公开(公告)号：US07254510B2

公开(公告)日：2007-08-07

申请号：US11498544

申请日：2006-08-02

申请人： Neil Benjamin ,  Richard Alan Gottscho ,  Nicolas Bright ,  Robert Steger

发明人： Neil Benjamin ,  Richard Alan Gottscho ,  Nicolas Bright ,  Robert Steger

IPC分类号： G06F19/00

CPC分类号： G01R31/3187 ,  G05B19/4184 ,  G05B2219/31362 ,  G05B2219/31463 ,  Y02P90/14 ,  Y02P90/86

摘要： A method of component management in a substrate processing system is disclosed. The substrate processing system has a set of components, at least a plurality of components of the set of components being designated to be smart components, each component of the plurality of components having an intelligent component enhancement (ICE). The method includes querying the plurality of components to request their respective unique identification data from their respective ICEs. The method further includes receiving unique identification data from the plurality of components if any of the plurality of components responds to the querying. The method additionally includes flagging the first component for corrective action if a first component of the plurality of components fails to provide first component unique identification data when the first component identification data is expected.

摘要翻译： 公开了一种基板处理系统中的部件管理方法。 衬底处理系统具有一组组件，该组组件中的至少多个组件被指定为智能组件，多个组件的每个组件具有智能组件增强（ICE）。 该方法包括查询多个组件以从它们各自的ICE请求它们各自的唯一标识数据。 该方法还包括如果多个组件中的任何组件响应于查询，则从多个组件接收唯一的标识数据。 该方法另外包括：如果在预期第一组件识别数据时多个组件的第一组件不能提供第一组件唯一标识数据，则标记第一组件以用于校正动作。

公开(公告)号：US07152011B2

公开(公告)日：2006-12-19

申请号：US10927161

申请日：2004-08-25

申请人： Neil Benjamin ,  Richard Alan Gottscho ,  Nicolas Bright ,  Robert Steger

发明人： Neil Benjamin ,  Richard Alan Gottscho ,  Nicolas Bright ,  Robert Steger

IPC分类号： G06F19/00

CPC分类号： G01R31/3187 ,  G05B19/4184 ,  G05B2219/31362 ,  G05B2219/31463 ,  Y02P90/14 ,  Y02P90/86

摘要： A method of component management in a substrate processing system is disclosed. The substrate processing system has a set of components, at least a plurality of components of the set of components being designated to be smart components, each component of the plurality of components having an intelligent component enhancement (ICE). The method includes querying the plurality of components to request their respective unique identification data from their respective ICEs. The method further includes receiving unique identification data from the plurality of components if any of the plurality of components responds to the querying. The method additionally includes flagging the first component for corrective action if a first component of the plurality of components fails to provide first component unique identification data when the first component identification data is expected.

摘要翻译： 公开了一种基板处理系统中的部件管理方法。 衬底处理系统具有一组组件，该组组件中的至少多个组件被指定为智能组件，多个组件的每个组件具有智能组件增强（ICE）。 该方法包括查询多个组件以从它们各自的ICE请求它们各自的唯一标识数据。 该方法还包括如果多个组件中的任何组件响应于查询，则从多个组件接收唯一的标识数据。 该方法另外包括：如果在预期第一组件识别数据时多个组件的第一组件不能提供第一组件唯一标识数据，则标记第一组件以用于校正动作。

公开(公告)号：US20060047458A1

公开(公告)日：2006-03-02

申请号：US10927161

申请日：2004-08-25

申请人： Neil Benjamin ,  Richard Gottscho ,  Nicolas Bright ,  Robert Steger

发明人： Neil Benjamin ,  Richard Gottscho ,  Nicolas Bright ,  Robert Steger

IPC分类号： G06F19/00

CPC分类号： G01R31/3187 ,  G05B19/4184 ,  G05B2219/31362 ,  G05B2219/31463 ,  Y02P90/14 ,  Y02P90/86

摘要： A method of component management in a substrate processing system is disclosed. The substrate processing system has a set of components, at least a plurality of components of the set of components being designated to be smart components, each component of the plurality of components having an intelligent component enhancement (ICE). The method includes querying the plurality of components to request their respective unique identification data from their respective ICEs. The method further includes receiving unique identification data from the plurality of components if any of the plurality of components responds to the querying. The method additionally includes flagging the first component for corrective action if a first component of the plurality of components fails to provide first component unique identification data when the first component identification data is expected.

公开(公告)号：US20060271325A1

公开(公告)日：2006-11-30

申请号：US11498544

申请日：2006-08-02

申请人： Neil Benjamin ,  Richard Gottscho ,  Nicolas Bright ,  Robert Steger

发明人： Neil Benjamin ,  Richard Gottscho ,  Nicolas Bright ,  Robert Steger

IPC分类号： G01R31/14

CPC分类号： G01R31/3187 ,  G05B19/4184 ,  G05B2219/31362 ,  G05B2219/31463 ,  Y02P90/14 ,  Y02P90/86

摘要： A method of component management in a substrate processing system is disclosed. The substrate processing system has a set of components, at least a plurality of components of the set of components being designated to be smart components, each component of the plurality of components having an intelligent component enhancement (ICE). The method includes querying the plurality of components to request their respective unique identification data from their respective ICEs. The method further includes receiving unique identification data from the plurality of components if any of the plurality of components responds to the querying. The method additionally includes flagging the first component for corrective action if a first component of the plurality of components fails to provide first component unique identification data when the first component identification data is expected.

公开(公告)号：US08963052B2

公开(公告)日：2015-02-24

申请号：US12436443

申请日：2009-05-06

申请人： Neil Benjamin ,  Robert Steger

发明人： Neil Benjamin ,  Robert Steger

IPC分类号： H05B3/68 ,  H01L21/302 ,  C23C16/00 ,  H01L21/687 ,  H01L21/67 ,  H01L21/683

CPC分类号： H01L21/67248 ,  H01J37/32724 ,  H01J2237/2001 ,  H01J2237/334 ,  H01L21/67069 ,  H01L21/67103 ,  H01L21/6833 ,  H01L21/68714

摘要： A chuck for a plasma processor comprises a temperature-controlled base, a thermal insulator, a flat support, and a heater. The temperature-controlled base is controlled in operation a temperature below the desired temperature of a workpiece. The thermal insulator is disposed over at least a portion of the temperature-controlled base. The flat support holds a workpiece and is disposed over the thermal insulator. A heater is embedded within the flat support and/or mounted to an underside of the flat support. The heater includes a plurality of heating elements that heat a plurality of corresponding heating zones. The power supplied and/or temperature of each heating element is controlled independently. The heater and flat support have a combined temperature rate change of at least 1° C. per second.

摘要翻译： 用于等离子体处理器的卡盘包括温度控制的基座，绝热体，平坦的支架和加热器。 温度控制的基座在工作温度下控制在低于工件所需温度的温度。 热绝缘体设置在温度受控基底的至少一部分上。 平面支撑件保持工件并且设置在绝热体上方。 加热器嵌入在平坦支撑件内和/或安装到平坦支撑件的下侧。 加热器包括多个加热元件，其加热多个相应的加热区。 每个加热元件的供电功率和/或温度都是独立控制的。 加热器和平坦支架的组合温度变化率每秒至少1℃。

公开(公告)号：US20050030524A1

公开(公告)日：2005-02-10

申请号：US10636086

申请日：2003-08-06

申请人： Andrew Perry ,  Robert Steger ,  Neil Benjamin

发明人： Andrew Perry ,  Robert Steger ,  Neil Benjamin

IPC分类号： G01C1/00 ,  H01L21/68 ,  G01B11/26

CPC分类号： G01C1/00 ,  H01J2237/30438 ,  H01L21/681

摘要： An optical alignment system for use in a semiconductor processing system is provided. The optical alignment system includes a wafer chuck that has an alignment feature integrated into the top surface of the wafer chuck. In addition, a beam-forming system, which is capable of emitting an optical signal onto the alignment feature, is disposed above the wafer chuck. Also, a detector is included that can detect an amplitude of the optical signal emitted onto the alignment feature. In one aspect, the alignment feature can be a reflective alignment feature that reflects a portion of the optical signal back to the beam detector. In additional aspect, the alignment feature can be a transmittance alignment feature capable of allowing a portion of the optical signal to pass through the wafer chuck to the detector. In this aspect, the detector can be disposed below the wafer chuck.

摘要翻译： 提供一种用于半导体处理系统的光学对准系统。 光学对准系统包括具有集成到晶片卡盘的顶表面中的对准特征的晶片卡盘。 此外，能够将光信号发射到对准特征上的波束形成系统设置在晶片卡盘上方。 而且，包括可以检测发射到对准特征上的光信号的幅度的检测器。 在一个方面，对准特征可以是将光信号的一部分反射回光束检测器的反射对准特征。 在另外的方面，对准特征可以是能够允许光信号的一部分通过晶片卡盘到达检测器的透射率对准特征。 在这方面，检测器可以设置在晶片卡盘的下方。

公开(公告)号：US07274004B2

公开(公告)日：2007-09-25

申请号：US11001218

申请日：2004-11-30

申请人： Neil Benjamin ,  Robert Steger

发明人： Neil Benjamin ,  Robert Steger

IPC分类号： H05B3/68 ,  C23C16/00

CPC分类号： H01J37/20 ,  H01J2237/2001 ,  H01L21/67103 ,  H01L21/67248

摘要： A chuck for a plasma processor comprises a temperature-controlled base, a thermal insulator, a flat support, and a heater. The temperature-controlled base has a temperature below the desired temperature of a workpiece. The thermal insulator is disposed over the temperature-controlled base. The flat-support holds a workpiece and is disposed over the thermal insulator. A heater is embedded within the flat support and/or disposed on an underside of the flat support. The heater includes a plurality of heating elements that heat a plurality of corresponding heating zones. The power supplied and/or temperature of each heating element is controlled independently.

摘要翻译： 用于等离子体处理器的卡盘包括温度控制的基座，绝热体，平坦的支架和加热器。 温度控制的基座的温度低于工件所需的温度。 热绝缘体设置在温度控制的基座上。 平坦支撑件保持工件并设置在绝热体上。 加热器嵌入在平坦支撑件内和/或设置在平坦支撑件的下侧上。 加热器包括多个加热元件，其加热多个相应的加热区。 每个加热元件的供电功率和/或温度都是独立控制的。

公开(公告)号：US06847014B1

公开(公告)日：2005-01-25

申请号：US10062395

申请日：2002-02-01

申请人： Neil Benjamin ,  Robert Steger

发明人： Neil Benjamin ,  Robert Steger

IPC分类号： H01L21/00 ,  H05B3/68

CPC分类号： H01L21/67248 ,  H01J2237/2001 ,  H01L21/67103

摘要： A chuck for a plasma processor comprises a temperature-controlled base, a thermal insulator, a flat support, and a heater. The temperature-controlled base has a temperature below the desired temperature of a workpiece. The thermal insulator is disposed over the temperature-controlled base. The flat support holds a workpiece and is disposed over the thermal insulator. A heater is embedded within the flat support and/or disposed on an underside of the flat support. The heater includes a plurality of heating elements that heat a plurality of corresponding heating zones. The power supplied and/or temperature of each heating element is controlled independently.

公开(公告)号：US20090215201A1

公开(公告)日：2009-08-27

申请号：US12436443

申请日：2009-05-06

申请人： Neil Benjamin ,  Robert Steger

发明人： Neil Benjamin ,  Robert Steger

IPC分类号： H01L21/465 ,  H01L21/66

CPC分类号： H01L21/67248 ,  H01J37/32724 ,  H01J2237/2001 ,  H01J2237/334 ,  H01L21/67069 ,  H01L21/67103 ,  H01L21/6833 ,  H01L21/68714

摘要： A chuck for a plasma processor comprises a temperature-controlled base, a thermal insulator, a flat support, and a heater. The temperature-controlled base is controlled in operation a temperature below the desired temperature of a workpiece. The thermal insulator is disposed over at least a portion of the temperature-controlled base. The flat support holds a workpiece and is disposed over the thermal insulator. A heater is embedded within the flat support and/or mounted to an underside of the flat support. The heater includes a plurality of heating elements that heat a plurality of corresponding heating zones. The power supplied and/or temperature of each heating element is controlled independently. The heater and flat support have a combined temperature rate change of at least 1° C. per second.

摘要翻译： 用于等离子体处理器的卡盘包括温度控制的基座，绝热体，平坦的支架和加热器。 温度控制的基座在工作温度下控制在低于工件所需温度的温度。 热绝缘体设置在温度受控基底的至少一部分上。 平面支撑件保持工件并且设置在绝热体上方。 加热器嵌入在平坦支撑件内和/或安装到平坦支撑件的下侧。 加热器包括多个加热元件，其加热多个相应的加热区。 每个加热元件的供电功率和/或温度都是独立控制的。 加热器和平坦支架的组合温度变化率每秒至少1℃。

公开(公告)号：US08536494B2

公开(公告)日：2013-09-17

申请号：US11001219

申请日：2004-11-30

申请人： Neil Benjamin ,  Robert Steger

发明人： Neil Benjamin ,  Robert Steger

IPC分类号： H05B3/68 ,  C23C16/00

CPC分类号： H01J37/20 ,  H01J2237/2001 ,  H01L21/67103 ,  H01L21/67248

摘要： A chuck for a plasma processor comprises a temperature-controlled base, a thermal insulator, a flat support, and a heater. The temperature-controlled base has a temperature below the desired temperature of a workpiece. The thermal insulator is disposed over the temperature-controlled base. The flat support holds a workpiece and is disposed over the thermal insulator. A heater is embedded within the flat support and/or disposed on an underside of the flat support. The heater includes a plurality of heating elements that heat a plurality of corresponding heating zones. The power supplied and/or temperature of each heating element is controlled independently.

摘要翻译： 用于等离子体处理器的卡盘包括温度控制的基座，绝热体，平坦的支架和加热器。 温度控制的基座的温度低于工件所需的温度。 热绝缘体设置在温度控制的基座上。 平面支撑件保持工件并且设置在绝热体上方。 加热器嵌入在平坦支撑件内和/或设置在平坦支撑件的下侧上。 加热器包括多个加热元件，其加热多个相应的加热区。 每个加热元件的供电功率和/或温度都是独立控制的。