公开(公告)号：US20170148697A1

公开(公告)日：2017-05-25

申请号：US15342285

申请日：2016-11-03

Applicant: NXP B.V.

Inventor： Tonny Kamphuis ,  Leo van Gemert ,  Hans van Rijckevorsel ,  Sascha Moeller ,  Hartmut Buenning ,  Steffen Holland ,  Y Kuang Huang

IPC: H01L23/31 ,  H01L29/06 ,  H01L23/00 ,  H01L21/3205 ,  H01L21/683 ,  H01L23/528 ,  H01L21/78

CPC classification number: H01L23/3114 ,  H01L21/32051 ,  H01L21/6836 ,  H01L21/78 ,  H01L23/528 ,  H01L24/32 ,  H01L24/83 ,  H01L29/0657 ,  H01L2221/68327 ,  H01L2224/32245 ,  H01L2224/83801 ,  H01L2924/01022 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/10156 ,  H01L2924/17747 ,  H01L2924/35 ,  H01L2924/37

Abstract: A semiconductor device and a method of making the same. The device includes a semiconductor substrate having a major surface, a backside and side surfaces extending between the major surface and the backside. The semiconductor device also includes at least one metal layer extending across the backside of the substrate. A peripheral part of the at least one metal layer located at the edge of the substrate between the backside and at least one of the side surfaces extends towards a plane containing the major surface. This can prevent burrs located at the peripheral part of the at least one metal layer interfering with the mounting of the backside of the substrate on the surface of a carrier.