公开(公告)号：US09979355B2

公开(公告)日：2018-05-22

申请号：US15393473

申请日：2016-12-29

Applicant: NXP USA, Inc.

Inventor： Joseph Staudinger ,  Abdulrhman M. S. Ahmed ,  Paul R. Hart ,  Monte G. Miller ,  Nicholas J. Spence

IPC: H03F3/19 ,  H03F1/02 ,  H03F1/32 ,  H03F3/24

Abstract: An embodiment of an amplifier system includes a modifiable signal adjustment device with an RF signal adjustment circuit coupled between first and second nodes. The RF signal adjustment circuit includes an adjustable phase shifter and an adjustable attenuator coupled in series with each other. The device also includes a memory and a controller circuit. The controller circuit retrieves a phase shift value and an attenuation value from the memory. The controller circuit then controls the adjustable phase shifter to apply a phase shift corresponding to the phase shift value to an input RF signal received at the first node, and controls the adjustable attenuator to apply an attenuation corresponding to the attenuation value to the input RF signal. Applying the phase shift and the attenuation results in an output RF signal at the second node.

公开(公告)号：US10027284B2

公开(公告)日：2018-07-17

申请号：US15393473

申请日：2016-12-29

Applicant: NXP USA, Inc.

Inventor： Joseph Staudinger ,  Abdulrhman M. S. Ahmed ,  Paul R. Hart ,  Monte G. Miller ,  Nicholas J. Spence

IPC: H03F3/19 ,  H03F1/02 ,  H03F1/32 ,  H03F3/24

Abstract: An embodiment of an amplifier system includes a modifiable signal adjustment device with an RF signal adjustment circuit coupled between first and second nodes. The RF signal adjustment circuit includes an adjustable phase shifter and an adjustable attenuator coupled in series with each other. The device also includes a memory and a controller circuit. The controller circuit retrieves a phase shift value and an attenuation value from the memory. The controller circuit then controls the adjustable phase shifter to apply a phase shift corresponding to the phase shift value to an input RF signal received at the first node, and controls the adjustable attenuator to apply an attenuation corresponding to the attenuation value to the input RF signal. Applying the phase shift and the attenuation results in an output RF signal at the second node.

公开(公告)号：US20170111014A1

公开(公告)日：2017-04-20

申请号：US15393473

申请日：2016-12-29

Applicant: NXP USA, Inc.

Inventor： Joseph Staudinger ,  Abdulrhman M. S. Ahmed ,  Paul R. Hart ,  Monte G. Miller ,  Nicholas J. Spence

IPC: H03F1/02 ,  H03F3/19 ,  H03F3/24 ,  H03F1/32

CPC classification number: H03F1/0288 ,  H03F1/3247 ,  H03F1/3282 ,  H03F3/19 ,  H03F3/245 ,  H03F2200/222 ,  H03F2200/387 ,  H03F2200/451 ,  H03F2201/3233 ,  H03F2203/21106

Abstract: An embodiment of an amplifier system includes a modifiable signal adjustment device with an RF signal adjustment circuit coupled between first and second nodes. The RF signal adjustment circuit includes an adjustable phase shifter and an adjustable attenuator coupled in series with each other. The device also includes a memory and a controller circuit. The controller circuit retrieves a phase shift value and an attenuation value from the memory. The controller circuit then controls the adjustable phase shifter to apply a phase shift corresponding to the phase shift value to an input RF signal received at the first node, and controls the adjustable attenuator to apply an attenuation corresponding to the attenuation value to the input RF signal. Applying the phase shift and the attenuation results in an output RF signal at the second node.

公开(公告)号：US11349438B2

公开(公告)日：2022-05-31

申请号：US16730699

申请日：2019-12-30

Applicant: NXP USA, Inc.

Inventor： Yun Wei ,  Ricardo Uscola ,  Monte G. Miller

IPC: H03F3/68 ,  H03F1/02 ,  H01L23/00 ,  H03F3/195 ,  H03F3/21

Abstract: Power amplifier (PA) packages, such as Doherty PA packages, containing multi-path integrated passive devices (IPDs) are disclosed. In embodiments, the PA package includes a package body through which first and second signal amplification paths extend, a first amplifier die within the package body and positioned in the first signal amplification path, and a second amplifier die within the package body and positioned in the second signal amplification path. A multi-path IPD is further contained in the package body. The multi-path IPD includes a first IPD region through which the first signal amplification path extends, a second IPD region through which the second signal amplification path extends, and an isolation region formed in the IPD substrate a location intermediate the first IPD region and the second IPD region.

公开(公告)号：US20210203278A1

公开(公告)日：2021-07-01

申请号：US16730699

申请日：2019-12-30

Applicant: NXP USA, Inc.

Inventor： Yun Wei ,  Ricardo Uscola ,  Monte G. Miller

IPC: H03F1/02 ,  H03F3/195 ,  H01L23/00

Abstract: Power amplifier (PA) packages, such as Doherty PA packages, containing multi-path integrated passive devices (IPDs) are disclosed. In embodiments, the PA package includes a package body through which first and second signal amplification paths extend, a first amplifier die within the package body and positioned in the first signal amplification path, and a second amplifier die within the package body and positioned in the second signal amplification path. A multi-path IPD is further contained in the package body. The multi-path IPD includes a first IPD region through which the first signal amplification path extends, a second IPD region through which the second signal amplification path extends, and an isolation region formed in the IPD substrate a location intermediate the first IPD region and the second IPD region.