公开(公告)号：US20180163111A1

公开(公告)日：2018-06-14

申请号：US15378769

申请日：2016-12-14

Applicant: National Chung-Shan Institute of Science and Technology

Inventor： CHIEN-LIANG CHANG ,  WU-CHING HUNG ,  CHII-RONG YANG ,  CHANG-DA CHEN ,  CHIA CHENG

IPC: C09K5/14 ,  B01J19/08 ,  C08K3/04 ,  C08K3/28

CPC classification number: C09K5/14 ,  B01J2219/0888 ,  B01J2219/0894 ,  C08K3/042 ,  C08K3/28 ,  C08K2003/282 ,  C08K2201/001 ,  C08K2201/003 ,  C08L83/04

Abstract: A thermal conductive plastic material, comprising: a plastic solution; a first thermal conductive material, filled and distributed in the plastic solution, being processed by an Atmospheric Pressure Plasma (APP) technology, and having its surface provided with hydrophilic functional groups; and a second thermal conductive material, filled and distributed in the plastic solution, being processed by the Atmospheric Pressure Plasma (APP) technology or chemical modification, and having its surface provided with hydrophilic functional groups. Wherein, the first thermal conductive material is formed by ceramic powders, the second thermal conductive material is formed by carbon-containing ingredient, while the first thermal conductive material and the second thermal conductive material are in touch with each other.