公开(公告)号：US20130320400A1

公开(公告)日：2013-12-05

申请号：US13895228

申请日：2013-05-15

Applicant: NXP B.V.

Inventor： Godefridus Adrianus Maria HURKX ,  Jeroen Antoon CROON ,  Johannes Josephus Theodorus Marinus Donkers ,  Jan Sonsky ,  Stephen John SQUE ,  Andreas Bernardus Maria JANSMAN ,  Markus MUELLER ,  Stephan HEIL ,  Tim BOETTCHER

IPC: H01L29/47 ,  H01L29/40

CPC classification number: H01L29/475 ,  H01L21/02362 ,  H01L21/0254 ,  H01L29/2003 ,  H01L29/401 ,  H01L29/417 ,  H01L29/42316 ,  H01L29/7787 ,  H01L29/7788 ,  H01L29/872

Abstract: Disclosed is a semiconductor device comprising a group 13 nitride heterojunction comprising a first layer having a first bandgap and a second layer having a second bandgap, wherein the first layer is located between a substrate and the second layer; and a Schottky electrode and a first further electrode each conductively coupled to a different area of the heterojunction, said Schottky electrode comprising a central region and an edge region, wherein the element comprises a conductive barrier portion located underneath said edge region only of the Schottky electrode for locally increasing the Schottky barrier of the Schottky electrode. A method of manufacturing such a semiconductor device is also disclosed.

Abstract translation: 公开了一种包括13族氮化物异质结的半导体器件，其包括具有第一带隙的第一层和具有第二带隙的第二层，其中第一层位于衬底和第二层之间; 以及肖特基电极和第一另外的电极，每个导体耦合到所述异质结的不同区域，所述肖特基电极包括中心区域和边缘区域，其中所述元件包括仅位于所述肖特基电极的所述边缘区域下方的导电阻挡部分 用于局部增加肖特基电极的肖特基势垒。 还公开了制造这种半导体器件的方法。

公开(公告)号：US20140306232A1

公开(公告)日：2014-10-16

申请号：US14249108

申请日：2014-04-09

Applicant: NXP B.V.

Inventor： Johannes DONKERS ,  Hans Broekman ,  Stephan HEIL ,  Mark DE KEIJSER ,  Cecilia van der Schaar

IPC: H01L29/205 ,  H01L29/45 ,  H01L29/47

CPC classification number: H01L29/205 ,  H01L21/28575 ,  H01L21/28581 ,  H01L29/2003 ,  H01L29/452 ,  H01L29/475 ,  H01L29/66462 ,  H01L29/7787

Abstract: Disclosed is a semiconductor device comprising at least one active layer (14, 16) on a substrate (10) and a first contact (24, 26, 28) to the at least one active layer, the first contact comprising a metal in contact with the at least one active layer and a titanium tungsten nitride (TiW(N)) layer (30) on the metal. A method of manufacturing such a semiconductor device is also disclosed.

Abstract translation: 公开了一种半导体器件，其包括在衬底（10）上的至少一个有源层（14,16）和至少一个有源层的第一接触（24,26,28），所述第一接触包括与 所述至少一个有源层和所述金属上的氮化钨（TiW（N））层（30）。 还公开了制造这种半导体器件的方法。