公开(公告)号：US20240093020A1

公开(公告)日：2024-03-21

申请号：US17642656

申请日：2022-02-07

申请人： Risho Kogyo Co., Ltd.

发明人： Norihito Kuboyama

IPC分类号： C08L33/24 ,  C08J5/24 ,  C08K3/22 ,  C08K3/28 ,  C08K3/38 ,  C09J7/35 ,  C09J133/24

CPC分类号： C08L33/24 ,  C08J5/244 ,  C08K3/22 ,  C08K3/28 ,  C08K3/38 ,  C09J7/35 ,  C09J133/24 ,  C08K2003/2227 ,  C08K2003/282 ,  C08K2003/385 ,  C08K5/14 ,  C08L2205/05 ,  C08L2312/04

摘要： Provided is a thermosetting resin composition that can satisfy both low transmission loss and radiation performance even under the same curing conditions as those for conventional substrate materials for high-frequency applications, and also provided are an adhesive sheet, a prepreg, and a laminate.
The thermosetting resin composition comprises a maleimide compound having at least two maleimide groups per molecule, a polyphenylene ether compound having at least two reactive organic groups per molecule, a curing accelerator, and an inorganic filler, wherein the inorganic filler is low-sodium aluminum oxide, and the low-sodium aluminum oxide has an Na+ ion content of 10 ppm or less.

公开(公告)号：US11814521B2

公开(公告)日：2023-11-14

申请号：US17357690

申请日：2021-06-24

申请人： MOMENTIVE PERFORMANCE MATERIALS JAPAN LLC

发明人： Atsushi Sakamoto ,  Isao Iida

IPC分类号： C08L83/04 ,  C08K3/28 ,  C08K3/013 ,  C08L83/06 ,  C08G77/12 ,  C08G77/20

CPC分类号： C08L83/04 ,  C08K3/013 ,  C08K3/28 ,  C08L83/06 ,  C08G77/12 ,  C08G77/20 ,  C08K2003/282 ,  C08K2201/001 ,  C08K2201/003 ,  C08L2203/206 ,  C08L83/04 ,  C08L83/00 ,  C08L83/00 ,  C08K5/56 ,  C08K3/22

摘要： A thermally conductive polysiloxane composition comprising: (A) a thermally conductive filler; (B) a polyorganosiloxane resin having a curable functional group in the polysiloxane molecule, the polyorganosiloxane resin comprising at least one polysiloxane (b1) having one curable functional group in the molecule thereof; (C) a siloxane compound having an alkoxysilyl group and a linear siloxane structure; (D) a hydrogenpolyorganosiloxane; and (E) a platinum catalyst, wherein the content of the polysiloxane (b1) having one curable functional group in the molecule thereof in the polyorganosiloxane resin (B) is more than 80% by mass.

公开(公告)号：US20230287213A1

公开(公告)日：2023-09-14

申请号：US18119063

申请日：2023-03-08

申请人： RESONAC CORPORATION

发明人： Hajime FUNAHASHI ,  Hikaru SATOH ,  Hajime YUKUTAKE ,  Ikue KOBAYASHI ,  Takeshi IEMURA

IPC分类号： C08L75/04 ,  C08L33/08 ,  C08K3/22 ,  C08K3/28 ,  C08K9/06

CPC分类号： C08L75/04 ,  C08L33/08 ,  C08K3/22 ,  C08K3/28 ,  C08K9/06 ,  C08K2003/2227 ,  C08K2003/282 ,  C08K2201/014 ,  C08L2203/20 ,  C08K2201/003

摘要： A thermally conductive composition containing a filler and a polymer component, wherein the filler includes a filler (A) surface-treated with a silylated castor oil derivative obtained by reacting isocyanate silane with a castor oil-based polyol.

公开(公告)号：US20230227708A1

公开(公告)日：2023-07-20

申请号：US18002107

申请日：2021-06-11

申请人： Shin-Etsu Chemical Co., Ltd.

发明人： Yuya Hironaka ,  Yasuhisa Ishihara ,  Katsuyuki Tanaka

IPC分类号： C09K5/14 ,  C08G77/20 ,  C08G77/12 ,  C08K13/04

CPC分类号： C09K5/14 ,  C08G77/20 ,  C08G77/12 ,  C08K13/04 ,  C08K2003/282

摘要： One of the objects the present invention to provide a cured product of a thermally conductive silicone composition having high thermal conductivity and excellent compressibility. A silicone composition comprising an organo(poly)siloxane and a thermally conductive filler, wherein the organo(poly)siloxane comprises at least one curable organo(poly)siloxane, the thermally conductive filler comprises (B-i) unsintered aluminum nitride having an average particle size of 20 μm or more and 120 μm or less and (B-ii) alumina having an average particle size of 0.1 μm or more and 5 μm or less, the (B-ii) alumina comprises spherical alumina with 25 to 80 mass % of the spherical alumina, based on a total mass of the component (B-ii), a proportion of the component (B-ii) is 25 to 50 mass %, based on a total mass of the components (B-i) and (B-ii), and a proportion of a volume of the thermally conductive filler is 80 to 90 volume %, based on a total volume of the silicone composition.

公开(公告)号：US20190233702A1

公开(公告)日：2019-08-01

申请号：US16375994

申请日：2019-04-05

申请人： Huawei Technologies Co., Ltd. ,  Cambridge Enterprise Limited

发明人： Yan XU ,  Yue LIN ,  Steve HODGE ,  Andrea FERRARI

IPC分类号： C09K5/14 ,  C01B32/194 ,  C01B32/198 ,  C08G77/04 ,  C08K9/06 ,  C08K3/04 ,  C09C1/46

CPC分类号： C09K5/14 ,  B82Y30/00 ,  B82Y40/00 ,  C01B32/194 ,  C01B32/198 ,  C01B2204/04 ,  C01B2204/24 ,  C01B2204/32 ,  C01P2004/24 ,  C08G77/04 ,  C08G77/06 ,  C08K3/04 ,  C08K3/042 ,  C08K3/22 ,  C08K3/28 ,  C08K3/38 ,  C08K7/00 ,  C08K9/06 ,  C08K2003/282 ,  C08K2003/385 ,  C08K2201/001 ,  C08K2201/004 ,  C08K2201/005 ,  C08K2201/011 ,  C09C1/46 ,  C09C3/006 ,  C09C3/12

摘要： Functionalized graphene is provided. The functionalized graphene is graphene onto whose surface one or more active molecules are grafted, the active molecule includes a plurality of terminal functional groups, and the plurality of terminal functional groups include at least two active functional groups. Because the active functional groups can chemically react with molecules in silicone oil, the functionalized graphene can evenly dissolve in the silicone oil, so that polyorganosiloxane prepared by using the functionalized graphene has good heat conduction performance. In addition, this application further provides a preparation method of the functionalized graphene and corresponding polyorganosiloxane.

公开(公告)号：US20190023961A1

公开(公告)日：2019-01-24

申请号：US16037231

申请日：2018-07-17

申请人： Shin-Etsu Chemical Co., Ltd.

发明人： Kenichi INAFUKU

IPC分类号： C09K5/14 ,  C08G77/12 ,  C08K3/22

CPC分类号： C09K5/14 ,  C08G77/045 ,  C08G77/12 ,  C08G77/20 ,  C08K3/14 ,  C08K3/22 ,  C08K3/36 ,  C08K2003/2227 ,  C08K2003/2296 ,  C08K2003/282 ,  C08K2003/382 ,  C08K2201/001 ,  C09D183/04 ,  C08K5/544 ,  C08K5/5397 ,  C08K5/0025

摘要： One object of the invention is to improve the affinity between the silicone resin and the thermally conductive filler to facilitate mixing thereof. Another object of the invention is to suppress a viscosity increase of a silicone resin composition containing a high level of loading of thermally conductive filler, and to provide a cured product having a higher thermal conductivity. According to the invention, a thermally conductive silicone composition is provided, which comprises (A) an organopolysiloxane having two or more alkenyl groups each bonded to a silicon atom per molecule; (B) an organohydrogenpolysiloxane having two or more hydrogen atoms each bonded to a silicon atom per molecule in such an amount that the molar ratio of the hydrogen atoms each bonded to a silicon atom in component (B) to the alkenyl groups in component (A) is within the range of from 0.1 to 4; (C) 50 to 98% by mass, based on total weight of the composition, of a thermally conductive filler; and (D) a catalytic amount of a catalyst based on a platinum group metal, wherein the thermally conductive filler has a contact angle with water of at most 75° on the filler surface.

公开(公告)号：US20180272674A1

公开(公告)日：2018-09-27

申请号：US15926140

申请日：2018-03-20

申请人： TOYOTA JIDOSHA KABUSHIKI KAISHA

发明人： Megumi SASAKI ,  Hiromitsu TANAKA ,  Shinichi MIURA ,  Masataka DEGUCHI ,  Masaki TERADA ,  Tetsuyoshi FUKAYA

IPC分类号： B32B27/20 ,  B32B27/38 ,  C08L63/00

CPC分类号： B32B27/20 ,  B32B27/38 ,  B32B2305/026 ,  B32B2305/30 ,  B32B2307/302 ,  C08K3/013 ,  C08K3/38 ,  C08K2003/282 ,  C08K2003/385 ,  C08K2201/005 ,  C08L63/00

摘要： There is provided a thermally conductive composite material obtained by dispersing a thermally conductive filler in a matrix. The thermally conductive filler is a mixture including boron nitride particles with an average particle size of 10 μm to 100 μm and aluminum nitride particles with an average particle size that is 1/100 to ½ of the average particle size of the boron nitride particles, a content of the boron nitride particles is 60 volume % to 90 volume % with respect to a total amount of the boron nitride particles and the aluminum nitride particles, a content of the thermally conductive filler is 80 volume % to 95 volume % with respect to a total amount of the composite material, and a porosity of the composite material is 10 volume % or less.

公开(公告)号：US20170256353A1

公开(公告)日：2017-09-07

申请号：US15509852

申请日：2015-04-27

申请人： MODA-INNOCHIPS CO., LTD.

发明人： In Kil PARK ,  Gyeong Tae KIM ,  Seung Hun CHO ,  Jun Ho JUNG ,  Ki Joung NAM ,  Jung Gyu LEE

IPC分类号： H01F27/29 ,  H01F27/255 ,  H01F41/04 ,  H01F41/02 ,  H01F41/10 ,  H05K1/18 ,  H01F27/34 ,  C09K5/14 ,  C08K3/08 ,  C08K3/22 ,  C08K3/28 ,  C08K3/04 ,  B22F1/00 ,  B22F1/02 ,  C23C18/16 ,  C25D7/12 ,  B22F3/02 ,  B29C43/02 ,  B29C65/00 ,  H01F27/28

CPC分类号： C08K3/28 ,  B22F1/0062 ,  B22F1/02 ,  B22F3/02 ,  B22F2301/35 ,  B22F2302/25 ,  B22F2302/45 ,  B29C43/02 ,  B29C65/002 ,  B29L2031/34 ,  C08K3/04 ,  C08K3/08 ,  C08K3/22 ,  C08K2003/0856 ,  C08K2003/222 ,  C08K2003/282 ,  C08K2201/001 ,  C08K2201/01 ,  C09K5/14 ,  C23C18/1637 ,  C23C18/1653 ,  C25D7/123 ,  H01F17/0013 ,  H01F17/04 ,  H01F27/008 ,  H01F27/22 ,  H01F27/292 ,  H01F27/34 ,  H01F41/0233 ,  H01F41/041 ,  H01F41/10 ,  H01F2017/048 ,  H01F2027/2809 ,  H05K1/181 ,  H05K2201/1003

摘要： Provided are a power inductor including a body, a base disposed in the body, a coil disposed on the base, a first external electrode connected to the coil, the first external electrode being disposed on a side surface of the body, and a second external electrode connected to the first external electrode, the second external electrode being disposed on a bottom surface of the body and a method for manufacturing the same.

公开(公告)号：US20170226396A1

公开(公告)日：2017-08-10

申请号：US15501878

申请日：2014-09-22

申请人： Dow Global Technologies LLC

发明人： Yunfeng Yang ,  Hongyu Chen ,  Brad C. Bailey ,  Mohamed Esseghir ,  Suh Joon Han

IPC分类号： C09K5/10 ,  C08K3/28 ,  C08K3/22

CPC分类号： C09K5/10 ,  B01J31/22 ,  C08F4/659 ,  C08F4/65908 ,  C08F4/65912 ,  C08F110/02 ,  C08K3/22 ,  C08K3/28 ,  C08K2003/2227 ,  C08K2003/2296 ,  C08K2003/282 ,  C10M107/06 ,  C10M169/02 ,  C10M2201/0416 ,  C10M2201/0616 ,  C10M2201/0626 ,  C10M2201/0656 ,  C10M2205/0225 ,  C10M2229/041 ,  C10M2229/042 ,  C10M2229/045 ,  C10N2220/022 ,  C10N2220/028 ,  C10N2230/08 ,  C08F2500/10 ,  C08F2500/02 ,  C08F10/02 ,  C08F4/64193 ,  C08F210/16 ,  C08F210/06 ,  C08F2500/17 ,  C08L23/14 ,  C08L23/06 ,  C10M2205/0245 ,  C10M2205/0285

摘要： Disclosed is an effective thermal grease comprising a hyperbranched olefinic fluid and a thermally conductive filler. Property-modifying additives and fillers may also be included. The hyperbranched olefinic fluid is selected to have an average of at least 1.5 methine carbons per oligomer molecule and at least 40 methine carbons per one thousand total carbons. The thermal grease exhibits a flash point of 180° C. or higher, a pour point of 0° C. or lower, and a kinematic viscosity at 40° C. of no more than 200 cSt (0.0002 m 2/s). The composition may offer improved thermal conductivity, reduced tendency to migrate, and lower cost when compared with many other thermal greases, including silicone-based thermal greases.

公开(公告)号：US20160215124A1

公开(公告)日：2016-07-28

申请号：US14916283

申请日：2014-09-03

申请人： MITSUBISHI ENGINEERING-PLASTICS CORPORATION

发明人： Takahiro TAKANO ,  Ryusuke YAMADA ,  Shinichi AYUBA

IPC分类号： C08K13/04 ,  C09K5/14 ,  C23C22/82 ,  C08K13/06

CPC分类号： C08K13/04 ,  C08K3/22 ,  C08K3/24 ,  C08K3/28 ,  C08K3/38 ,  C08K7/14 ,  C08K13/06 ,  C08K2003/282 ,  C08K2003/385 ,  C08L77/06 ,  C09K5/14 ,  C23C18/1612 ,  C23C18/1641 ,  C23C18/1651 ,  C23C18/1653 ,  C23C18/204 ,  C23C22/82 ,  H05K1/0346 ,  H05K1/0373 ,  H05K3/185 ,  H05K2201/0129 ,  H05K2201/0209 ,  H05K2201/0215 ,  H05K2201/0236 ,  H05K2201/09118 ,  H05K2203/107

摘要： Provided is a thermoplastic resin composition capable of producing a resin molded article having high resistance to soldering heat, good platability (appearance of plating layer), high thermal conductivity and high volume resistivity. The thermoplastic resin composition includes, per (A) 100 parts by weight of crystallizable thermoplastic resin showing a melting point of 250° C. or higher when measured by differential scanning colorimetry (DSC) at a temperature elevation rate of 10° C./min; (B) 40 to 150 parts by weight of insulating thermal conductive filler showing a thermal conductivity of 10 w/m·K or larger; (C) 3 to 20 parts by weight of laser direct structuring additive; and (D) 10 to 130 parts by weight of titanium oxide; wherein a total content of the (B) insulating thermal conductive filler, the (C) laser direct structuring additive and the (D) titanium oxide is 40 to 65% by weight of the resin composition.

摘要翻译： 提供一种热塑性树脂组合物，其能够制造具有高耐焊接性，良好的镀覆性（镀层外观），高导热性和高体积电阻率的树脂模塑制品。 当通过差示扫描比色法（DSC）以10℃/ min的升温速度测量时，热塑性树脂组合物包含（A）100重量份可结晶热塑性树脂，其显示出250℃或更高的熔点 ; （B）40〜150重量份的导热率为10w / m·K以上的绝热导热填料; （C）3〜20重量份的激光直接结构添加剂; 和（D）10至130重量份的氧化钛; 其中（B）绝缘导热填料，（C）激光直接结构添加剂和（D）氧化钛的总含量为树脂组合物的40〜65重量％。