公开(公告)号：US20230378106A1

公开(公告)日：2023-11-23

申请号：US17664113

申请日：2022-05-19

Applicant: NXP USA, Inc.

Inventor： Namrata Kanth ,  Paul Southworth ,  Scott M. Hayes ,  Dwight Lee Daniels ,  Yufu Liu ,  Jeroen Johannes Maria Zaal ,  Cheong Chiang Ng

IPC: H01L23/00

CPC classification number: H01L24/05 ,  H01L24/16 ,  H01L24/03 ,  H01L24/81 ,  H01L2224/16227 ,  H01L2224/81815 ,  H01L2224/81203 ,  H01L2224/03622 ,  H01L2224/0348 ,  H01L2224/03916 ,  H01L2224/0361 ,  H01L2224/05576 ,  H01L2224/05573 ,  H01L2224/05558 ,  H01L2224/05551 ,  H01L2224/05555 ,  H01L2224/05557 ,  H01L2224/05011 ,  H01L2224/05015 ,  H01L2224/05017 ,  H01L2224/05018 ,  H01L2924/35121

Abstract: An electronic device substrate with a substantially planar surface formed from an electrically non-conductive material is provided with one or more metalized pads on the substantially planner surface. Each of the one or more metalized pads is surrounded by and coplanar with the first electrically nonconductive material along an outer boundary of the metalized pad. The metalized pad is patterned such that portions of the metalized pad form metalized fingers that extend radially from the outer boundary of the metalized pad in an interdigitated arrangement with the first electrically nonconductive material. The metalized pad has a solderable surface.

公开(公告)号：US12119316B2

公开(公告)日：2024-10-15

申请号：US17664113

申请日：2022-05-19

Applicant: NXP USA, Inc.

Inventor： Namrata Kanth ,  Paul Southworth ,  Scott M. Hayes ,  Dwight Lee Daniels ,  Yufu Liu ,  Jeroen Johannes Maria Zaal ,  Cheong Chiang Ng

IPC: H01L23/00

CPC classification number: H01L24/05 ,  H01L24/03 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/0348 ,  H01L2224/0361 ,  H01L2224/03622 ,  H01L2224/03916 ,  H01L2224/05011 ,  H01L2224/05015 ,  H01L2224/05017 ,  H01L2224/05018 ,  H01L2224/05551 ,  H01L2224/05555 ,  H01L2224/05557 ,  H01L2224/05558 ,  H01L2224/05573 ,  H01L2224/05576 ,  H01L2224/16227 ,  H01L2224/81203 ,  H01L2224/81815 ,  H01L2924/35121

Abstract: An electronic device substrate with a substantially planar surface formed from an electrically non-conductive material is provided with one or more metalized pads on the substantially planner surface. Each of the one or more metalized pads is surrounded by and coplanar with the first electrically nonconductive material along an outer boundary of the metalized pad. The metalized pad is patterned such that portions of the metalized pad form metalized fingers that extend radially from the outer boundary of the metalized pad in an interdigitated arrangement with the first electrically nonconductive material. The metalized pad has a solderable surface.