Bismaleimide Compound, Composition Containing Same, Polybenzoxazole, And Semiconductor Device

    公开(公告)号:US20230305400A1

    公开(公告)日:2023-09-28

    申请号:US18107285

    申请日:2023-02-08

    IPC分类号: G03F7/039 C08L77/10

    摘要: An object is to provide a novel bismaleimide compound. The solution is a bismaleimide compound represented by formula (1):





    wherein A1 represents a direct bond, a divalent linking group represented by formula (1-1), (1-2), or (1-3):















    wherein ring a represents a benzene ring or a cyclohexane ring; X represents a direct bond or a divalent linking group; Z represents a monovalent substituent bonded to ring a; p, q, and r are the number of substituents Z, p and q represent an integer of 0 to 3, and r represents an integer of 0 to 2; or a divalent linking group other than this; at least one of a plurality of A1s is a divalent linking group represented by formula (1-1), (1-2), or (1-3); A2 represents a divalent linking group obtained by removing two carboxy groups from an aromatic dicarboxylic acid compound; Y represents a divalent linking group; and n is an average value of the number of repeating units and is a real number in a range of 1 to 100.

    Bismaleimide Compound, Composition Containing Same, Polybenzoxazole, And Semiconductor Device

    公开(公告)号:US20230250233A1

    公开(公告)日:2023-08-10

    申请号:US18107286

    申请日:2023-02-08

    摘要: An object is to provide a novel bismaleimide compound. The solution is a bismaleimide compound represented by formula (1):






    wherein A1 represents a direct bond, a divalent linking group represented by formula (1-1), (1-2), or (1-3):










    wherein ring a represents a benzene ring or a cyclohexane ring; X represents a direct bond or a divalent linking group; and Z represents a monovalent substituent; or a divalent linking group other than this; at least one of a plurality of A1s is formula (1-1), (1-2), or (1-3); A2 represents a divalent linking group that is a residue of a saturated aliphatic dicarboxylic acid compound, a divalent linking group that is a residue of an aromatic dicarboxylic acid compound, or a divalent linking group other than this; and when A2 is present singly, A2 is a divalent linking group that is a residue of a saturated aliphatic dicarboxylic acid compound, and when a plurality of A2s is present, at least one of A2s is a divalent linking group that is a residue of a saturated aliphatic dicarboxylic acid compound.

    Bismaleimide Compound, Composition Containing Same, Polybenzoxazole, And Semiconductor Device

    公开(公告)号:US20220298281A1

    公开(公告)日:2022-09-22

    申请号:US17685604

    申请日:2022-03-03

    摘要: An object of the present invention is to provide a novel photosensitive resin precursor that can be developed with an alkali and ring-closed even at low temperatures, and preferably has excellent thermal properties and excellent electric properties after curing, and also to provide a use application thereof. As means for achieving the object, disclosed are a bismaleimide compound comprising, in one molecule, two partial structures in each of which a carbon atom having a substituent represented by the following formula (A) (wherein Y represents a direct bond or a divalent linking group), and a carbon atom having a hydroxy group are directly bonded to each other, a polymer which is a self-polymer of the bismaleimide compound, and a benzoxazole which is an intramolecular dehydrated ring-closed product of the polymer.