H01L23/495 ,  H01L21/56 ,  H01L23/00 ,  H01L23/498 ,  H01L25/00 ,  H01L25/065

Abstract: Semiconductor packages with embedded wiring on re-distributed bumps are described. In an illustrative, non-limiting embodiment, a semiconductor package may include an integrated circuit (IC) having a plurality of pads and a re-distribution layer (RDL) coupled to the IC without any substrate or lead frame therebetween, where the RDL comprises a plurality of terminals, and where one or more of the plurality of pads are wire bonded to a corresponding one or more of the plurality of terminals.

公开(公告)号：US20230343749A1

公开(公告)日：2023-10-26

申请号：US17660441

申请日：2022-04-25

Applicant: NXP B.V.

Inventor： Kuan-Hsiang Mao ,  Norazham Mohd Sukemi ,  Chin Teck Siong ,  Tsung Nan Lo ,  Wen Hung Huang

IPC: H01L25/065 ,  H01L23/00 ,  H01L23/498 ,  H01L25/00 ,  H01L21/56

CPC classification number: H01L25/0657 ,  H01L24/48 ,  H01L23/49816 ,  H01L24/92 ,  H01L25/50 ,  H01L21/568 ,  H01L2224/48227 ,  H01L2224/92247

Abstract: Semiconductor packages with embedded wiring on re-distributed bumps are described. In an illustrative, non-limiting embodiment, a semiconductor package may include an integrated circuit (IC) having a plurality of pads and a re-distribution layer (RDL) coupled to the IC without any substrate or lead frame therebetween, where the RDL comprises a plurality of terminals, and where one or more of the plurality of pads are wire bonded to a corresponding one or more of the plurality of terminals.