摘要:
Embodiments of the present invention relate to approaches to effectively let noise on a head slider bonded to a silicon substrate of a microactuator, escape to the ground. A head gimbal assembly (HGA) according to an embodiment of the present invention comprises a microactuator bonded to a gimbal tongue. The microactuator comprises a piezoelectric element and a movable part for moving in response to expansion or contraction of the piezoelectric element. The motion of the movable part causes a head slider to slightly move. The microactuator further comprises a conductive path including an impurity-containing silicon layer formed on the silicon substrate. The conductive path transmits electric charge of the head slider to a suspension. The conductivity of the impurity-containing silicon layer is lower than the one of the silicon substrate so that the noise charge of the head slider may escape to the suspension.
摘要:
Embodiments of the present invention relate to approaches to effectively let noise on a head slider bonded to a silicon substrate of a microactuator, escape to the ground. A head gimbal assembly (HGA) according to an embodiment of the present invention comprises a microactuator bonded to a gimbal tongue. The microactuator comprises a piezoelectric element and a movable part for moving in response to expansion or contraction of the piezoelectric element. The motion of the movable part causes a head slider to slightly move. The microactuator further comprises a conductive path including an impurity-containing silicon layer formed on the silicon substrate. The conductive path transmits electric charge of the head slider to a suspension. The conductivity of the impurity-containing silicon layer is lower than the one of the silicon substrate so that the noise charge of the head slider may escape to the suspension.
摘要:
A micro-electromechanical signal transmission line is made from an electrically conductive material. It has a first distal end and a second distal end. The second distal end is free to move with respect to said first distal end. There exists an unsupported region between the first distal end and the second distal end. The unsupported region is juxtaposed at a controlled distance from at least one grounded conductive surface.
摘要:
A micro-electromechanical signal transmission line is made from an electrically conductive material. It has a first distal end and a second distal end. The second distal end is free to move with respect to said first distal end. There exists an unsupported region between the first distal end and the second distal end. The unsupported region is juxtaposed at a controlled distance from at least one grounded conductive surface.
摘要:
An interleaved conductor structure for electrically connecting the read/write electronics to a read/write head in a hard disk drive is provided. The interleaved conductor structure may allow for an increased characteristic-impedance range, greater interference shielding and a reduction of signal loss that is contributed by a lossy conductive substrate. The electrical traces may have different widths, be offset, or even wrap around each other at the via connections.
摘要:
A head-stack assembly. The head-stack assembly includes: a magnetic-recording head; a lead-suspension supporting the magnetic-recording head on an actuator arm; a metal plate coupled with the actuator arm; a resin layer disposed on the metal plate; a flexible-printed-circuit board disposed on the resin layer, and substantially perpendicularly connected to the lead-suspension; a arm-electronics module disposed on the flexible-printed-circuit board configured to shape a write-signal current waveform of a write signal to said magnetic-recording head; transmission lines disposed on the flexible-printed-circuit board configured to transmit the write signal to, and a read-back signal from, the lead-suspension; and, a single intermediate conductor layer that is disposed between the resin layer and the flexible-printed-circuit board, and having a planar shape substantially facing a bottom of the arm-electronics module and a bottom of the transmission lines.
摘要:
An interconnect between the write driver and the write head in a magnetic recording disk drive enables an inherent write current overshoot. The interconnect includes an integrated lead suspension (ILS) and a short flex cable that connects the write driver circuitry to the ILS. The interconnect is a two-segment transmission line, with the first segment connected to the write driver having multiple sub-segments or sections with non-uniform impedance levels. The section of the first segment that connects to the write driver is the short flex cable and has an impedance substantially higher than the source impedance ZWD of the write driver. The multiple sections of the first segment have non-uniform impedance values that have an effective impedance Z01-eff that substantially matches ZWD. The second segment of the transmission line has an effective impedance Z02-eff that is substantially less than Z01-eff. The write lines for the +W and −W signals are preferably interleaved on the transmission line sections.
摘要:
Embodiments disclose hole sequences that are formed in the metal layer of a trace to adjust rigidity and crosstalk noise resulting from the hole sequences is thereby suppressed. A suspension according to one aspect of the invention includes a trace adapted to transmit a signal of a head slider. The trace partially extends along the side surface of the suspension. The trace includes a metal layer, a plurality of transmission lines formed above the metal layer and an insulating layer. A hole sequence overlapping the transmission lines is formed in part of the metal layer, which contributes to a reduction in transmission loss. Another hole sequence of the metal layer is formed at a position opposed to the hinge portion of the suspension. This reduces the rigidity of the wiring structure portion in the hinge portion, thereby preventing interference with the behavior of the suspension at the hinge portion.
摘要:
Embodiments in accordance with the present invention reduce the structural stress applied to a head, and to achieve the effective control, when the clearance between the head and a disk is adjusted by using a heater. According to one embodiment, the hard disk controller/microprocessing unit (HDC/MPU) controls a slew rate of a heater at the time of TFC (Thermal Fly height Control). In response to processing conditions, a HDC/MPU changes a slew rate of the output of electric current/voltage applied to the heater. This makes it possible to reduce the head stress, and to achieve the effective TFC. To be more specific, with reference to a temperature/slew rate table, the HDC/MPU changes a slew rate in response to the temperature in the read/write processing.
摘要:
Embodiments in accordance with the present invention disclose hole sequences that are formed in the metal layer of a trace to adjust rigidity and crosstalk noise resulting from the hole sequences is thereby suppressed. A suspension according to one aspect of the invention includes a trace adapted to transmit a signal of a head slider. The trace partially extends along the side surface of the suspension. The trace includes a metal layer, a plurality of transmission lines formed above the metal layer and an insulating layer. A hole sequence overlapping the transmission lines is formed in part of the metal layer, which contributes to a reduction in transmission loss. Another hole sequence of the metal layer is formed at a position opposed to the hinge portion of the suspension. This reduces the rigidity of the wiring structure portion in the hinge portion, thereby preventing interference with the behavior of the suspension at the hinge portion.