Connector for a leadless electronic package
    2.
    发明授权
    Connector for a leadless electronic package 失效
    无引线电子封装的连接器

    公开(公告)号:US4334727A

    公开(公告)日:1982-06-15

    申请号:US182266

    申请日:1980-08-28

    CPC分类号: H05K7/1069

    摘要: The subject invention relates to a connector for electrically connecting a leadless electronic package to a printed circuit board. More particularly, the connector includes a frame-shape housing containing terminals having a circular contact section which engages the pads on the package. A clamp plate is also disclosed which secures the package and connector to the printed circuit board.

    摘要翻译: 本发明涉及一种用于将无引线电子封装电连接到印刷电路板的连接器。 更具体地,连接器包括框架形外壳,其包含具有接合封装上的焊盘的圆形接触部分的端子。 还公开了将封装和连接器固定到印刷电路板的夹板。

    Surface to surface connector
    3.
    发明授权
    Surface to surface connector 失效
    表面到表面连接器

    公开(公告)号:US4278311A

    公开(公告)日:1981-07-14

    申请号:US113926

    申请日:1980-01-21

    IPC分类号: H05K7/10 H01R23/72

    CPC分类号: H05K7/1069

    摘要: The present invention relates to a connector for connecting a semi-conductor chip carrier to a printed circuit board (PCB). More particularly, the invention comprises an insulating housing and a plurality of contact-bearing spring members positioned around the periphery of a central compartment in the housing. The spring member connects the leads on the chip package to traces on the PCB.

    摘要翻译: 本发明涉及用于将半导体芯片载体连接到印刷电路板(PCB)的连接器。 更具体地,本发明包括绝缘壳体和围绕壳体中心隔室的周边定位的多个接触轴承弹簧构件。 弹簧构件将芯片封装上的引线连接到PCB上的迹线。

    Active device substrate connector
    4.
    发明授权
    Active device substrate connector 失效
    有源器件基板连接器

    公开(公告)号:US4341433A

    公开(公告)日:1982-07-27

    申请号:US147766

    申请日:1980-05-08

    IPC分类号: H01R12/18 H05K7/10 H01R13/22

    CPC分类号: H05K7/1069

    摘要: The present invention relates to a connector of the type for electrically connecting an active device substrate unit for a PCB (printed circuit board). More particularly, the invention includes a dual-contact spring member having a buffer section so that forces exerted on one contact are not transmitted to the other contact.

    摘要翻译: 本发明涉及一种用于电连接用于PCB(印刷电路板)的有源器件基板单元的连接器。 更具体地,本发明包括具有缓冲部分的双接触弹簧部件,使得施加在一个接触件上的力不传递到另一接触件。

    Surface to surface connector
    5.
    发明授权
    Surface to surface connector 失效
    表面到表面连接器

    公开(公告)号:US4220383A

    公开(公告)日:1980-09-02

    申请号:US27567

    申请日:1979-04-06

    IPC分类号: H05K7/10 H05K1/12

    CPC分类号: H05K7/1069

    摘要: The present invention relates to a connector for connecting a semi-conductor chip carrier to a printed circuit board (PCB). More particularly, the invention comprises an insulating housing and a plurality of contact-bearing spring members positioned around the periphery of a central compartment in the housing. The spring member connects the leads on the chip package to traces on the PCB.

    摘要翻译: 本发明涉及用于将半导体芯片载体连接到印刷电路板(PCB)的连接器。 更具体地,本发明包括绝缘壳体和围绕壳体中心隔室的周边定位的多个接触轴承弹簧构件。 弹簧构件将芯片封装上的引线连接到PCB上的迹线。

    Electrical interconnect device
    6.
    发明授权
    Electrical interconnect device 失效
    电气互连器件

    公开(公告)号:US4262986A

    公开(公告)日:1981-04-21

    申请号:US75292

    申请日:1979-09-12

    IPC分类号: H01R4/02 H01R4/14 H01R13/24

    CPC分类号: H01R12/714 H01R4/02 H01R4/14

    摘要: The present invention relates to an interconnect device to provide electrical connections between printed circuit boards or a supported flexible circuit board and a wire wrap connection or solder tail connection or the like. More specifically the preferred embodiment of the invention includes a device, stamped and formed from a coplanar strip of conductive material and having a double thickness leg on top of which is an elongated spring arm formed into a rectangular shape to reduce the height it occupies in a housing while providing high spring force. Additionally, stress-distribution means is incorporated into the device.

    摘要翻译: 本发明涉及一种用于提供印刷电路板或支撑的柔性电路板之间的电连接以及线缠绕连接或焊尾连接等的互连装置。 更具体地说,本发明的优选实施例包括一个冲压并由共面的导电材料条形成的装置,并且具有双层厚度的腿,其上面是细长的弹簧臂,形成为矩形形状,以减小它在一个 同时提供高弹簧力。 此外,应力分布装置被并入设备中。

    Connector for a ceramic substrate
    7.
    发明授权
    Connector for a ceramic substrate 失效
    陶瓷基板连接器

    公开(公告)号:US4346952A

    公开(公告)日:1982-08-31

    申请号:US159429

    申请日:1980-06-16

    IPC分类号: H01R12/71 H05K7/10 H01R9/09

    CPC分类号: H05K7/1069

    摘要: The present invention relates to a connector for holding a ceramic substrate and for electrically connecting its circuits to a printed circuit board. More particularly, the connector includes a housing containing a plurality of cells, contact carrying spring members positioned in the cells and a cover which loads the substrate against spring members. The spring members have a pin for insertion into a printed circuit board and a preloaded upper section for substrate engagement.

    摘要翻译: 本发明涉及一种用于保持陶瓷基板并将其电路电连接到印刷电路板的连接器。 更具体地,连接器包括容纳多个单元的壳体,位于单元中的接触弹簧构件和将基板抵靠弹簧构件加载的盖。 弹簧构件具有用于插入印刷电路板的引脚和用于基板接合的预加载的上部。

    Electrical connector
    9.
    发明授权
    Electrical connector 失效
    电连接器

    公开(公告)号:US4657325A

    公开(公告)日:1987-04-14

    申请号:US835834

    申请日:1986-02-27

    IPC分类号: H05K7/10 H01R23/72

    CPC分类号: H05K7/1069 H01R12/714

    摘要: An electrical connector for electrically interconnecting conductive pads on a printed circuit board and an electronic package located in an opening in the board and for biasing the electronic package against a cooling substructure on which it rests. More particularly, the connector includes a housing having downwardly extending walls for abutting and biasing the electronic package against the substructure and a plurality of contact elements having spring members which electrically engage respective conductive pads on the electronic package and surrounding circuit board.

    摘要翻译: 一种电连接器,用于将印刷电路板上的导电焊盘和位于所述板中的开口中的电子封装电互连,并且用于将所述电子封装抵靠在其上搁置的冷却子结构上。 更具体地,连接器包括具有向下延伸的壁的壳体,用于抵靠和偏置电子封装抵靠子结构,以及多个具有弹簧构件的接触元件,其电耦合电子封装和周围电路板上的各个导电焊盘。

    Connecting element for surface to surface connectors
    10.
    发明授权
    Connecting element for surface to surface connectors 失效
    连接元件用于表面连接器

    公开(公告)号:US4161346A

    公开(公告)日:1979-07-17

    申请号:US935839

    申请日:1978-08-22

    IPC分类号: H01R13/22 H01R31/00 H05K1/12

    CPC分类号: H01R12/714 H01R31/00

    摘要: The present invention relates to a connecting element of the type for interconnecting electrical circuits on two electronic component-carrying devices such as printed circuit boards and substrate devices. More particularly the invention discloses a connecting element having a symmetrical, sinuous shape so as to provide a spring section for exerting a determined contact force. Further, the connecting element has, as an integral part thereof, a shorting beam to provide a shorter electrical path and to provide a spring means to hold the element in a housing.

    摘要翻译: {PG,1]本发明涉及用于在诸如印刷电路板和基板装置的两个电子元件承载装置上互连电路的类型的连接元件。 更具体地,本发明公开了一种具有对称的,弯曲形状的连接元件,以便提供用于施加确定的接触力的弹簧部分。 此外,连接元件作为其整体部分具有短路梁以提供较短的电路径并且提供将元件保持在壳体中的弹簧装置。