公开(公告)号：US5725640A

公开(公告)日：1998-03-10

申请号：US645743

申请日：1996-05-14

申请人： Nayan E. Joshi ,  John E. McCaskie ,  Michael T. Boyle

发明人： Nayan E. Joshi ,  John E. McCaskie ,  Michael T. Boyle

IPC分类号： C25D5/34 ,  C23C18/04 ,  C23C18/16 ,  C23C26/00 ,  C25D5/54 ,  C25D5/56 ,  C25D7/00 ,  H01L21/288 ,  H05K3/10 ,  H05K3/22 ,  H05K3/24 ,  H05K3/38 ,  H05K3/42 ,  C23C22/05 ,  C23C22/08

CPC分类号： C25D5/54 ,  H05K3/22 ,  H05K3/24 ,  H05K3/424 ,  H05K2203/0392 ,  H05K3/108 ,  H05K3/383

摘要： The disclosure relates to treating a self accelerating and replenishing immersion composition on a substrate with a neutralizing and reducing composition comprising an acid and a salt of an inorganic or organic amine, and then electrolytically coating the treated surface with a metal. The salts in one embodiment comprise salts of hydroxylamine or hydrazine and the acid comprises a mineral acid.

摘要翻译： 本公开涉及用包含酸和无机或有机胺的盐的中和和还原组合物在衬底上处理自加速和补充浸渍组合物，然后用金属电解涂覆处理的表面。 一个实施方案中的盐包括羟胺或肼的盐，酸包括无机酸。

公开(公告)号：US5543182A

公开(公告)日：1996-08-06

申请号：US389565

申请日：1995-02-16

申请人： Nayan Joshi ,  John E. McCaskie ,  Michael T. Boyle

发明人： Nayan Joshi ,  John E. McCaskie ,  Michael T. Boyle

IPC分类号： C25D5/34 ,  C23C18/04 ,  C23C18/16 ,  C23C26/00 ,  C25D5/54 ,  C25D5/56 ,  C25D7/00 ,  H01L21/288 ,  H05K3/10 ,  H05K3/22 ,  H05K3/24 ,  H05K3/38 ,  H05K3/42 ,  B05D1/18

CPC分类号： C25D5/54 ,  H05K3/22 ,  H05K3/24 ,  H05K3/424 ,  H05K2203/0392 ,  H05K3/108 ,  H05K3/383

摘要： A process for applying a metal coating to a non-conductive substrate without an electroless coating is disclosed. The process includes the step of: a. contacting said substrate with an activator comprising a noble metal/Group IVA metal sol to obtain a treated substrate; b. contacting said treated substrate with a self accelerating and replenishing immersion metal composition comprising a solution of (i) a soluble metal salt whose metal is more noble than said Group IVA metal, (ii) a Group IA metal hydroxide, (iii) a complexing agent comprising an organic material having a cumulative formation constant log K of from about 0.73 to about 21.95 for an ion of the metal of said metal salt. The Group IVA metal is employed in a stoichiometric excess compared to the noble metal, the excess Group IVA metal being in its lowest oxidation state. Self accelerating and replenishing non-formaldehyde immersion metal compositions are also disclosed. The composition is used in a two step process to electrolytically coat a nonconductive substrate. In the first step the conductivity of the substrate is increased by applying the composition to it. In the second step, the substrate treated with the composition is electrolytically coated with a metal.

摘要翻译： 公开了一种将金属涂层施加到不带无电涂层的非导电基底上的方法。 该过程包括以下步骤：a。 使所述衬底与包含贵金属/ IVA族金属溶胶的活化剂接触以获得经处理的衬底; b。 使所述经处理的基材与自加速和补充的浸入金属组合物接触，所述组合物包含（i）其金属比所述IVA族金属更贵的可溶性金属盐，（ii）IA族金属氢氧化物，（iii）络合剂 包括对于所述金属盐的金属的离子，累积形成常数log K为约0.73至约21.95的有机材料。 与贵金属相比，IVA族金属以化学计量过量使用，过量的IVA族金属处于其最低的氧化态。 还公开了自加速和补充非甲醛浸渍金属组合物。 该组合物用于电解涂覆非导电基材的两步法。 在第一步中，通过将组合物施加到基底上来增加基底的电导率。 在第二步骤中，用金属电解涂覆用组合物处理的基材。