公开(公告)号：US20250157986A1

公开(公告)日：2025-05-15

申请号：US18505364

申请日：2023-11-09

Applicant: NXP B.V.

Inventor： Yen-Chih Lin ,  Yi-Hsuan Tsai ,  Yu Ling Tsai ,  Yao Jung Chang

IPC: H01L25/065 ,  H01L23/00 ,  H01L23/498 ,  H01L23/532

Abstract: A method of forming a die-in-die semiconductor device is provided. The method includes forming a first cavity in a backside of a first semiconductor die. The first semiconductor die has a back end of line (BEOL) region, a front end of line (FEOL) region, and a bulk region. A second semiconductor die is mounted in the first cavity. A bond pad of the second semiconductor die is interconnected through a bottom side of the first cavity with an embedded conductive trace of the BEOL region of the first semiconductor die.

公开(公告)号：US20250157862A1

公开(公告)日：2025-05-15

申请号：US18509642

申请日：2023-11-15

Applicant: NXP B.V.

Inventor： Yu Ling Tsai ,  Yen-Chih Lin ,  Yi-Hsuan Tsai ,  Yao Jung Chang

IPC: H01L23/04 ,  H01L21/48 ,  H01L21/52 ,  H01L23/00 ,  H01L23/367 ,  H01L23/552

Abstract: A semiconductor device having an integrated lid structure is provided. The method includes mounting a semiconductor die within a cavity of a lid structure. An active side of the semiconductor die is substantially coplanar with a bottom surface of the lid structure. An encapsulant substantially fills a gap region between sidewalls of the semiconductor die and inner sidewall surfaces of the cavity.

公开(公告)号：US20250125159A1

公开(公告)日：2025-04-17

申请号：US18484533

申请日：2023-10-11

Applicant: NXP B.V.

Inventor： Yu Ling Tsai ,  Yao Jung Chang ,  Yen-Chih Lin ,  Tzu Ya Fang ,  Jian Nian Chen ,  Yi-Hsuan Tsai

IPC: H01L21/60 ,  H01L21/56

Abstract: A semiconductor device having dismantlable structure is provided. The method includes forming a packaged semiconductor die by mounting the semiconductor die onto a package substrate in a flip chip orientation, attaching an interposer substrate over a backside of the semiconductor die, and encapsulating with an encapsulant the semiconductor die and remaining gap region between the package substrate and the interposer substrate. A bond pad of the semiconductor die is interconnected with a conductive trace of the package substrate. The interposer substrate includes a plurality of conductive pads exposed at a top surface and interconnected with the package substrate. A dismantlable structure is attached on the top surface of the interposer substrate. A first region of the dismantlable structure covers the plurality of conductive pads.

公开(公告)号：US20250096077A1

公开(公告)日：2025-03-20

申请号：US18468958

申请日：2023-09-18

Applicant: NXP B.V.

Inventor： Yen-Chih Lin ,  Yao Jung Chang ,  Kuan Lin Huang ,  Yi-Hsuan Tsai ,  Meng-huang Sie

IPC: H01L23/495 ,  H01L21/56 ,  H01L23/00 ,  H01L23/31 ,  H01L23/48

Abstract: A method of forming a semiconductor device is provided. The method includes mounting a semiconductor die on a die pad of a leadframe. The die pad includes a central opening configured to expose a central portion of the semiconductor die. A first end of a bond wire is attached to a bond pad of the semiconductor die and a second end of the bond wire is attached to a lead of the leadframe. An encapsulant encapsulates the semiconductor die and the leadframe. A portion of the lead and a portion of the die pad are exposed and protruded through the encapsulant.

公开(公告)号：US20240038683A1

公开(公告)日：2024-02-01

申请号：US17815638

申请日：2022-07-28

Applicant: NXP B.V.

Inventor： Tzu Ya Fang ,  Yen-Chih Lin ,  Jian Nian Chen ,  Moly Lee ,  Yi Xiu Xie ,  Vanessa Wyn Jean Tan ,  Yao Jung Chang ,  Yi-Hsuan Tsai ,  Xiu Hong Shen ,  Kuan Lin Huang

IPC: H01L23/00 ,  H01L25/065 ,  H01L23/31 ,  H01L23/48 ,  H01L23/538 ,  H01L21/683 ,  H01L21/48 ,  H01L21/56 ,  H01L25/00

CPC classification number: H01L23/562 ,  H01L25/0657 ,  H01L24/20 ,  H01L23/3128 ,  H01L23/481 ,  H01L23/5383 ,  H01L23/5386 ,  H01L23/5389 ,  H01L21/6835 ,  H01L21/4853 ,  H01L21/4857 ,  H01L21/565 ,  H01L21/568 ,  H01L24/19 ,  H01L25/50 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06548 ,  H01L2225/06586 ,  H01L2224/214 ,  H01L2924/17151 ,  H01L2924/351 ,  H01L2221/68372

Abstract: A method of manufacturing a semiconductor device is provided. The method includes placing a package substrate on a carrier substrate, forming a frame on the package substrate, and affixing an active side of a semiconductor die on the package substrate. The semiconductor die together with the frame and the package substrate form a cavity between the semiconductor die and the package substrate. At least a portion of the semiconductor die and the package substrate are encapsulated with an encapsulant. The frame is configured to prevent the encapsulant from entering the cavity.