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公开(公告)号:US08449204B2
公开(公告)日:2013-05-28
申请号:US13126898
申请日:2009-06-11
申请人: Toshiaki Takai , Yukio Sakigawa , Shohei Hata
发明人: Toshiaki Takai , Yukio Sakigawa , Shohei Hata
CPC分类号: G02B6/4246 , G02B6/29367 , H01S5/005 , H01S5/02212 , H01S5/02228 , H01S5/02284 , H01S5/02296 , H01S2301/176
摘要: An optical module in a simple configuration is provided which can suppress optical crosstalk due to leakage light without causing characteristics deterioration and reliability decrease of light-emitting elements to thereby obtain appropriate light receiving sensitivity. In an optical module in which a plurality of light-emitting elements 11 and light-receiving elements 12 are mounted on an optical-element mounting substrate 1, a light-absorbing resin 6 to absorb light with a light-emission wavelength of the light-emitting elements 11 is arranged to cover side surfaces of the light-emitting elements 11 and a non-adhesive layer 7 including a material not adhesive to the light-absorbing resin 6 is arranged between the light-absorbing resin 6 and the optical-element mounting substrate 1.
摘要翻译: 提供一种简单结构的光模块,其可以抑制由于漏光引起的光串扰,而不会导致发光元件的特性劣化和可靠性降低,从而获得适当的光接收灵敏度。 在其中多个发光元件11和光接收元件12安装在光学元件安装基板1上的光学模块中,用于吸收发光波长的光的光吸收树脂6, 发光元件11布置成覆盖发光元件11的侧表面,并且在光吸收树脂6和光学元件安装之间布置有包括不与光吸收树脂6粘合的材料的非粘合层7 基板1。
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公开(公告)号:US20110243512A1
公开(公告)日:2011-10-06
申请号:US13126898
申请日:2009-06-11
申请人: Toshiaki Takai , Yukio Sakigawa , Shohei Hata
发明人: Toshiaki Takai , Yukio Sakigawa , Shohei Hata
IPC分类号: G02B6/36
CPC分类号: G02B6/4246 , G02B6/29367 , H01S5/005 , H01S5/02212 , H01S5/02228 , H01S5/02284 , H01S5/02296 , H01S2301/176
摘要: An optical module in a simple configuration is provided which can suppress optical crosstalk due to leakage light without causing characteristics deterioration and reliability decrease of light-emitting elements to thereby obtain appropriate light receiving sensitivity. In an optical module in which a plurality of light-emitting elements 11 and light-receiving elements 12 are mounted on an optical-element mounting substrate 1, a light-absorbing resin 6 to absorb light with a light-emission wavelength of the light-emitting elements 11 is arranged to cover side surfaces of the light-emitting elements 11 and a non-adhesive layer 7 including a material not adhesive to the light-absorbing resin 6 is arranged between the light-absorbing resin 6 and the optical-element mounting substrate 1.
摘要翻译: 提供一种简单结构的光模块,其可以抑制由于漏光引起的光串扰,而不会导致发光元件的特性劣化和可靠性降低,从而获得适当的光接收灵敏度。 在其中多个发光元件11和光接收元件12安装在光学元件安装基板1上的光学模块中,用于吸收发光波长的光的光吸收树脂6, 发光元件11布置成覆盖发光元件11的侧表面,并且在光吸收树脂6和光学元件安装之间布置有包括不与光吸收树脂6粘合的材料的非粘合层7 基板1。
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公开(公告)号:US08380075B2
公开(公告)日:2013-02-19
申请号:US12624470
申请日:2009-11-24
申请人: Yukio Sakigawa , Toshiaki Takai , Shohei Hata
发明人: Yukio Sakigawa , Toshiaki Takai , Shohei Hata
IPC分类号: H04B10/00
CPC分类号: G02B6/4215 , G02B6/4201 , G02B6/4214 , G02B6/423 , G02B6/424 , G02B6/4244 , G02B6/4245 , G02B6/4246 , G02B6/4253 , G02B6/4257 , G02B6/4259 , H04B10/40
摘要: There are provided a downsized and low-cost optical module used as a terminal for wavelength multiplexing optical transmission and one-core bidirectional optical transmission which transmits lights of plural wavelengths through one optical fiber, and a method of manufacturing the optical module. A base on which plural optical elements are mounted, and an optical multiplexer and demultiplexer having wavelength selection filters and mirrors formed on both surfaces of a substrate are prepared. Those two parts are packed into a package so that an optical element mounted surface and a filter surface are substantially parallel to each other, and the optical elements are arranged to emit or receive lights obliquely to the base. With this configuration, because the optical multiplexer and demultiplexer can be mounted in parallel to an X-Y plane, a package can be easily machined by using a lathe, thereby enabling a reduction in the costs.
摘要翻译: 提供了一种小型化和低成本的光模块,其用作通过一根光纤传输多种波长的光的波分复用光传输和单核双向光传输的终端,以及制造光模块的方法。 准备了安装有多个光学元件的基底,以及在基板的两个表面上形成有波长选择滤光器和反射镜的光复用器和解复用器。 这两个部件被包装成包装,使得光学元件安装表面和滤光器表面基本上彼此平行,并且光学元件布置成发射或接收与基部倾斜的光。 利用这种配置,由于光学复用器和解复用器可以平行于X-Y平面安装,所以可以通过使用车床来容易地加工封装,从而能够降低成本。
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公开(公告)号:US07991251B2
公开(公告)日:2011-08-02
申请号:US12494890
申请日:2009-06-30
申请人: Shohei Hata , Naoki Matsushima , Toshiaki Takai , Yukio Sakigawa , Satoshi Arai
发明人: Shohei Hata , Naoki Matsushima , Toshiaki Takai , Yukio Sakigawa , Satoshi Arai
CPC分类号: G02B6/29365 , G02B6/29367 , G02B6/4204 , G02B6/4246 , Y10T156/1052 , Y10T156/1089
摘要: A filter element includes a first glass substrate having a pair of parallel surfaces and a band pass filter arranged on one of the parallel surfaces, a pair of single-crystal substrates (Si wafers) each including a primary surface formed with a depression having an inclined surface with respect to the primary surface occupying at least one half of the opening of the depression, and a second glass substrate having an optical element. The primary surfaces of the single-crystal substrate pair are bonded to a pair of the surfaces of the glass substrate. The depressions are faced through the glass substrate and surround the band pass filter. By this configuration, the filter element can be mass produced with a high accuracy and a low cost by the wafer-level process.
摘要翻译: 过滤元件包括具有一对平行表面的第一玻璃基板和布置在一个平行表面上的带通滤波器,一对单晶基板(Si晶片),每个单晶基板包括形成有具有倾斜的凹陷的主表面 相对于占据凹部的开口的至少一半的主表面的表面,以及具有光学元件的第二玻璃基板。 单晶衬底对的主表面被接合到玻璃衬底的一对表面上。 凹陷面向玻璃基板并围绕带通滤光片。 通过这种构造,可以通过晶片级处理以高精度和低成本大量生产过滤元件。
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公开(公告)号:US20100002987A1
公开(公告)日:2010-01-07
申请号:US12494890
申请日:2009-06-30
申请人: Shohei HATA , Naoki MATSUSHIMA , Toshiaki TAKAI , Yukio SAKIGAWA , Satoshi ARAI
发明人: Shohei HATA , Naoki MATSUSHIMA , Toshiaki TAKAI , Yukio SAKIGAWA , Satoshi ARAI
CPC分类号: G02B6/29365 , G02B6/29367 , G02B6/4204 , G02B6/4246 , Y10T156/1052 , Y10T156/1089
摘要: A filter element includes a first glass substrate having a pair of parallel surfaces and a band pass filter arranged on one of the parallel surfaces, a pair of single-crystal substrates (Si wafers) each including a primary surface formed with a depression having an inclined surface with respect to the primary surface occupying at least one half of the opening of the depression, and a second glass substrate having an optical element. The primary surfaces of the single-crystal substrate pair are bonded to a pair of the surfaces of the glass substrate. The depressions are faced through the glass substrate and surround the band pass filter. By this configuration, the filter element can be mass produced with a high accuracy and a low cost by the wafer-level process.
摘要翻译: 过滤元件包括具有一对平行表面的第一玻璃基板和布置在一个平行表面上的带通滤波器,一对单晶基板(Si晶片),每个单晶基板包括形成有具有倾斜的凹陷的主表面 相对于占据凹部的开口的至少一半的主表面的表面,以及具有光学元件的第二玻璃基板。 单晶衬底对的主表面被接合到玻璃衬底的一对表面上。 凹陷面向玻璃基板并围绕带通滤光片。 通过这种构造,可以通过晶片级处理以高精度和低成本大量生产过滤元件。
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公开(公告)号:US08889441B2
公开(公告)日:2014-11-18
申请号:US13519590
申请日:2010-10-27
申请人: Toshiaki Takai , Yukio Sakigawa
发明人: Toshiaki Takai , Yukio Sakigawa
IPC分类号: H01L21/26 , H01L31/18 , H01L33/48 , H01L21/50 , H01L27/146 , H01L23/10 , H01L33/00 , H01S5/42 , H01L23/00 , H01S5/022
CPC分类号: H01L23/10 , H01L21/50 , H01L24/05 , H01L24/27 , H01L24/29 , H01L24/83 , H01L27/14618 , H01L33/0079 , H01L2224/04026 , H01L2224/05155 , H01L2224/05644 , H01L2224/2732 , H01L2224/2745 , H01L2224/29082 , H01L2224/291 , H01L2224/2919 , H01L2224/29294 , H01L2224/293 , H01L2224/29324 , H01L2224/29355 , H01L2224/29363 , H01L2224/29366 , H01L2224/32225 , H01L2224/32237 , H01L2224/83011 , H01L2224/83121 , H01L2224/83192 , H01L2224/83193 , H01L2224/8321 , H01L2224/83444 , H01L2224/83801 , H01L2224/8381 , H01L2224/83815 , H01L2224/83862 , H01L2924/01327 , H01L2924/09701 , H01L2924/12042 , H01L2924/15159 , H01L2924/181 , H01L2924/3511 , H01L2924/3651 , H01L2924/3656 , H01S5/02208 , H01S5/02272 , H01S5/02296 , H01S5/423 , H01L2924/014 , H01L2924/00014 , H01L2924/01006 , H01L2224/81121 , H01L2924/00013 , H01L2924/00015 , H01L2924/00
摘要: The invention provides a wafer-bonded semiconductor device wherein warpage generated when wafers are bonded is reduced at a low cost ad through a simple process.In a method for manufacturing a wafer-bonded semiconductor device by bonding a first wafer substrate and a second wafer substrate together, the method of the invention includes a first step of forming in advance bonding members having a bonding function when heated on the wafer-bonded surface sides of the first wafer substrate and the second wafer substrate, respectively; a second step of supplying flux paste containing two or more kinds of powdery materials having reactivity to the surfaces of the bonding members formed in the first step; and a third step of causing excitation to have the flux paste supplied in the second step start reacting.
摘要翻译: 本发明提供了一种晶片接合的半导体器件,其中通过简单的工艺以低成本的ad降低了晶片接合时产生的翘曲。 在通过将第一晶片基板和第二晶片基板接合在一起而制造晶片接合的半导体器件的方法中,本发明的方法包括:第一步骤,预先在晶片接合时加热时具有接合功能的接合部件 分别为第一晶片基板和第二晶片基板的表面侧; 第二步骤,向第一步骤中形成的接合部件的表面供给含有两种以上具有反应性的粉末状材料的助焊剂; 并且使在第二步骤中供给助焊剂糊料的激发开始反应的第三步骤。
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公开(公告)号:US20130029438A1
公开(公告)日:2013-01-31
申请号:US13519590
申请日:2010-10-27
申请人: Toshiaki Takai , Yukio Sakigawa
发明人: Toshiaki Takai , Yukio Sakigawa
CPC分类号: H01L23/10 , H01L21/50 , H01L24/05 , H01L24/27 , H01L24/29 , H01L24/83 , H01L27/14618 , H01L33/0079 , H01L2224/04026 , H01L2224/05155 , H01L2224/05644 , H01L2224/2732 , H01L2224/2745 , H01L2224/29082 , H01L2224/291 , H01L2224/2919 , H01L2224/29294 , H01L2224/293 , H01L2224/29324 , H01L2224/29355 , H01L2224/29363 , H01L2224/29366 , H01L2224/32225 , H01L2224/32237 , H01L2224/83011 , H01L2224/83121 , H01L2224/83192 , H01L2224/83193 , H01L2224/8321 , H01L2224/83444 , H01L2224/83801 , H01L2224/8381 , H01L2224/83815 , H01L2224/83862 , H01L2924/01327 , H01L2924/09701 , H01L2924/12042 , H01L2924/15159 , H01L2924/181 , H01L2924/3511 , H01L2924/3651 , H01L2924/3656 , H01S5/02208 , H01S5/02272 , H01S5/02296 , H01S5/423 , H01L2924/014 , H01L2924/00014 , H01L2924/01006 , H01L2224/81121 , H01L2924/00013 , H01L2924/00015 , H01L2924/00
摘要: The invention provides a wafer-bonded semiconductor device wherein warpage generated when wafers are bonded is reduced at a low cost ad through a simple process.In a method for manufacturing a wafer-bonded semiconductor device by bonding a first wafer substrate and a second wafer substrate together, the method of the invention includes a first step of forming in advance bonding members having a bonding function when heated on the wafer-bonded surface sides of the first wafer substrate and the second wafer substrate, respectively; a second step of supplying flux paste containing two or more kinds of powdery materials having reactivity to the surfaces of the bonding members formed in the first step; and a third step of causing excitation to have the flux paste supplied in the second step start reacting.
摘要翻译: 本发明提供了一种晶片接合的半导体器件,其中通过简单的工艺以低成本的ad降低了晶片接合时产生的翘曲。 在通过将第一晶片基板和第二晶片基板接合在一起而制造晶片接合的半导体器件的方法中,本发明的方法包括:第一步骤,预先在晶片接合时加热时具有接合功能的接合部件 分别为第一晶片基板和第二晶片基板的表面侧; 第二步骤,向第一步骤中形成的接合部件的表面供给含有两种以上具有反应性的粉末状材料的助焊剂; 并且使在第二步骤中供给助焊剂糊料的激发开始反应的第三步骤。
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公开(公告)号:US20100209103A1
公开(公告)日:2010-08-19
申请号:US12624470
申请日:2009-11-24
申请人: Yukio SAKIGAWA , Toshiaki TAKAI , Shohei HATA
发明人: Yukio SAKIGAWA , Toshiaki TAKAI , Shohei HATA
CPC分类号: G02B6/4215 , G02B6/4201 , G02B6/4214 , G02B6/423 , G02B6/424 , G02B6/4244 , G02B6/4245 , G02B6/4246 , G02B6/4253 , G02B6/4257 , G02B6/4259 , H04B10/40
摘要: There are provided a downsized and low-cost optical module used as a terminal for wavelength multiplexing optical transmission and one-core bidirectional optical transmission which transmits lights of plural wavelengths through one optical fiber, and a method of manufacturing the optical module. A base on which plural optical elements are mounted, and an optical multiplexer and demultiplexer having wavelength selection filters and mirrors formed on both surfaces of a substrate are prepared. Those two parts are packed into a package so that an optical element mounted surface and a filter surface are substantially parallel to each other, and the optical elements are arranged to emit or receive lights obliquely to the base. With this configuration, because the optical multiplexer and demultiplexer can be mounted in parallel to an X-Y plane, a package can be easily machined by using a lathe, thereby enabling a reduction in the costs.
摘要翻译: 提供了一种小型化和低成本的光模块,其用作通过一根光纤传输多种波长的光的波分复用光传输和单核双向光传输的终端,以及制造光模块的方法。 准备了安装有多个光学元件的基底,以及在基板的两个表面上形成有波长选择滤光器和反射镜的光复用器和解复用器。 这两个部件被包装成包装,使得光学元件安装表面和滤光器表面基本上彼此平行,并且光学元件布置成发射或接收与基部倾斜的光。 利用这种配置,由于光学复用器和解复用器可以平行于X-Y平面安装,所以可以通过使用车床来容易地加工封装,从而能够降低成本。
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