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    Contactor for electronic parts and a contact method
    1.
    发明申请
    Contactor for electronic parts and a contact method 有权
    电子零件接触器和接触方式

    公开(公告)号：US20060186905A1

    公开(公告)日：2006-08-24

    申请号：US11339836

    申请日：2006-01-26

    申请人： Naohito Kohashi ,  Shigeyuki Maruyama ,  Yoshikazu Arisaka ,  Hiroyuki Murotani ,  Katsuhiko Ono

    发明人： Naohito Kohashi ,  Shigeyuki Maruyama ,  Yoshikazu Arisaka ,  Hiroyuki Murotani ,  Katsuhiko Ono

    IPC分类号： G01R31/02

    CPC分类号： G01R1/0466 ,  G01R1/0483

    摘要： A contactor for electronic parts can provide an appropriate and uniform contact with respect to a plurality of electrode terminals in an electronic part such as an IC. Each of a plurality of contact members has a first contact portion on one end thereof and a second contact portion on the other end thereof, the first contract portion having a recessed portion that receives one of the electrode terminals of the electronic part. A base accommodates and supports the plurality of the contact members. The first contact portion is movable in a horizontal direction.

    摘要翻译： 用于电子部件的接触器可以提供相对于诸如IC的电子部件中的多个电极端子的适当且均匀的接触。 多个接触构件中的每一个在其一端具有第一接触部分和另一端的第二接触部分，第一接合部分具有容纳电子部件的电极端子之一的凹部。 基座容纳并支撑多个接触构件。 第一接触部分可沿水平方向移动。

    Contactor for electronic parts and a contact method
    2.
    发明授权
    Contactor for electronic parts and a contact method 有权
    电子零件接触器和接触方式

    公开(公告)号：US07471096B2

    公开(公告)日：2008-12-30

    申请号：US11339836

    申请日：2006-01-26

    申请人： Naohito Kohashi ,  Shigeyuki Maruyama ,  Yoshikazu Arisaka ,  Hiroyuki Murotani ,  Katsuhiko Ono

    发明人： Naohito Kohashi ,  Shigeyuki Maruyama ,  Yoshikazu Arisaka ,  Hiroyuki Murotani ,  Katsuhiko Ono

    IPC分类号： G01R31/02

    CPC分类号： G01R1/0466 ,  G01R1/0483

    摘要： A contactor for electronic parts can provide an appropriate and uniform contact with respect to a plurality of electrode terminals in an electronic part such as an IC. Each of a plurality of contact members has a first contact portion on one end thereof and a second contact portion on the other end thereof, the first contract portion having a recessed portion that receives one of the electrode terminals of the electronic part. A base accommodates and supports the plurality of the contact members. The first contact portion is movable in a horizontal direction.

    摘要翻译： 用于电子部件的接触器可以提供相对于诸如IC的电子部件中的多个电极端子的适当且均匀的接触。 多个接触构件中的每一个在其一端具有第一接触部分和另一端的第二接触部分，第一接合部分具有容纳电子部件的电极端子之一的凹部。 基座容纳并支撑多个接触构件。 第一接触部分可沿水平方向移动。

    Semiconductor device packaging structure
    4.
    发明授权
    Semiconductor device packaging structure 有权
    半导体器件封装结构

    公开(公告)号：US08164181B2

    公开(公告)日：2012-04-24

    申请号：US12872131

    申请日：2010-08-31

    申请人： Kazuhiro Tashiro ,  Keisuke Fukuda ,  Naohito Kohashi ,  Shigeyuki Maruyama

    发明人： Kazuhiro Tashiro ,  Keisuke Fukuda ,  Naohito Kohashi ,  Shigeyuki Maruyama

    IPC分类号： H01L23/12

    CPC分类号： H01L21/67333 ,  H01L21/50 ,  H01L22/20 ,  H01L23/04 ,  H01L23/544 ,  H01L25/0655 ,  H01L2223/54473 ,  H01L2924/0002 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/16153 ,  H01L2924/1616 ,  H01L2924/166 ,  Y10T29/49826 ,  H01L2924/00

    摘要： A semiconductor device packaging structure is disclosed that can improve reliability of a performance test for the semiconductor device and prevent damage to the semiconductor device during transportation or packaging for shipment. An IC cover is attached to the semiconductor device, which has height unevenness because it includes semiconductor chips and electric parts having different heights. The IC cover includes projecting portions and a base portion. After being attached to the semiconductor device, the projecting portions stand in a free area in the semiconductor device, and the base portion is supported by the projections to be separated from the semiconductor chips and electric parts in the semiconductor device. The IC cover is detachably attached to the semiconductor device.

    摘要翻译： 公开了一种半导体器件封装结构，其可以提高半导体器件的性能测试的可靠性，并防止在运输或包装期间对半导体器件的损坏。 由于包含半导体芯片和具有不同高度的电气部件，所以具有高度不均匀性的半导体器件附着IC盖。 IC盖包括突出部分和基部。 在安装到半导体器件之后，突出部分位于半导体器件中的自由区域中，并且基底部分由与半导体芯片和半导体器件中的电气部件分离的突起支撑。 IC盖可拆卸地附接到半导体器件。

    Temperature control method and temperature control device
    8.
    发明申请
    Temperature control method and temperature control device 有权
    温度控制方法和温度控制装置

    公开(公告)号：US20060245161A1

    公开(公告)日：2006-11-02

    申请号：US11350894

    申请日：2006-02-10

    申请人： Shigeyuki Maruyama ,  Hiroshi Misawa ,  Naohito Kohashi

    发明人： Shigeyuki Maruyama ,  Hiroshi Misawa ,  Naohito Kohashi

    IPC分类号： H05K7/20

    CPC分类号： G01R31/2874 ,  H01L2924/0002 ,  H01L2924/00

    摘要： In a temperature control method, a controlled part is arranged to contact a first principal surface of a heat conduction part. The heat conduction part has the first principal surface and a second principal surface opposite to the first principal surface. The first principal surface has a configuration corresponding to a configuration of the controlled part. The second principal surface has an area larger than an area of the first principal surface. At least one of a heating unit and a cooling unit is driven to set the controlled part at a predetermined temperature. The heating unit and the cooling unit are disposed on the second principal surface of the heat conduction part so that the heating unit and the cooling unit are arranged side by side.

    摘要翻译： 在温度控制方法中，受控部件布置成接触导热部分的第一主表面。 导热部分具有第一主表面和与第一主表面相对的第二主表面。 第一主表面具有对应于受控部件的构造的构造。 第二主表面的面积大于第一主表面的面积。 驱动加热单元和冷却单元中的至少一个以将受控部件设定在预定温度。 加热单元和冷却单元设置在导热部分的第二主表面上，使得加热单元和冷却单元并排布置。

    METHOD OF SEMICONDUCTOR DEVICE PROTECTION
    10.
    发明申请
    METHOD OF SEMICONDUCTOR DEVICE PROTECTION 有权
    半导体器件保护方法

    公开(公告)号：US20120005875A1

    公开(公告)日：2012-01-12

    申请号：US13240508

    申请日：2011-09-22

    申请人： Kazuhiro Tashiro ,  Keisuke Fukuda ,  Naohito Kohashi ,  Shigeyuki Maruyama

    发明人： Kazuhiro Tashiro ,  Keisuke Fukuda ,  Naohito Kohashi ,  Shigeyuki Maruyama

    IPC分类号： B23P11/00

    CPC分类号： H01L21/67333 ,  H01L21/50 ,  H01L22/20 ,  H01L23/04 ,  H01L23/544 ,  H01L25/0655 ,  H01L2223/54473 ,  H01L2924/0002 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/16153 ,  H01L2924/1616 ,  H01L2924/166 ,  Y10T29/49826 ,  H01L2924/00

    摘要： A method for protecting a semiconductor device is disclosed that can improve reliability of a performance test for the semiconductor device and prevent damage to the semiconductor device during transportation or packaging for shipment. An IC cover is attached to the semiconductor device, which has height unevenness because it includes semiconductor chips and electric parts having different heights. The IC cover includes projecting portions and a base portion. After being attached to the semiconductor device, the projecting portions stand in a free area in the semiconductor device, and the base portion is supported by the projections to be separated from the semiconductor chips and electric parts in the semiconductor device. The IC cover is detachably attached to the semiconductor device.

    摘要翻译： 公开了一种用于保护半导体器件的方法，其可以提高半导体器件的性能测试的可靠性，并防止在运输或包装期间对半导体器件的损坏。 由于包含半导体芯片和具有不同高度的电气部件，所以具有高度不均匀性的半导体器件附着IC盖。 IC盖包括突出部分和基部。 在安装到半导体器件之后，突出部分位于半导体器件中的自由区域中，并且基底部分由与半导体芯片和半导体器件中的电气部件分离的突起支撑。 IC盖可拆卸地附接到半导体器件。