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公开(公告)号：US5556553A
公开(公告)日：1996-09-17
申请号：US447752
申请日：1995-05-23
CPC分类号： C23F1/46
摘要： A process for control of recycle of ammoniacal copper etchant which uses metallic aluminum to remove copper without substantially adding undesirable byproducts, by controlling the temperature and mixture rate of the removal process. The very rapid reaction can be controlled by using a diluent of copper-free etchant, heating to process temperature, then adding spent, copper containing etchant at a controlled rate while actively cooling the system to control the temperature. The copper concentration can be monitored by colorimetry while maintaining the pH above pH 8. The separated metallic copper and aluminum hydroxide sludge are easily filtered from the etchant. The purified etchant is now suitable for chemical adjustment and reuse.
摘要翻译： 用于控制氨铜腐蚀剂的再循环的方法，其通过控制除去过程的温度和混合速率，其使用金属铝去除铜而基本上不加入不需要的副产物。 可以通过使用无铜蚀刻剂的稀释剂，加热至加工温度，然后以有控制的速率加入废铜的蚀刻剂，同时主动冷却系统以控制温度，来控制非常快的反应。 可以通过比色法监测铜浓度，同时保持pH高于pH8。分离的金属铜和氢氧化铝污泥容易从蚀刻剂中过滤。 纯化的蚀刻剂现在适用于化学调整和再利用。
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公开(公告)号：US5524780A
公开(公告)日：1996-06-11
申请号：US381510
申请日：1995-01-31
IPC分类号： C23F1/46
CPC分类号： C23F1/46
摘要： A method of improved control of recycle of ammoniacal copper etchant which uses metallic aluminum to remove copper without substantially adding undesirable byproducts. The very rapid reaction can be controlled by using a diluent of copper-free etchant, eliminating overheating. The separated copper and aluminum hydroxide sludge are easily filtered from the etchant. The purified etchant is now suitable for chemical adjustment and reuse.
摘要翻译： 一种改进控制氨铜腐蚀剂的方法，其使用金属铝去除铜而基本上不增加不期望的副产物。 通过使用无铜蚀刻剂的稀释剂可以控制非常快的反应，从而消除过热。 分离的铜和氢氧化铝污泥容易从蚀刻剂过滤。 纯化的蚀刻剂现在适用于化学调整和再利用。
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公开(公告)号：US5322553A
公开(公告)日：1994-06-21
申请号：US20618
申请日：1993-02-22
CPC分类号： C23C18/44 , Y10T428/12944
摘要： An electroless silver plating solution comprises a silver(I) complex, a thiosulfate salt, and a sulfite salt. This electroless silver plating solution uses a novel reducing agent combination of thiosulfate and sulfite. It shows a plating rate and a plating solution stability far superior to those of conventional silver plating solutions containing formaldehyde, reducing sugars, borohydride, hydrazine, and other reducing agents.
摘要翻译： 无电镀银溶液包含银（I）络合物，硫代硫酸盐和亚硫酸盐。 该无电镀银溶液使用硫代硫酸盐和亚硫酸盐的新型还原剂组合。 其显示电镀速率和电镀液稳定性远优于含有甲醛，还原糖，硼氢化物，肼和其它还原剂的常规镀银溶液的电镀速率和镀液稳定性。
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公开(公告)号：US5318621A
公开(公告)日：1994-06-07
申请号：US104723
申请日：1993-08-11
CPC分类号： C23C18/42
摘要： An electroless silver or gold plating solution comprising a noncyanide metal complex, a thiosulfate, a sulfite, and at least one amino acid. These electroless plating solutions containing an amino acid exhibit an accelerated plating rate compared to identical solutions lacking amino acids.
摘要翻译： 包含非氰化物金属络合物，硫代硫酸盐，亚硫酸盐和至少一种氨基酸的无电镀银或金镀液。 与不含氨基酸的相同溶液相比，含有氨基酸的这些化学镀溶液显示出加速镀覆速率。
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公开(公告)号：US5505872A
公开(公告)日：1996-04-09
申请号：US447811
申请日：1995-05-23
摘要： This invention relates to the removal of lead from spent ferric nitrate based solder strippers, the regeneration of the spent ferric nitrate based solder strippers, and the reuse of these solutions at least one time. It comprises a method and process for precipitating lead salts from used acidic solder strippers which are employed to strip solder coatings, including the underlying tin-copper alloy, from the copper substrate of a printed circuit board. The method includes the use of sulfate ions which are directly added to an aqueous solution of spent solder stripper, without neutralization of the spent solder stripper, optionally in combination with nitric or methylsulfonic acid addition. After precipitation and removal of the lead salts, additional components of the solder stripper composition may be added to substantially restore the initial functioning of the solder stripper.
摘要翻译： 本发明涉及从废硝酸铁基焊料剥离器中去除铅，再生废硝酸铁基焊料剥离剂，以及至少一次这些溶液的再利用。 它包括用于从使用的酸性焊料剥离剂中沉淀铅盐的方法和方法，其用于从印刷电路板的铜基板剥离包括下面的锡 - 铜合金的焊料涂层。 该方法包括使用硫酸根离子，其直接添加到废焊料剥离剂的水溶液中，而不中和废焊料剥离剂，任选地与硝酸或甲基磺酸添加组合。 在沉淀和除去铅盐之后，可以加入焊料剥离剂组合物的附加组分以基本上恢复焊料剥离器的初始功能。
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6.发明授权Low corrosivity catalyst containing ammonium ions for activation of copper for electroless nickel plating 失效含有铵离子的低腐蚀性催化剂用于化学镀镍的铜活化
公开(公告)号：US5219815A
公开(公告)日：1993-06-15
申请号：US763634
申请日：1991-09-23
申请人： Gerald A. Krulik , Nenad V. Mandich
发明人： Gerald A. Krulik , Nenad V. Mandich
CPC分类号： H05K3/244 , C23C18/1831 , C23C18/31 , C23C18/32 , C23C18/54
摘要： This invention relates to electroless nickel plating of metals which are normally noncatalytic for electroless nickel initiation. It is especially useful in the electronics industry, such as for production of electroless nickel/electroless gold tabs or surface mount pads on printed circuit boards, and for use in electroless nickel plating over copper for radiofrequency interference shielding. More particularly, it comprises ammonium halide salt solutions of a palladium salt with another Group VIII precious metal salt and acid and optionally an alkali halide salt for effectively and completely catalyzing the initiation of electroless nickel plating on copper substrates.
摘要翻译： 本发明涉及通常用于非电解镍引发的非催化剂的金属的无电镀镍。 它在电子工业中特别有用，例如在印刷电路板上生产化学镀镍/无电镀金片或表面安装焊盘，以及用于铜上的无电镀镍以用于射频干扰屏蔽。 更具体地，它包括钯盐与另一种VIII族贵金属盐的卤化铵盐溶液和酸以及任选的卤化碱盐，用于有效和完全地催化在铜基底上开始化学镀镍。
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公开(公告)号：US5232492A
公开(公告)日：1993-08-03
申请号：US824076
申请日：1992-01-23
申请人： Gerald A. Krulik , Nenad V. Mandich
发明人： Gerald A. Krulik , Nenad V. Mandich
IPC分类号： C23C18/44
CPC分类号： C23C18/44
摘要： An electroless gold plating solution comprising a gold(I) complex, a thiosulfate, a sulfite, a pH regulator and an oxidation controller. The electroless gold plating solution uses a novel reducing agent system, the thiosulfate-sulfite-sulfate system. It shows a plating rate and a plating solution stability comparable to those of conventional gold plating solutions containing borohydride, thiourea, hydrazine, and other reducing agents.
摘要翻译： 包含金（I）配合物，硫代硫酸盐，亚硫酸盐，pH调节剂和氧化控制剂的无电镀金液。 化学镀镀液采用新型还原剂体系，即硫代硫酸盐 - 硫酸亚硫酸盐体系。 它显示了与含有硼氢化物，硫脲，肼和其它还原剂的常规镀金溶液相当的电镀速率和电镀溶液稳定性。
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8.发明授权Low corrosivity catalyst for activation of copper for electroless nickel plating 失效用于化学镀镍活化铜的低腐蚀性催化剂
公开(公告)号：US5212138A
公开(公告)日：1993-05-18
申请号：US763646
申请日：1991-09-23
申请人： Gerald A. Krulik , Nenad V. Mandich
发明人： Gerald A. Krulik , Nenad V. Mandich
CPC分类号： H05K3/244 , C23C18/1831 , C23C18/31 , C23C18/32
摘要： This invention relates to electroless nickel plating of metals which are normally noncatalytic for electroless nickel initiation. It is especially useful in the electronics industry, including production of electroless nickel/electroless gold tabs or surface mount pads on printed circuit boards, and for use in electroless nickel plating over copper for radiofrequency interference shielding. More particularly, it comprises alkali halide salt solutions of a palladium salt with another Group VIII precious metal salt in an inorganic acid solution for effectively and completely catalyzing the initiation of electroless nickel plating on copper substrates.
摘要翻译： 本发明涉及通常用于非电解镍引发的非催化剂的金属的无电镀镍。 它在电子工业中特别有用，包括在印刷电路板上生产化学镀镍/无电镀金片或表面安装焊盘，并用于铜上的无电镀镍以用于射频干扰屏蔽。 更具体地说，它在无机酸溶液中包含钯盐与另一种VIII族贵金属盐的碱金属卤化物盐溶液，用于有效且完全催化在铜基底上引发无电镀镍。
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