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公开(公告)号：USD665105S1
公开(公告)日：2012-08-07
申请号：US29387861
申请日：2011-03-18
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公开(公告)号：US20120099309A1
公开(公告)日：2012-04-26
申请号：US13280433
申请日：2011-10-25
CPC分类号： H01L33/641 , F21K9/00 , F21V29/505 , F21Y2103/10 , F21Y2105/10 , F21Y2115/10 , H01L33/483 , H01L2224/45144 , H01L2224/48091 , H01L2224/73265 , H05K1/0209 , H05K1/113 , H05K3/284 , H05K2201/10106 , H05K2201/2054 , H01L2924/00014 , H01L2924/00
摘要： According to one embodiment, a light emitting device includes a substrate, a lead pattern and a plurality of mounting pads, and a plurality of light emitting elements. The substrate includes an insulating layer. The lead pattern and the plurality of mounting pads are formed on a surface of the substrate. The lead pattern and the plurality of mounting pads are conductive. The plurality of mounting pads are configured not to electrically conduct. The lead pattern is configured to electrically conduct. The plurality of light emitting elements are mounted on the mounting pads and electrically connected to the lead pattern.
摘要翻译： 根据一个实施例，发光器件包括衬底，引线图案和多个安装焊盘以及多个发光元件。 基板包括绝缘层。 引线图案和多个安装焊盘形成在基板的表面上。 引线图案和多个安装焊盘是导电的。 多个安装焊盘被构造成不进行导电。 引线图案被配置为电导电。 多个发光元件安装在安装焊盘上并电连接到引线图案。
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公开(公告)号：US08770795B2
公开(公告)日：2014-07-08
申请号：US13236672
申请日：2011-09-20
申请人： Kozo Uemura , Soichi Shibusawa , Shuhei Matsuda , Nobuhiko Betsuda , Kiyoshi Nishimura , Masatoshi Kumagai
发明人： Kozo Uemura , Soichi Shibusawa , Shuhei Matsuda , Nobuhiko Betsuda , Kiyoshi Nishimura , Masatoshi Kumagai
IPC分类号： F21V21/00
CPC分类号： H01L25/0753 , F21K9/27 , F21S8/031 , F21V23/023 , F21Y2103/10 , F21Y2105/10 , F21Y2113/00 , F21Y2115/10 , H01L33/54 , H01L2924/0002 , H01L2924/00
摘要： A light-emitting device includes a substrate, and a plurality of light-emitting elements mounted on the substrate. The light-emitting elements are placed to meet conditions that the number B of light-emitting elements per unit area (cm2) of a mounting part is not less than 0.4 and a mean mounting density D is not less than 58 to not greater than 334, when a relationship of formula “D=A×B” is established, assuming D as a mean mounting density of light-emitting elements on a substrate, A as a current (mA) flowing through one light-emitting element, and B as the number of light-emitting elements per unit area (cm2) of a substantial mounting part for light-emitting elements.
摘要翻译： 发光装置包括基板和安装在基板上的多个发光元件。 放置发光元件以满足以下条件：安装部件的每单位面积（cm2）的发光元件的数量B不小于0.4，平均安装密度D不小于58至不大于334 当建立公式“D = A×B”的关系时，假设D作为基板上的发光元件的平均安装密度，A作为流过一个发光元件的电流（mA），B作为 用于发光元件的基本安装部件的每单位面积的发光元件的数量（cm2）。
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公开(公告)号：USD663443S1
公开(公告)日：2012-07-10
申请号：US29387857
申请日：2011-03-18
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公开(公告)号：USD663444S1
公开(公告)日：2012-07-10
申请号：US29387863
申请日：2011-03-18
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公开(公告)号：US20120075836A1
公开(公告)日：2012-03-29
申请号：US13236672
申请日：2011-09-20
申请人： Kozo UEMURA , Soichi Shibusawa , Shuhei Matsuda , Nobuhiko Betsuda , Kiyoshi Nishimura , Masatoshi Kumagai
发明人： Kozo UEMURA , Soichi Shibusawa , Shuhei Matsuda , Nobuhiko Betsuda , Kiyoshi Nishimura , Masatoshi Kumagai
CPC分类号： H01L25/0753 , F21K9/27 , F21S8/031 , F21V23/023 , F21Y2103/10 , F21Y2105/10 , F21Y2113/00 , F21Y2115/10 , H01L33/54 , H01L2924/0002 , H01L2924/00
摘要： A light-emitting device includes a substrate, and a plurality of light-emitting elements mounted on the substrate. The light-emitting elements are placed to meet conditions that the number B of light-emitting elements per unit area (cm2) of a mounting part is not less than 0.4 and a mean mounting density D is not less than 58 to not greater than 334, when a relationship of formula “D=A×B” is established, assuming D as a mean mounting density of light-emitting elements on a substrate, A as a current (mA) flowing through one light-emitting element, and B as the number of light-emitting elements per unit area (cm2) of a substantial mounting part for light-emitting elements.
摘要翻译： 发光装置包括基板和安装在基板上的多个发光元件。 放置发光元件以满足以下条件：安装部件的每单位面积（cm2）的发光元件的数量B不小于0.4，平均安装密度D不小于58至不大于334 当建立公式“D = A×B”的关系时，假设D作为基板上的发光元件的平均安装密度，A作为流过一个发光元件的电流（mA），B作为 用于发光元件的基本安装部件的每单位面积的发光元件的数量（cm2）。
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公开(公告)号：US20130271971A1
公开(公告)日：2013-10-17
申请号：US13819296
申请日：2011-09-27
申请人： Kozo Uemura , Kiyoshi Nishimura , Soichi Shibusawa , Nobuhiko Betsuda , Shuhei Matsuda , Masatoshi Kumagai
发明人： Kozo Uemura , Kiyoshi Nishimura , Soichi Shibusawa , Nobuhiko Betsuda , Shuhei Matsuda , Masatoshi Kumagai
IPC分类号： F21S2/00
CPC分类号： F21S2/00 , F21K9/27 , F21K9/61 , F21S8/031 , F21V3/02 , F21V7/005 , F21V11/02 , F21V19/004 , F21Y2103/10 , F21Y2107/90 , F21Y2115/10
摘要： A light-emitting circuit is formed as a straight tube in a stable shape and capable of appropriately housing and holding an LED module and the like. The light-emitting circuit includes: a plurality of light-emitting elements configured to emit light; a substrate, functioning as an arrangement member, including an arrangement surface on which the plurality of light-emitting elements are arranged; and a substantially cylindrical lamp body including a translucent section at least in a part thereof, including the arrangement member disposed on the inside, and including a louver functioning as a projecting body projecting from an inner wall opposed to the arrangement surface and extending toward the arrangement surface.
摘要翻译： 发光电路形成为稳定形状的直管，能够适当地容纳和保持LED模块等。 发光电路包括：多个被配置为发光的发光元件; 用作布置构件的基板，包括布置有多个发光元件的布置表面; 以及至少在其一部分上具有半透明部分的大致圆柱形的灯体，包括设置在内部的布置构件，并且包括用作突出体的百叶窗，所述突出体从与所述布置表面相对的内壁突出并延伸到所述布置 表面。
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公开(公告)号：USD663866S1
公开(公告)日：2012-07-17
申请号：US29387895
申请日：2011-03-21
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公开(公告)号：USD663865S1
公开(公告)日：2012-07-17
申请号：US29387866
申请日：2011-03-18
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公开(公告)号：US20110309381A1
公开(公告)日：2011-12-22
申请号：US13162150
申请日：2011-06-16
IPC分类号： H01L27/15
CPC分类号： H05K1/0209 , F21S2/005 , F21S8/04 , F21Y2105/10 , F21Y2115/10 , H01L25/0753 , H01L33/50 , H01L2224/48091 , H01L2224/48137 , H01L2224/73265 , H05K1/181 , H05K2201/10106 , H01L2924/00014 , H01L2924/00
摘要： According to one embodiment, a light-emitting device includes a series circuit, a substrate, and a sealing member. The series circuit includes a plurality of parallel circuits each including a plurality of light-emitting elements connected in parallel. The plurality of parallel circuits are connected in series. A plurality of groups are provided on the substrate. Each of the groups includes at least one of the light-emitting elements in the parallel circuit. The light-emitting elements are arranged in a divided manner according to each of the groups. The sealing member covers at least one of the light-emitting elements.
摘要翻译： 根据一个实施例，发光装置包括串联电路，基板和密封构件。 串联电路包括多个并联电路，每个并联电路包括并联连接的多个发光元件。 多个并联电路串联连接。 在基板上设置多个组。 每个组包括并联电路中的至少一个发光元件。 发光元件根据每个组分开排列。 密封构件覆盖至少一个发光元件。
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