公开(公告)号：US08102628B2

公开(公告)日：2012-01-24

申请号：US11726614

申请日：2007-03-21

申请人： Ryohei Ota ,  Eiji Soga ,  Nobumasa Nishiyama ,  Hiroyasu Tsuchida

发明人： Ryohei Ota ,  Eiji Soga ,  Nobumasa Nishiyama ,  Hiroyasu Tsuchida

IPC分类号： G11B21/16 ,  G11B5/48

CPC分类号： G11B5/486

摘要： Embodiments disclose hole sequences that are formed in the metal layer of a trace to adjust rigidity and crosstalk noise resulting from the hole sequences is thereby suppressed. A suspension according to one aspect of the invention includes a trace adapted to transmit a signal of a head slider. The trace partially extends along the side surface of the suspension. The trace includes a metal layer, a plurality of transmission lines formed above the metal layer and an insulating layer. A hole sequence overlapping the transmission lines is formed in part of the metal layer, which contributes to a reduction in transmission loss. Another hole sequence of the metal layer is formed at a position opposed to the hinge portion of the suspension. This reduces the rigidity of the wiring structure portion in the hinge portion, thereby preventing interference with the behavior of the suspension at the hinge portion.

摘要翻译： 实施例公开了在痕迹的金属层中形成的调整刚性的孔序列，从而抑制由空穴序列产生的串扰噪声。 根据本发明的一个方面的悬架包括适于传输磁头滑块的信号的轨迹。 轨迹部分沿着悬架的侧表面延伸。 迹线包括金属层，形成在金属层上方的多条传输线和绝缘层。 与传输线重叠的孔序列形成在金属层的一部分中，这有助于传输损耗的降低。 金属层的另一个孔序列形成在与悬架的铰链部分相对的位置处。 这就降低了铰链部分中的布线结构部分的刚度，从而防止了在铰链部分处的悬架的行为的干扰。

公开(公告)号：US20070230059A1

公开(公告)日：2007-10-04

申请号：US11726614

申请日：2007-03-21

申请人： Ryohei Ota ,  Eiji Soga ,  Nobumasa Nishiyama ,  Hiroyasu Tsuchida

发明人： Ryohei Ota ,  Eiji Soga ,  Nobumasa Nishiyama ,  Hiroyasu Tsuchida

IPC分类号： G11B5/48

CPC分类号： G11B5/486

摘要： Embodiments in accordance with the present invention disclose hole sequences that are formed in the metal layer of a trace to adjust rigidity and crosstalk noise resulting from the hole sequences is thereby suppressed. A suspension according to one aspect of the invention includes a trace adapted to transmit a signal of a head slider. The trace partially extends along the side surface of the suspension. The trace includes a metal layer, a plurality of transmission lines formed above the metal layer and an insulating layer. A hole sequence overlapping the transmission lines is formed in part of the metal layer, which contributes to a reduction in transmission loss. Another hole sequence of the metal layer is formed at a position opposed to the hinge portion of the suspension. This reduces the rigidity of the wiring structure portion in the hinge portion, thereby preventing interference with the behavior of the suspension at the hinge portion.

摘要翻译： 根据本发明的实施例公开了在轨迹的金属层中形成的调整刚度的孔序列，从而抑制由空穴序列产生的串扰噪声。 根据本发明的一个方面的悬架包括适于传输磁头滑块的信号的轨迹。 轨迹部分沿着悬架的侧表面延伸。 迹线包括金属层，形成在金属层上方的多条传输线和绝缘层。 与传输线重叠的孔序列形成在金属层的一部分中，这有助于传输损耗的降低。 金属层的另一个孔序列形成在与悬架的铰链部分相对的位置处。 这就降低了铰链部分中的布线结构部分的刚度，从而防止了在铰链部分处的悬架的行为的干扰。

公开(公告)号：US20120140360A1

公开(公告)日：2012-06-07

申请号：US12961962

申请日：2010-12-07

申请人： John Contreras ,  Nobumasa Nishiyama ,  Bijan Rafizadeh ,  Eiji Soga ,  Hiroyasu Tsuchida ,  Yiduo Zhang

发明人： John Contreras ,  Nobumasa Nishiyama ,  Bijan Rafizadeh ,  Eiji Soga ,  Hiroyasu Tsuchida ,  Yiduo Zhang

IPC分类号： G11B5/48

CPC分类号： G11B5/486

摘要： Approaches for integrated lead suspension that provides many benefits, such as enabling a dual stage actuator (DSA) to be used with a single layer flex with a reduced amount of crosstalk. An integrated lead suspension comprises a tail end having a plurality of conductive pads positioned thereat. The plurality of conductive pads includes a first and second dual stage actuator (DSA) pad. The first and second DSA pads are electrically coupled to a conductive member by way of conductive vias. The conductive member may be a stainless steel island. The first DSA pad conducts a signal to a first terminal at each of a plurality of dual stage actuators, while a second terminal at each of the plurality of dual stage actuators is connected to ground.

摘要翻译： 集成式引线悬架的方法提供了许多优点，例如使双级致动器（DSA）与单层弯曲件一起使用，具有减少的串扰量。 集成引线悬架包括具有定位在其上的多个导电焊盘的尾端。 多个导电焊盘包括第一和第二双级致动器（DSA）焊盘。 第一和第二DSA焊盘通过导电通孔电耦合到导电部件。 导电构件可以是不锈钢岛。 第一DSA垫在多个双级致动器中的每一个致动器处向第一端子传导信号，而多个双级致动器中的每一个的第二端子接地。

公开(公告)号：US08213128B2

公开(公告)日：2012-07-03

申请号：US12870626

申请日：2010-08-27

申请人： Eiji Soga ,  Hiroyasu Tsuchida

发明人： Eiji Soga ,  Hiroyasu Tsuchida

IPC分类号： G11B5/56

CPC分类号： G11B5/4833 ,  G11B5/4873

摘要： A head-gimbal assembly (HGA). The HGA includes a deformable plate affixed to a load beam, a piezoelectric element affixed to the deformable plate, and a base plate affixed to the deformable plate. The deformable plate includes: a hole; a first section in front of the hole and affixed to the load beam; a second section behind the hole and affixed to the base plate; and, first and second spring members that join the first section and the second section, can deform in a front-back direction, and are positioned to sandwich the hole in a left-right direction. The piezoelectric element is affixed between the first section and the second section. The base plate includes projection members on a front edge of the plate and projecting out toward the first section. The front edges of the projection member are positioned further to a front edge than a back edge of the hole.

摘要翻译： 头万向架（HGA）。 HGA包括固定到负载梁的可变形板，固定到可变形板的压电元件和固定到可变形板上的基板。 可变形板包括：孔; 在孔的前面的第一部分并且固定到负载梁上; 孔后面的第二部分，固定在基板上; 并且连接第一部分和第二部分的第一和第二弹性部件可以在前后方向上变形，并且被定位成沿着左右方向夹住孔。 压电元件固定在第一部分和第二部分之间。 基板包括在板的前边缘上的突出部件，并向第一部分突出。 突起构件的前边缘比孔的后边缘进一步定位在前边缘。

公开(公告)号：US20110051289A1

公开(公告)日：2011-03-03

申请号：US12870626

申请日：2010-08-27

申请人： Eiji Soga ,  Hiroyasu Tsuchida

发明人： Eiji Soga ,  Hiroyasu Tsuchida

IPC分类号： G11B5/48

CPC分类号： G11B5/4833 ,  G11B5/4873

摘要： A head-gimbal assembly (HGA). The HGA includes a deformable plate affixed to a load beam, a piezoelectric element affixed to the deformable plate, and a base plate affixed to the deformable plate. The deformable plate includes: a hole; a first section in front of the hole and affixed to the load beam; a second section behind the hole and affixed to the base plate; and, first and second spring members that join the first section and the second section, can deform in a front-back direction, and are positioned to sandwich the hole in a left-right direction. The piezoelectric element is affixed between the first section and the second section. The base plate includes projection members on a front edge of the plate and projecting out toward the first section. The front edges of the projection member are positioned further to a front edge than a back edge of the hole.

摘要翻译： 头万向架（HGA）。 HGA包括固定到负载梁的可变形板，固定到可变形板的压电元件和固定到可变形板上的基板。 可变形板包括：孔; 在孔的前面的第一部分并且固定到负载梁上; 孔后面的第二部分，固定在基板上; 并且连接第一部分和第二部分的第一和第二弹性部件可以在前后方向上变形，并且被定位成沿着左右方向夹住孔。 压电元件固定在第一部分和第二部分之间。 基板包括在板的前边缘上的突出部件，并向第一部分突出。 突起构件的前边缘比孔的后边缘进一步定位在前边缘。

公开(公告)号：US20110013319A1

公开(公告)日：2011-01-20

申请号：US12839342

申请日：2010-07-19

申请人： Eiji Soga ,  Hiroyasu Tsuchida ,  Akio Takatsuka ,  Masaru Muranishi ,  Hidehiko Numasato

发明人： Eiji Soga ,  Hiroyasu Tsuchida ,  Akio Takatsuka ,  Masaru Muranishi ,  Hidehiko Numasato

IPC分类号： G11B5/48

CPC分类号： G11B5/4833 ,  G11B5/4873 ,  G11B5/5552 ,  G11B5/596

摘要： A disk drive configured with micro-actuator interconnect conditioning. The disk drive includes a disk, a head, an actuator, a piezoelectric element, a hardened conductive adhesive, a voltage-supply circuit, and a controller. The head is configured to access the disk. The actuator includes a suspension supporting the head, and an arm supporting the suspension. The piezoelectric element is disposed on the suspension, is electrically connected to a first drive line and a second drive line, and is configured to change the position of the head. The hardened conductive adhesive is electrically connected to at least one connecting part of the piezoelectric element and the first drive line. The voltage-supply circuit is configured to supply a voltage to the piezoelectric element. The controller is configured to control a voltage-control circuit each time a designated process is executed, and to apply a voltage to the piezoelectric element with a prescribed maximum absolute value.

摘要翻译： 配置有微执行器互连条件的磁盘驱动器。 磁盘驱动器包括盘，头，致动器，压电元件，硬化导电粘合剂，电压供应电路和控制器。 头被配置为访问磁盘。 致动器包括支撑头部的悬架和支撑悬架的臂。 压电元件设置在悬架上，电连接到第一驱动线和第二驱动线，并且被配置为改变头的位置。 硬化的导电粘合剂电连接到压电元件和第一驱动线的至少一个连接部分。 电压供给电路构成为向压电元件供给电压。 控制器被配置为每当执行指定处理时控制电压控制电路，并且以规定的最大绝对值向压电元件施加电压。

公开(公告)号：US07953300B2

公开(公告)日：2011-05-31

申请号：US11869448

申请日：2007-10-09

申请人： Hiroyasu Tsuchida ,  Manabu Ukai

发明人： Hiroyasu Tsuchida ,  Manabu Ukai

IPC分类号： G06K9/54 ,  G06K9/60 ,  H04N5/77

CPC分类号： G11B20/10527 ,  G11B20/00007 ,  G11B2020/00072 ,  G11B2020/10537 ,  G11B2020/10759 ,  G11B2220/61 ,  H04N19/177 ,  H04N19/423 ,  H04N19/61

摘要： An imaging apparatus that records, on a recording medium, a moving image captured using a solid-state imaging device as stream data, is disclosed. The apparatus includes: an image encoding section that encodes data of the captured moving image with a unit of an image group being a sequence of images of a fixed number of frames; an input detection section that detects a recording stop request to stop recording of the stream data including the moving image data being an encoding result of the image encoding section onto the recording medium; and a recording control section that controls a recording operation of the stream data onto the recording medium such that, when the recording stop request is detected by the input detection section, the image group located immediately before the image group including an image captured at the time of detection is the last image group.

摘要翻译： 公开了一种在记录介质上记录使用固态成像装置捕获的运动图像作为流数据的成像装置。 该装置包括：图像编码部，其以所述图像组为单位对所拍摄的运动图像的数据进行编码，所述图像组是固定数量帧的图像序列; 输入检测部分，其检测记录停止请求，以将包括作为图像编码部分的编码结果的运动图像数据的流数据的记录停止到记录介质上; 以及记录控制部分，其将流数据的记录操作控制到记录介质上，使得当由输入检测部分检测到记录停止请求时，紧邻在包括当前捕获的图像的图像组之前的图像组 的检测是最后一个图像组。

公开(公告)号：US07583475B2

公开(公告)日：2009-09-01

申请号：US11066949

申请日：2005-02-25

申请人： Yuhsuke Matsumoto ,  Tatsumi Tsuchiya ,  Takaaki Murokawa ,  Yoshio Uematsu ,  Tatsushi Yoshida ,  Nobuyuki Hashi ,  Hiroyasu Tsuchida ,  Takuma Muraki

发明人： Yuhsuke Matsumoto ,  Tatsumi Tsuchiya ,  Takaaki Murokawa ,  Yoshio Uematsu ,  Tatsushi Yoshida ,  Nobuyuki Hashi ,  Hiroyasu Tsuchida ,  Takuma Muraki

IPC分类号： G11B5/48

CPC分类号： H05K3/3442 ,  G11B5/4853 ,  H05K1/111 ,  H05K2201/0397 ,  H05K2201/09663 ,  H05K2201/0969 ,  H05K2201/09745 ,  H05K2201/10727 ,  H05K2203/041 ,  Y02P70/611 ,  Y02P70/613

摘要： Embodiments of the invention provide techniques to prevent, when a bonding pad and a lead wiring pad are to be connected using a solder ball, the solder ball from deviating from a centerline and a soldering problem from occurring. In one embodiment, a head suspension assembly includes a solder ball disposed between a lead wiring pad provided for a flexure and a bonding pad provided for a slider. The solder ball is then melted for making a soldered joint between the lead wiring pad and the bonding pad. A through slot is provided at a position near a centerline on a front surface of the lead wiring pad. The solder ball is dropped into the through slot by gravity from the front surface of the lead wiring pad. A contact area in contact with the solder ball is thereby secured on a side of the slider.

摘要翻译： 本发明的实施例提供了当使用焊球连接接合焊盘和引线接线焊盘时防止焊料球偏离中心线并发生焊接问题的技术。 在一个实施例中，头悬挂组件包括设置在为弯曲提供的引线布线垫和为滑块设置的接合焊盘之间的焊球。 然后将焊球熔化以在引线接线焊盘和焊盘之间形成焊接接头。 在引线配线衬垫的前表面上的中心线附近的位置处设有通槽。 焊球通过重力从引线接线板的前表面落入通槽。 因此，与滑块接触的接触区域被固定在滑块的一侧。

公开(公告)号：US07137189B2

公开(公告)日：2006-11-21

申请号：US10964224

申请日：2004-10-13

申请人： Tatsumi Tsuchiya ,  Yuhsuke Matsumoto ,  Takaaki Murokawa ,  Naoki Fujii ,  Takuya Satoh ,  Yasuhiro Mita ,  Hiroyasu Tsuchida ,  Yoshio Uematsu

发明人： Tatsumi Tsuchiya ,  Yuhsuke Matsumoto ,  Takaaki Murokawa ,  Naoki Fujii ,  Takuya Satoh ,  Yasuhiro Mita ,  Hiroyasu Tsuchida ,  Yoshio Uematsu

IPC分类号： G11B5/127 ,  H04R31/00

CPC分类号： G11B5/4853 ,  G11B5/484 ,  G11B5/486 ,  H01L2224/742 ,  H05K1/189 ,  H05K3/3442 ,  H05K3/3494 ,  H05K2201/0397 ,  H05K2201/09663 ,  H05K2201/09745 ,  H05K2203/041 ,  H05K2203/107 ,  H05K2203/159 ,  Y02P70/613 ,  Y10T29/49025 ,  Y10T29/4903 ,  Y10T29/49032 ,  Y10T29/49046 ,  Y10T29/49144 ,  Y10T29/49179

摘要： An integrated lead suspension includes a solder ball that is placed between a lead wiring pad provided on a flexure of the suspension, and a bonding pad provided on a slider of a head gimbal section. The lead wiring pad and bonding pad are soldered by melting the solder ball. As a result, there is provided a recessed section into which a solder ball is placed by way of surface raised sections, using gravitational force, in the vicinity of the center line of the surface of the lead wiring pad. In this way the position of the solder ball is not displaced from the center line when a bonding pad and lead wiring pad are connected by means of a solder ball.

公开(公告)号：US20050180052A1

公开(公告)日：2005-08-18

申请号：US11046348

申请日：2005-01-27

申请人： Kohichi Suzuki ,  Hiroyasu Tsuchida

发明人： Kohichi Suzuki ,  Hiroyasu Tsuchida

IPC分类号： G11B21/21 ,  G11B5/48

CPC分类号： G11B5/4826

摘要： In a suspension used in an actuator of a hard disk drive, a limiter mechanism is to be provided which produces little dust and which can restrict deformation of a gimbals even against a strong shock. According to one embodiment, when a weak shock is applied to the suspension, a limiter tab and a back side of a load beam come into contact with each other to prevent a gimbals from being largely deformed by the shock. Since deformation of the gimbals is restricted by surface contact of both load beam and limiter tab, the generation of dust is suppressed effectively. When a strong shock is applied to the suspension, the limiter tab is deformed and a projecting portion of a restrictive aperture and an end portion of a limiter tab aperture come into contact with each other. The projecting portion retains the limiter tab to restrict a further deformation of the gimbals.

摘要翻译： 在用于硬盘驱动器的致动器的悬架中，将提供限制器机构，其产生很少的灰尘，并且即使抵抗强烈的冲击也可以限制万向架的变形。 根据一个实施例，当对悬架施加弱冲击时，限位器翼片和负载梁的后侧彼此接触以防止万向节被冲击大幅度变形。 由于万向节的变形受到载荷梁和限位片的表面接触的限制，因此有效地抑制了灰尘的产生。 当对悬架施加强烈的冲击时，限制器翼片变形，并且限制孔的突出部分和限制器翼片孔的端部彼此接触。 突出部分保持限制器翼片以限制万向节的进一步变形。