公开(公告)号：US20240363519A1

公开(公告)日：2024-10-31

申请号：US18307082

申请日：2023-04-26

Applicant: NXP USA, INC.

Inventor： Michael B. Vincent ,  Ankur Shah ,  Namrata Kanth

IPC: H01L23/498 ,  H01L21/48 ,  H01L21/56 ,  H01L23/14 ,  H01L23/31 ,  H01L23/538 ,  H01L25/16

CPC classification number: H01L23/4985 ,  H01L21/4853 ,  H01L21/566 ,  H01L23/145 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49833 ,  H01L23/49838 ,  H01L23/5385 ,  H01L23/5386 ,  H01L23/5387 ,  H01L25/162 ,  H01L25/165 ,  H01L21/486 ,  H01L24/08 ,  H01L24/16 ,  H01L24/32 ,  H01L2224/08235 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2224/32225 ,  H01L2924/182

Abstract: A method of forming a semiconductor device is provided. The method includes placing a semiconductor die on a carrier substrate and affixing a rigid-flex sub-assembly on the semiconductor die. The rigid-flex sub-assembly includes a rigid portion and a flex portion having a conductive trace. A distal region of the flex portion is bent such that the bent distal region is not coplanar with the rigid portion. An encapsulant encapsulates at least a portion of the semiconductor die and the rigid-flex sub-assembly.

公开(公告)号：US12119316B2

公开(公告)日：2024-10-15

申请号：US17664113

申请日：2022-05-19

Applicant: NXP USA, Inc.

Inventor： Namrata Kanth ,  Paul Southworth ,  Scott M. Hayes ,  Dwight Lee Daniels ,  Yufu Liu ,  Jeroen Johannes Maria Zaal ,  Cheong Chiang Ng

IPC: H01L23/00

CPC classification number: H01L24/05 ,  H01L24/03 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/0348 ,  H01L2224/0361 ,  H01L2224/03622 ,  H01L2224/03916 ,  H01L2224/05011 ,  H01L2224/05015 ,  H01L2224/05017 ,  H01L2224/05018 ,  H01L2224/05551 ,  H01L2224/05555 ,  H01L2224/05557 ,  H01L2224/05558 ,  H01L2224/05573 ,  H01L2224/05576 ,  H01L2224/16227 ,  H01L2224/81203 ,  H01L2224/81815 ,  H01L2924/35121

Abstract: An electronic device substrate with a substantially planar surface formed from an electrically non-conductive material is provided with one or more metalized pads on the substantially planner surface. Each of the one or more metalized pads is surrounded by and coplanar with the first electrically nonconductive material along an outer boundary of the metalized pad. The metalized pad is patterned such that portions of the metalized pad form metalized fingers that extend radially from the outer boundary of the metalized pad in an interdigitated arrangement with the first electrically nonconductive material. The metalized pad has a solderable surface.

公开(公告)号：US20240332105A1

公开(公告)日：2024-10-03

申请号：US18295230

申请日：2023-04-03

Applicant: NXP USA, Inc.

Inventor： Namrata Kanth ,  Scott M. Hayes ,  Stephen Ryan Hooper ,  Chayathorn Saklang ,  Burton Jesse Carpenter

IPC: H01L23/31 ,  H01L21/56 ,  H01L23/00

CPC classification number: H01L23/3135 ,  H01L21/565 ,  H01L24/16 ,  H01L24/17 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/85 ,  H01L2224/16145 ,  H01L2224/1703 ,  H01L2224/32225 ,  H01L2224/48145 ,  H01L2224/73215 ,  H01L2224/81191 ,  H01L2224/83192 ,  H01L2224/8502 ,  H01L2924/1815

Abstract: A multidevice package includes upper and lower surfaces with the lower surface disposed beneath a first die forming part of the package. The lower surface includes a first a set of electrical contacts and a recessed region with a second set of electrical contacts configured to allow a second die to be coupled to the lower surface and electrically coupled to the first die via the second set of contacts. The recessed region is sufficiently recessed to allow the package to be coupled to a mounting surface such as a printed circuit board via the first set of contacts while the second die remains suspended above the mounting surface.

公开(公告)号：US20240178111A1

公开(公告)日：2024-05-30

申请号：US18059465

申请日：2022-11-29

Applicant: NXP USA, INC.

Inventor： Chayathorn Saklang ,  Namrata Kanth ,  Stephen Ryan Hooper ,  Scott M. Hayes

IPC: H01L23/495 ,  H01L21/48 ,  H01L21/56 ,  H01L23/31

CPC classification number: H01L23/49593 ,  H01L21/4825 ,  H01L21/4842 ,  H01L21/565 ,  H01L23/3107 ,  H01L23/49503 ,  H01L23/4952 ,  H01L23/49555

Abstract: A method of manufacturing a semiconductor device with an attached battery is provided. The method includes affixing a semiconductor die to a die pad region of a first battery lead of a leadframe. The first battery lead of the leadframe is separated from a second battery lead of the leadframe. An encapsulant encapsulates the semiconductor die and portions of the first and second battery leads of the leadframe. The battery is affixed to an exposed portion of the first battery lead of the leadframe such that a first terminal of the battery is conductively connected to the first battery lead. An exposed portion of the second battery lead of the leadframe is bent to overlap a top surface portion of the battery such that a second terminal of the battery conductively connected to the second battery lead.

公开(公告)号：US20230378106A1

公开(公告)日：2023-11-23

申请号：US17664113

申请日：2022-05-19

Applicant: NXP USA, Inc.

Inventor： Namrata Kanth ,  Paul Southworth ,  Scott M. Hayes ,  Dwight Lee Daniels ,  Yufu Liu ,  Jeroen Johannes Maria Zaal ,  Cheong Chiang Ng

IPC: H01L23/00

CPC classification number: H01L24/05 ,  H01L24/16 ,  H01L24/03 ,  H01L24/81 ,  H01L2224/16227 ,  H01L2224/81815 ,  H01L2224/81203 ,  H01L2224/03622 ,  H01L2224/0348 ,  H01L2224/03916 ,  H01L2224/0361 ,  H01L2224/05576 ,  H01L2224/05573 ,  H01L2224/05558 ,  H01L2224/05551 ,  H01L2224/05555 ,  H01L2224/05557 ,  H01L2224/05011 ,  H01L2224/05015 ,  H01L2224/05017 ,  H01L2224/05018 ,  H01L2924/35121

Abstract: An electronic device substrate with a substantially planar surface formed from an electrically non-conductive material is provided with one or more metalized pads on the substantially planner surface. Each of the one or more metalized pads is surrounded by and coplanar with the first electrically nonconductive material along an outer boundary of the metalized pad. The metalized pad is patterned such that portions of the metalized pad form metalized fingers that extend radially from the outer boundary of the metalized pad in an interdigitated arrangement with the first electrically nonconductive material. The metalized pad has a solderable surface.