摘要:
The single-poly EEPROM includes a first PMOS transistor serially connected to a second PMOS transistor. The first and second PMOS transistors are both formed on an N-well of a P type substrate. The first PMOS transistor includes a floating gate, a first P+ doped drain region and a first P+ doped source region. The second PMOS transistor includes a gate and a second P+ doped source region. The first P+ doped drain region of the first PMOS transistor serves as a drain of the second PMOS transistor. A diode is located in the P type substrate including a P-well and a N+ doped region. The floating gate overlaps with the N-well and extends to the N+ doped region. The overlapped region of the P-well and the N+ doped region junction beneath the floating gate serves as an avalanche injection point in the vicinity of the first PMOS transistor.
摘要:
The single-poly EEPROM includes a first PMOS transistor serially connected to a second PMOS transistor. The first and second PMOS transistors are both formed on an N-well of a P type substrate. The first PMOS transistor includes a floating gate, a first P+ doped drain region and a first P+ doped source region. The second PMOS transistor includes a gate and a second P+ doped source region. The first P+ doped drain region of the first PMOS transistor serves as a drain of the second PMOS transistor. A diode is located in the P type substrate including a P-well and a N+ doped region. The floating gate overlaps with the N-well and extends to the N+ doped region. The overlapped region of the P-well and the N+ doped region junction beneath the floating gate serves as an avalanche injection point in the vicinity of the first PMOS transistor.
摘要:
A method of fabricating a mask ROM, in which conductive strips are formed with a cap layer on each of them, then a plurality of spacers are formed on the side-walls of the conductive strips, while the substrate under the spacers are used as the coding regions. The buried bit-lines are formed in the substrate between the spacers, then a two-step coding process is performed, wherein the coding regions at the first and the second side of the conductive strips are selectively doped by a first and a second tilt coding implantation with a first and a second coding mask. After the second mask layer and the cap layer are removed, a conductive layer is formed over the substrate, then the conductive layer and the conductive strips are patterned successively to form a plurality of word-lines and plural gates, respectively.
摘要:
A self-aligned contact process is provided on a semiconductor substrate having at least two gate structures and a plurality of lightly ion-doped regions on the semiconductor substrate. Each of the gate structures has a gate layer and a cap layer formed on the gate layer. A first sidewall spacer is formed on the sidewalls of the gate structure, and then a heavy ion-doped region is formed on the exposed lightly ion-doped region. Next, a first dielectric layer is formed to fill the gap between adjacent first sidewall spacers. Part of the first sidewall spacer and part of the first dielectric layer is removed to expose the cap layer. A second spacer is then formed on the exposed sidewall of the cap layer. Next, a second dielectric layer is formed to fill the gap between adjacent second sidewall spacers. Finally, the second dielectric layer and the first dielectric layer positioned adjacent gate structures are removed to expose the second ion-doped region so as to form a contact hole.
摘要:
A method of fabricating a memory device having a buried source/drain region is provided, in which a dielectric layer and a word-line is sequentially formed on the substrate, then a buried source/drain region is formed in the substrate. After that, a barrier layer is formed on the exposed surface of the word-line, then a metal layer is formed over the substrate. The metal layer is patterned to leave a portion covering the buried source/drain region beside the word-line and crossing over the word-line.
摘要:
The present invention relates to discloses a manufacturing method of a gate-split flash memory, which is suitable for a self-align contact process and fully-salicide-compatible process. The present invention masks the invalid peaks with a thick passivation layer to obtain the purpose of removing the invalid peaks in the manufacturing process of a gate-split flash memory. The present invention deposits a nitride spacer to define a pattern of a floating gate of the flash memory, so that a channel length of the floating gate can be finely defined. The present invention also utilizes a mask pattern to define the floating gate region of the flash memory, and the manufacturing process will be smooth and cheap.
摘要:
A method for programming a P-channel EEPROM having an N-well, a floating gate, a control gate, a P-type source region and a P-type drain region is provided. In the method, the N-well is grounded, a first positive voltage is applied to the control gate, a second positive voltage or a programming current is applied to the P-type source region, and a negative voltage is applied to the P-type drain region.
摘要:
A self-aligned contact method includes, firstly, forming a plurality of stack structures on a semiconductor substrate. The stack structures separate each other and each has a first polysilicon layer, an insulating layer on the first polysilicon layer and a second polysilicon layer on the insulating layer. Secondly, a spacer forms on the sidewall of the stack structures, and then a dielectric layer is formed on the stack structures, the spacers and the semiconductor substrate. Finally, the portion of the second polysilicon layer is used as a buffer for forming a contact window by removing a portion of the dielectric layer. The contact window is located between two stack structures.
摘要:
A method for programming a P-channel EEPROM having an N-well, a floating gate, a control gate, a P-type source region and a P-type drain region is provided. In the method, the N-well is grounded, a first positive voltage is applied to the control gate, a second positive voltage or a programming current is applied to the P-type source region, and a negative voltage is applied to the P-type drain region.
摘要:
A method of fabricating a memory device having a buried source/drain region is provided, in which a dielectric layer and a word-line is sequentially formed on the substrate, then a buried source/drain region is formed in the substrate. After that, a barrier layer is formed on the exposed surface of the word-line, then a metal layer is formed over the substrate. The metal layer is patterned to leave a portion covering the buried source/drain region beside the word-line and crossing over the word-line.