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    SOLID-STATE IMAGE PICKUP DEVICE AND IMAGE PICKUP SYSTEM
    1.
    发明申请
    SOLID-STATE IMAGE PICKUP DEVICE AND IMAGE PICKUP SYSTEM 有权
    固态图像拾取器件和图像拾取系统

    公开(公告)号：US20120267690A1

    公开(公告)日：2012-10-25

    申请号：US13517357

    申请日：2010-12-22

    申请人： Nobuyuki Endo ,  Tetsuya Itano ,  Kazuo Yamazaki ,  Kyouhei Watanabe ,  Takeshi Ichikawa

    发明人： Nobuyuki Endo ,  Tetsuya Itano ,  Kazuo Yamazaki ,  Kyouhei Watanabe ,  Takeshi Ichikawa

    IPC分类号： H01L27/148

    CPC分类号： H01L27/14636 ,  H01L27/14632 ,  H01L27/14643 ,  H01L27/1465

    摘要： The present invention relates to a solid-state image pickup device. The device includes a first substrate including a photoelectric conversion element and a transfer gate electrode configured to transfer charge from the photoelectric conversion element, a second substrate having a peripheral circuit portion including a circuit configured to read a signal based charge generated in the photoelectric conversion element, the first and second substrates being laminated. The device further includes a multilayer interconnect structure, disposed on the first substrate, including an aluminum interconnect and a multilayer interconnect structure, disposed on the second substrate, including a copper interconnect.

    摘要翻译： 本发明涉及一种固态图像拾取装置。 该装置包括：第一基板，包括光电转换元件和被配置为从光电转换元件传送电荷的转移栅电极;第二基板，具有外围电路部分，其包括被配置为读取在光电转换元件中产生的基于信号的电荷 第一和第二基板被层压。 该器件还包括多层互连结构，其设置在第一衬底上，包括铝互连和多层互连结构，设置在第二衬底上，包括铜互连。

    Solid-state image pickup device and image pickup system
    2.
    发明授权
    Solid-state image pickup device and image pickup system 有权
    固态图像拾取装置和图像拾取系统

    公开(公告)号：US08912578B2

    公开(公告)日：2014-12-16

    申请号：US13517357

    申请日：2010-12-22

    申请人： Nobuyuki Endo ,  Tetsuya Itano ,  Kazuo Yamazaki ,  Kyouhei Watanabe ,  Takeshi Ichikawa

    发明人： Nobuyuki Endo ,  Tetsuya Itano ,  Kazuo Yamazaki ,  Kyouhei Watanabe ,  Takeshi Ichikawa

    IPC分类号： H01L27/148 ,  H01L27/146

    CPC分类号： H01L27/14636 ,  H01L27/14632 ,  H01L27/14643 ,  H01L27/1465

    摘要： The present invention relates to a solid-state image pickup device. The device includes a first substrate including a photoelectric conversion element and a transfer gate electrode configured to transfer charge from the photoelectric conversion element, a second substrate having a peripheral circuit portion including a circuit configured to read a signal based charge generated in the photoelectric conversion element, the first and second substrates being laminated. The device further includes a multilayer interconnect structure, disposed on the first substrate, including an aluminum interconnect and a multilayer interconnect structure, disposed on the second substrate, including a copper interconnect.

    摘要翻译： 本发明涉及一种固态图像拾取装置。 该装置包括：第一基板，包括光电转换元件和被配置为从光电转换元件传送电荷的转移栅电极;第二基板，具有外围电路部分，其包括被配置为读取在光电转换元件中产生的基于信号的电荷 第一和第二基板被层压。 该器件还包括多层互连结构，其设置在第一衬底上，包括铝互连和多层互连结构，设置在第二衬底上，包括铜互连。

    SOLID-STATE IMAGE PICKUP DEVICE
    6.
    发明申请
    SOLID-STATE IMAGE PICKUP DEVICE 有权
    固态图像拾取器件

    公开(公告)号：US20120286140A1

    公开(公告)日：2012-11-15

    申请号：US13512281

    申请日：2010-11-29

    申请人： Tetsuya Itano ,  Kazuo Yamazaki ,  Nobuyuki Endo ,  Kyouhei Watanabe

    发明人： Tetsuya Itano ,  Kazuo Yamazaki ,  Nobuyuki Endo ,  Kyouhei Watanabe

    IPC分类号： H01L27/148

    CPC分类号： H04N5/361 ,  H01L27/14609 ,  H01L27/14612 ,  H01L27/14634 ,  H01L27/1464 ,  H04N5/3698 ,  H04N5/3742

    摘要： Dark current from a transfer transistor is suppressed and power-supply voltage in a second semiconductor substrate is lowered. A solid-state image pickup device includes a pixel array, a plurality of common output lines receiving signals read out from a plurality of pixels, a transfer scanning unit sequentially driving the plurality of transfer transistors, a signal processing unit processing the signals output to the common signal lines, and a level shift unit making amplitude of a pulse supplied to a gate of the transfer transistor larger than amplitude of a pulse supplied to a gate of a transistor constituting the signal processing unit. The pixel array and the level shift unit are arranged on a first semiconductor substrate, whereas the plurality of common output lines and the signal processing unit are arranged on a second semiconductor substrate.

    摘要翻译： 来自转移晶体管的暗电流被抑制，并且第二半导体衬底中的电源电压降低。 一种固态摄像装置，包括：像素阵列，多个公共输出线，接收从多个像素读出的信号;顺序地驱动多个传输晶体管的传送扫描单元;信号处理单元，处理输出到 公共信号线和电平移位单元，使提供给转移晶体管的栅极的脉冲的幅度大于提供给构成信号处理单元的晶体管的栅极的脉冲的幅度。 像素阵列和电平移位单元布置在第一半导体衬底上，而多个公共输出线和信号处理单元布置在第二半导体衬底上。

    SOLID-STATE IMAGE PICKUP DEVICE
    7.
    发明申请
    SOLID-STATE IMAGE PICKUP DEVICE 有权
    固态图像拾取器件

    公开(公告)号：US20120248293A1

    公开(公告)日：2012-10-04

    申请号：US13515445

    申请日：2010-12-13

    申请人： Kazuo Yamazaki ,  Tetsuya Itano ,  Nobuyuki Endo ,  Kyouhei Watanabe

    发明人： Kazuo Yamazaki ,  Tetsuya Itano ,  Nobuyuki Endo ,  Kyouhei Watanabe

    IPC分类号： H01L27/148

    CPC分类号： H01L27/14609 ,  H01L27/1465

    摘要： A solid-state image pickup device includes a pixel region including photoelectric conversion units, FDs, and transfer transistors, reset transistors, amplifier transistors, and a reference voltage supply line used to supply reference voltages to the photoelectric conversion units. In the device, the pixel region and the reference voltage supply line are disposed on a first semiconductor substrate, and at least the reset transistors or the amplifier transistors are disposed on a second semiconductor substrate. Furthermore, power supply lines used to supply voltages to the reference voltage supply line are disposed on the second semiconductor substrate. The device further includes second electric connection units which electrically connect the reference voltage supply line to the power supply line. The first electric connection units are disposed in the pixel region whereas the second electric connection units are disposed outside the pixel region.

    摘要翻译： 固态图像拾取装置包括包括光电转换单元，FD和传输晶体管的像素区域，复位晶体管，放大器晶体管和用于向光电转换单元提供参考电压的参考电压供应线。 在该器件中，像素区域和参考电压供给线设置在第一半导体衬底上，并且至少复位晶体管或放大器晶体管设置在第二半导体衬底上。 此外，用于向参考电压供应线供电的电源线设置在第二半导体衬底上。 该装置还包括将参考电压供应线电连接到电源线的第二电连接单元。 第一电连接单元设置在像素区域中，而第二电连接单元设置在像素区域的外部。